Abstract: The description relates to display devices. One example can include a display having an active area surrounded by an inactive deadband. The example can also include a chassis, the display received in the chassis and secured to the chassis beneath the inactive deadband with adhesive. The example can further include a fastening assembly positioned below the inactive deadband and farther beneath the plane than the adhesive, where the fastening assembly creates a retention force between the display and the chassis.

Abstract: An electronic device mount includes a rigid cover, a flexible cover, and a frame positioned between the rigid cover and the flexible cover. The frame has a plurality of openings. The electronic device mount further includes a plurality of rocker arms coupled within correspond openings of the frame, and to the flexible cover. The plurality of rocker arms are configured to pivot within the plurality of openings to deflect the flexible cover relative to the frame to define a curved outer surface of the flexible cover. The electronic device mount also includes a plurality of magnets coupled to one of the frame or the flexible cover. The deflection of the flexible cover is self-adjusting to allow for easy mounting of an electronic device to a curved metal surface.

Abstract: A contactless readable programmable transponder to monitor chip join and method of use are disclosed. The method includes reading a frequency of an oscillator associated with a chip module. The method further includes correlating the frequency with a bond quality of the chip module.

Abstract: This document relates to providing a thermal management system for a device. One example determines temperature readings associated with one or more components of the device, and comparing the temperature readings to optimal operating temperatures. This example can selectively couple or decouple heat-dissipating elements based at least on the temperature readings associated with the one or more components of the device in order to reach the optimal operating temperatures.

Abstract: The description relates to display devices. One example can include a display having an active area surrounded by an inactive deadband. The example can also include a chassis, the display received in the chassis and secured to the chassis beneath the inactive deadband with adhesive. The example can further include a fastening assembly positioned below the inactive deadband and farther beneath the plane than the adhesive, where the fastening assembly creates a retention force between the display and the chassis.

Abstract: An electronic device mount includes a rigid cover, a flexible cover, and a frame positioned between the rigid cover and the flexible cover. The frame has a plurality of openings. The electronic device mount further includes a plurality of rocker arms coupled within correspond openings of the frame, and to the flexible cover. The plurality of rocker arms are configured to pivot within the plurality of openings to deflect the flexible cover relative to the frame to define a curved outer surface of the flexible cover. The electronic device mount also includes a plurality of magnets coupled to one of the frame or the flexible cover. The deflection of the flexible cover is self-adjusting to allow for easy mounting of an electronic device to a curved metal surface.

Abstract: This document relates to providing a thermal management system for a device. One example determines temperature readings associated with one or more components of the device, and comparing the temperature readings to optimal operating temperatures. This example can selectively couple or decouple heat-dissipating elements based at least on the temperature readings associated with the one or more components of the device in order to reach the optimal operating temperatures.

Abstract: The description relates to display devices. One example can include a display having an active area surrounded by an inactive deadband. The example can also include a chassis, the display received in the chassis and secured to the chassis beneath the inactive deadband with adhesive. The example can further include a fastening assembly positioned below the inactive deadband and farther beneath the plane than the adhesive, where the fastening assembly creates a retention force between the display and the chassis.

Abstract: A contactless readable programmable transponder to monitor chip join and method of use are disclosed. The method includes reading a frequency of an oscillator associated with a chip module. The method further includes correlating the frequency with a bond quality of the chip module.

Abstract: A contactless readable programmable transponder to monitor chip join and method of use are disclosed. The method includes reading a frequency of an oscillator associated with a chip module. The method further includes correlating the frequency with a bond quality of the chip module.

Abstract: The description relates to display devices. One example can include a display having an active area surrounded by an inactive deadband. The example can also include a chassis, the display received in the chassis and secured to the chassis beneath the inactive deadband with adhesive. The example can further include a fastening assembly positioned below the inactive deadband and farther beneath the plane than the adhesive, where the fastening assembly creates a retention force between the display and the chassis.

Abstract: An enclosure assembly of a monitor device includes an enclosure cover having a cover wall extending substantially in a first plane between a plurality of sides, wherein the cover wall includes an interior surface and an opposing exterior surface. The enclosure assembly includes a first stiffener wing and a second stiffener wing each having one or more mounting portions spaced apart from one or more stiffener portions to define one or more wing body ribs, each mounting portion including a mounting surface opposing a corresponding portion of the interior surface of the cover wall. The first stiffener wing includes a first wing body that extends toward a first side of the enclosure cover, and the second stiffener wing includes a second wing body that extends to a second side of the enclosure cover. Additionally, a display and/or a base assembly may be mounted to the enclosure assembly.

Abstract: Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.

Abstract: A contactless readable programmable transponder to monitor chip join and method of use are disclosed. The method includes reading a frequency of an oscillator associated with a chip module. The method further includes correlating the frequency with a bond quality of the chip module.

Abstract: A contactless readable programmable transponder to monitor chip join and method of use are disclosed. The method includes reading a frequency of an oscillator associated with a chip module. The method further includes correlating the frequency with a bond quality of the chip module.

Abstract: Disclosed are processes and apparatuses for semiconductor die removal and rework, including thin dies. In one aspect the process involves the use of a localized induction heating system to melt targeted solder joints, thereby minimizing the degradation of the thermal performance of the assembly undergoing the rework. Use of a vacuum-based die removal head, optionally in combination with the induction heating system, allows for the removal of thin dies of 150 micrometers thick or less.

Abstract: An enclosure assembly of a monitor device includes an enclosure cover having a cover wall extending substantially in a first plane between a plurality of sides, wherein the cover wall includes an interior surface and an opposing exterior surface. The enclosure assembly includes a first stiffener wing and a second stiffener wing each having one or more mounting portions spaced apart from one or more stiffener portions to define one or more wing body ribs, each mounting portion including a mounting surface opposing a corresponding portion of the interior surface of the cover wall. The first stiffener wing includes a first wing body that extends toward a first side of the enclosure cover, and the second stiffener wing includes a second wing body that extends to a second side of the enclosure cover. Additionally, a display and/or a base assembly may be mounted to the enclosure assembly.

Abstract: A contactless readable programmable transponder to monitor chip join and method of use are disclosed. The method includes reading a frequency of an oscillator associated with a chip module. The method further includes correlating the frequency with a bond quality of the chip module.

Abstract: A contactless readable programmable transponder to monitor chip join and method of use are disclosed. The method includes reading a frequency of an oscillator associated with a chip module. The method further includes correlating the frequency with a bond quality of the chip module.

Abstract: Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.