Patents by Inventor Timothy Markison

Timothy Markison has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10706424
    Abstract: A server computer and a mobile device, as well as a method, are disclosed. The mobile device includes an image including a transactional image layer and a master image layer. The mobile device can be used to conduct transactions.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: July 7, 2020
    Assignee: Visa U.S.A. Inc.
    Inventor: Timothy Markison
  • Publication number: 20190244208
    Abstract: A server computer and a mobile device, as well as a method, are disclosed. The mobile device includes an image including a transactional image layer and a master image layer. The mobile device can be used to conduct transactions.
    Type: Application
    Filed: April 19, 2019
    Publication date: August 8, 2019
    Inventor: Timothy Markison
  • Patent number: 10311441
    Abstract: A mobile device is disclosed. The mobile device includes an image including a transactional image layer and a master image layer. The mobile device can be used to conduct transactions.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: June 4, 2019
    Assignee: Visa U.S.A. Inc.
    Inventor: Timothy Markison
  • Patent number: 7211465
    Abstract: A method of manufacturing a high frequency integrated circuit begins by positioning a die within a package, wherein the die includes a circuit that processes a high frequency signal and at least one bond pad operably coupled to the circuit, and wherein the package includes a plurality of bond posts, wherein at least one of the plurality of bond posts is allocated to the at least one bond pad. The method continues by bonding a first plate of a capacitor to the at least one bond pad. The method continues by bonding a second plate of the capacitor to the at one of the plurality of bond posts.
    Type: Grant
    Filed: July 5, 2005
    Date of Patent: May 1, 2007
    Assignee: ViXS Systems, Inc.
    Inventors: Michael Cave, Michael May, Mathew Rybicki, Timothy Markison
  • Patent number: 7190083
    Abstract: A high frequency integrated circuit includes a die, a package and capacitive bond. The die includes a circuit that processes a high frequency signal and also includes at least one bonding pad coupled to the circuit. The package includes a plurality of bonding posts, at least one of the bonding posts is allocated to the at least one bond pad of the die. A bonding capacitor couples the at least one bond pad on the die to the at least one bond post of the package.
    Type: Grant
    Filed: January 7, 2002
    Date of Patent: March 13, 2007
    Assignee: ViXS Systems, Inc.
    Inventors: Michael Cave, Michael May, Mathew Rybicki, Timothy Markison
  • Patent number: 7184490
    Abstract: A low power distributed transmitter includes a signal generator, signal partitioning module, signal processing module, a plurality of amplifiers, and a transmitting module. The signal generator is operably coupled to generate a signal to represent base-band data in accordance with a particular transmission protocol. The signal partitioning module is operably coupled to partition the signal into a plurality of signal partitions based on a peak-to-average ratio of the signal. The signal processing module processes the plurality of signal partitions to in accordance with the particular transmission protocol to produce processed signals. Each of the amplifiers amplifies a corresponding one of the processed signal partitions to produce amplified signal partitioned. The transmitting module transmits, via an antenna or a plurality of antennas, the amplified signal partitions as a composite amplified signal.
    Type: Grant
    Filed: December 18, 2001
    Date of Patent: February 27, 2007
    Assignee: ViXS Systems, Inc.
    Inventors: Mathew Rybicki, Michael Cave, Michael May, Timothy Markison
  • Publication number: 20050245102
    Abstract: A method of manufacturing a high frequency integrated circuit begins by positioning a die within a package, wherein the die includes a circuit that processes a high frequency signal and at least one bond pad operably coupled to the circuit, and wherein the package includes a plurality of bond posts, wherein at least one of the plurality of bond posts is allocated to the at least one bond pad. The method continues by bonding a first plate of a capacitor to the at least one bond pad. The method continues by bonding a second plate of the capacitor to the at one of the plurality of bond posts.
    Type: Application
    Filed: July 5, 2005
    Publication date: November 3, 2005
    Inventors: Michael Cave, Michael May, Mathew Rybicki, Timothy Markison
  • Publication number: 20050185671
    Abstract: A method for wireless communication between stations of differing protocols begins by determining whether protocols of target stations of a wireless communication are different than a protocol of a source station. The method continues by, when at least one of the target stations has a different protocol than the protocol of the source station, determining whether the wireless communication is a direct wireless communication or an indirect wireless communication. The method continues with the source station transmitting a frame to an access point, wherein the frame is formatted in accordance with the protocol of the source station, when the wireless communication is the indirect wireless communication. The method continues with the access point converting the frame into at least one alternate frame based on the protocol of the at least one of the target stations having the different protocol.
    Type: Application
    Filed: May 28, 2004
    Publication date: August 25, 2005
    Inventors: Christopher Hansen, Jason Trachewsky, Timothy Markison