Patents by Inventor Timothy P. O'Brien

Timothy P. O'Brien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8052186
    Abstract: A high rise hose pack system for efficiently transporting a length of fire hose. The high rise hose pack system generally includes a main member having an elongated structure, a plurality of first support members attached to a first side of the main member, a plurality of second support members attached to a second side of the main member opposite of the first support members, a first strap attached to the first side of the main member and a second strap attached to the second side of the main member, wherein the first strap and the second strap are connectable to one another to secure a fire hose folded upon the main member. The first support members and the second support members are preferably comprised of a rigid structure to adequately support the sides of the folded fire hose. A roller is rotatably attached to at least one of the second straps to allow the folded fire hose to bend freely without the second strap frictionally engaging the upper surface of the folded fire hose.
    Type: Grant
    Filed: January 18, 2008
    Date of Patent: November 8, 2011
    Inventors: Timothy P. O'Brien, Gabriel Z. Deurloo, Jon Van Dort
  • Patent number: 7487897
    Abstract: An emergency information holder made of a pliable material having an elongate configuration with a clip secured at one end and a pocket formed at a second end. The pocket is configured to receive a flat strip of writable material. The pocket can be selectively opened and closed.
    Type: Grant
    Filed: April 26, 2005
    Date of Patent: February 10, 2009
    Inventor: Timothy P. O'Brien
  • Publication number: 20080174133
    Abstract: A high rise hose pack system for efficiently transporting a length of fire hose. The high rise hose pack system generally includes a main member having an elongated structure, a plurality of first support members attached to a first side of the main member, a plurality of second support members attached to a second side of the main member opposite of the first support members, a first strap attached to the first side of the main member and a second strap attached to the second side of the main member, wherein the first strap and the second strap are connectable to one another to secure a fire hose folded upon the main member. The first support members and the second support members are preferably comprised of a rigid structure to adequately support the sides of the folded fire hose. A roller is rotatably attached to at least one of the second straps to allow the folded fire hose to bend freely without the second strap frictionally engaging the upper surface of the folded fire hose.
    Type: Application
    Filed: January 18, 2008
    Publication date: July 24, 2008
    Inventors: Timothy P. O'Brien, Gabriel Z. Deurloo, Jon Van Dort
  • Publication number: 20040167850
    Abstract: A method of refinancing a mortgage loan is provided. The method of refinancing a mortgage loan comprises pre-approving a customer for refinancing of a mortgage loan. This customer is sent a pre-screened offer. The offer comprises materials setting forth the terms of the refinanced mortgage loan, materials providing all required pre-acceptance disclosures, and instructions describing how the customer may accept the offer. Upon receiving an indication of acceptance of the offer from the customer, a closing package is sent to the customer to be executed by the customer. The execution of the closing package by the customer creates a refinancing loan agreement. Also provided is a closing package for a mortgage loan comprising closing documents and a format and instructions providing specific guidance to the customer for completion and execution of the closing documents.
    Type: Application
    Filed: February 27, 2004
    Publication date: August 26, 2004
    Applicant: Wells Fargo Home Mortgage, Inc.
    Inventors: Geoffery H. Dreyer, Mark C. Oman, Robert James Caruso, Steven Arthur Bulmer, Eric A. Malchodi, Michael John DeVito, Nancy G. Brennan, Michael J. Heid, Timothy P. O'Brien
  • Publication number: 20040064402
    Abstract: A method of refinancing a mortgage loan is provided. The method of refinancing a mortgage loan comprises pre-approving a customer for refinancing of a mortgage loan. This customer is sent a pre-screened offer. The offer comprises materials setting forth the terms of the refinanced mortgage loan, materials providing all required pre-acceptance disclosures, and instructions describing how the customer may accept the offer. Upon receiving an indication of acceptance of the offer from the customer, a closing package is sent to the customer to be executed by the customer. The execution of the closing package by the customer creates a refinancing loan agreement. Also provided is a closing package for a mortgage loan comprising closing documents and a format and instructions providing specific guidance to the customer for completion and execution of the closing documents.
    Type: Application
    Filed: September 27, 2002
    Publication date: April 1, 2004
    Applicant: Wells Fargo Home Mortgage, Inc.
