Patents by Inventor Timothy Mermagen

Timothy Mermagen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding of silicon carbide chip with a semiconductor
    Patent number: 5990551
    Abstract: A module and a method of making the module is disclosed. The module is fod from a semiconductor and a silicon carbide chip for high temperature applications. The module is designed to be compatible with current silicon IC processes.
    Type: Grant
    Filed: March 23, 1998
    Date of Patent: November 23, 1999
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Timothy Mermagen, Judith McCullen, Robert Reams, Bohdan Dobriansky
  • Bonding of silicon carbide directly to a semiconductor substrate by using silicon to silicon bonding
    Patent number: 5877516
    Abstract: A module and a method of making the module is disclosed. The module is formed from a semiconductor substrate and a silicon carbide chip for high temperature applications. The module is designed to be compatible with current silicon IC processes.
    Type: Grant
    Filed: March 20, 1998
    Date of Patent: March 2, 1999
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Timothy Mermagen, Judith McCullen, Robert Reams, Bohdan Dobriansky
  • Double sided wafer, alignment technique
    Patent number: 5530552
    Abstract: A photolithographed method and pattern for alignment of circuit patterns on double sided opaque substrate or semiconductor such as a silicon wafer during processing of integrated circuits.
    Type: Grant
    Filed: December 28, 1994
    Date of Patent: June 25, 1996
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Timothy Mermagen, Bruce R. Geil