Patents by Inventor Timothy Patrick Patterson

Timothy Patrick Patterson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FLIP-CHIP BONDED IMAGER DIE
    Publication number: 20130075850
    Abstract: An image sensor includes an imager die, a circuit board, and an optical layer. The circuit board is flip-chip bonded to the imager die. The optical layer is adhered to the circuit board and includes a first portion configured to refract light differently than a second portion. Both the first portion and the second portion are integrally formed with the optical layer.
    Type: Application
    Filed: August 20, 2012
    Publication date: March 28, 2013
    Inventors: Timothy Patrick Patterson, Tim J. Moran, Craig W. Forrest