    Inventors: Geoffery H. Dreyer, Mark C. Oman, Robert James Caruso, Steven Arthur Bulmer, Eric A. Malchodi, Michael John DeVito, Nancy G. Brennan, Michael J. Heid, Timothy P. O'Brien
  • Patent number: 5960314
    Abstract: A semiconductor processing method of providing an electrically conductive interconnecting plug between an elevationally inner conductive node and an elevationally outer conductive node includes, a) providing an inner node location to which electrical connection is to be made; b) providing an electrically insulative layer outwardly over the inner node location; c) patterning and etching a contact opening through the insulative layer to the inner node location; d) substantially filling the contact opening with an electrically conductive material to provide a conductive plug within the contact opening to the inner node location, the conductive plug defining an outermost fang gap between the conductive plug and the electrically insulative layer, the fang gap having a first width; e) widening the fang gap to a second width which is greater than the first width by a timed RF plasma etch of the electrically conductive material; f) providing an outer metal layer over the conductive plug after the widening step, the m
    Type: Grant
    Filed: September 18, 1998
    Date of Patent: September 28, 1999
    Assignee: Micron Technology, Inc.
    Inventors: Howard E. Rhodes, Timothy P. O'Brien, Rod C. Langley
  • Patent number: 5817573
    Abstract: In one aspect, a semiconductor processing method for connecting a metal layer to a plug when there is a fang gap between the plug and a layer surrounding the plug includes: a) forming a conductive material within an opening in a surrounding layer; b) etching the conductive material with a first etch chemistry to form a fang gap between the conductive material and the surrounding layer, the fang gap having a first width; c) etching the conductive material with a second etch chemistry to widen the fang gap to a second width which is greater than the first width, the second etch chemistry being different from the first etch chemistry; and d) providing an outer metal layer over the conductive plug after widening the fang gap, the metal layer at least partially filling the widened fang gap.
    Type: Grant
    Filed: December 8, 1995
    Date of Patent: October 6, 1998
    Assignee: Micron Technology, Inc.
    Inventors: Howard E. Rhodes, Timothy P. O'Brien, Rod C. Langley
  • Patent number: 5496773
    Abstract: A semiconductor processing method of providing an electrically conductive interconnecting plug between an elevationally inner conductive node and an elevationally outer conductive node includes, a) providing an inner node location to which electrical connection is to be made; b) providing an electrically insulative layer outwardly over the inner node location; c) patterning and etching a contact opening through the insulative layer to the inner node location; d) substantially filling the contact opening with an electrically conductive material to provide a conductive plug within the contact opening to the inner node location, the conductive plug defining an outermost fang gap between the conductive plug and the electrically insulative layer, the fang gap having a first width; e) widening the fang gap to a second width which is greater than the first width by a timed RF plasma etch of the electrically conductive material; f) providing an outer metal layer over the conductive plug after the widening step, the m
    Type: Grant
    Filed: April 28, 1995
    Date of Patent: March 5, 1996
    Assignee: Micron Technology, Inc.
    Inventors: Howard E. Rhodes, Timothy P. O'Brien, Rod C. Langley
  • Patent number: 5200359
    Abstract: A semiconductor processing method for decreasing electrical contact resistance between different elevation electrically conductive layers is disclosed. The method includes applying an aluminum layer atop a partially processed semiconductor wafer, with the aluminum layer having a defined upper surface. The semiconductor wafer with applied aluminum layer is exposed to an oxidizing atmosphere, forming an electrically resistive aluminum oxide at the upper surface of the aluminum layer. An interlayer insulating dielectric material is applied atop the aluminum layer. It is selectively patterned and etched to define a contact opening to the aluminum layer. A layer of titanium metal is applied atop the patterned and etched interlayer dielectric to a preselected thickness. The titanium metal contacts the upper aluminum oxide surface of the aluminum layer within the contact opening.
    Type: Grant
    Filed: October 3, 1991
    Date of Patent: April 6, 1993
    Assignee: Micron Technology, Inc.
    Inventors: Leslie A. Pearey, Timothy P. O'Brien, John E. Knudson, Thomas N. Melody, Russell C. Zahorik
  • Patent number: 4824067
    Abstract: A removable outboard motor bracket that mounts on a swim platform on the rear end of a power boat, and which permits an outboard motor carried on the bracket to be lowered into the water for use and raised vertically out of the water when not in use, and which can be quickly and easily removed for storage purposes.
    Type: Grant
    Filed: July 5, 1988
    Date of Patent: April 25, 1989
    Inventor: Timothy P. O'Brien