Abstract: A device for cooling an electronic component in a data center is provided. The device includes a closed loop, a first area, a second area, and a barrier. The closed loop includes a first portion and a second portion. The liquid flows around the closed loop. The first area is configured for dissipating heat from the electronic component in the data center to liquid in the first portion of the closed loop. The second area is configured for removing heat from the liquid in the second portion of the closed loop by receiving ambient air, which moves across the second portion, from outside the data center and configured for outputting the ambient air with the dissipated heat from the second area and the data center. The barrier is configured for preventing the ambient air from entering the first area.

Abstract: A data center includes a modular building structure forming an enclosure having a bottom side. An external support system extends from the modular building structure. A series of heat sinks are each configured to extend from an interior to an exterior of the enclosure and protrude below the bottom side of the modular building structure into a fluid. Electronic components and devices are housed within the enclosure.

Abstract: A device for cooling an electronic component in a data center is provided. The device includes a closed loop, a first area, a second area, and a barrier. The closed loop includes a first portion and a second portion. The liquid flows around the closed loop. The first area is configured for dissipating heat from the electronic component in the data center to liquid in the first portion of the closed loop. The second area is configured for removing heat from the liquid in the second portion of the closed loop by receiving ambient air, which moves across the second portion, from outside the data center and configured for outputting the ambient air with the dissipated heat from the second area and the data center. The barrier is configured for preventing the ambient air from entering the first area.

Abstract: A fluid cooling module includes tubing and a turbulence structure. The tubing is configured to contain a flowing fluid. The turbulence structure disposed inside the tubing and configured to increase fluid movement within the tubing as the flowing fluid flows over the turbulence structure to thereby generate turbulence in the flowing fluid.

Abstract: A data center includes a modular building structure forming an enclosure having a bottom side. An external support system extends from the modular building structure. A series of heat sinks are each configured to extend from an interior to an exterior of the enclosure and protrude below the bottom side of the modular building structure into a fluid. Electronic components and devices are housed within the enclosure.