Patents by Inventor Timothy Mellander

Timothy Mellander has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7713754
    Abstract: This disclosure relates to amorphous ferroelectric memory devices and methods for forming them.
    Type: Grant
    Filed: July 7, 2008
    Date of Patent: May 11, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Robert Bicknell, Timothy Mellander
  • Publication number: 20090047747
    Abstract: This disclosure relates to amorphous ferroelectric memory devices and methods for forming them.
    Type: Application
    Filed: July 7, 2008
    Publication date: February 19, 2009
    Inventors: Robert Bicknell, Timothy Mellander
  • Patent number: 7172978
    Abstract: A method of depositing polymer thin films on a MEMS device having a wafer stack includes depositing one or more protection films on a polymer thin film layer on the wafer stack, fabricating the MEMS device, and removing the one or more protection films.
    Type: Grant
    Filed: July 21, 2004
    Date of Patent: February 6, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hang Liao, Timothy Mellander, Mike Groh
  • Publication number: 20060233091
    Abstract: A storage device comprises a substrate having a recording layer, the recording layer having plural regions associated with respective plural storage cells. A light source generates write light having a first wavelength to write to the storage cells, wherein the storage cells have a size less than the first wavelength.
    Type: Application
    Filed: April 1, 2005
    Publication date: October 19, 2006
    Inventors: David Schut, Robert Bicknell, Michael Setera, Timothy Mellander, Robert Bass
  • Publication number: 20060019420
    Abstract: A method of depositing polymer thin films on a MEMS device having a wafer stack includes depositing one or more protection films on a polymer thin film layer on the wafer stack, fabricating the MEMS device, and removing the one or more protection films.
    Type: Application
    Filed: July 21, 2004
    Publication date: January 26, 2006
    Inventors: Hang Liao, Timothy Mellander, Mike Groh