Abstract: The present disclosure relates generally to coordinating travel plans in a networked environmental. More particularly, the disclosure relates to providing a dashboard of aggregated travel information.

Abstract: A spacer used to secure a solar module to a substrate having surface irregularities or unevenness includes a spacer layer located between two adhesive layers. The spacer has a thickness greater than any anticipated irregularities or unevenness on the surface of the substrate. The spacer is comprised of materials that provide sufficient strength and weatherability.

Abstract: A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.

Abstract: A solar module includes a photovoltaic device that is partially encapsulated on a front side by a laminate layer. A front substrate is located over the laminate layer. The photovoltaic device is also at least partially encapsulated on a back side by a pressure sensitive adhesive layer. The adhesive layer acts as an encapsulant to protect the photovoltaic device as well as acts as an adhesive for attachment to a substrate.

Abstract: A spacer used to secure a solar module to a substrate having surface irregularities or unevenness includes a spacer layer located between two adhesive layers. The spacer has a thickness greater than any anticipated irregularities or unevenness on the surface of the substrate. The spacer is comprised of materials that provide sufficient strength and weatherability.

Abstract: A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.

Abstract: A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.

Abstract: A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.

Abstract: A method for reducing air infiltration in a building having a frame constructed with wooden components. Glue is applied to abutting wooden surfaces to provide a seal between such surfaces to prevent air flow between such surfaces.