Patents by Inventor Timothy R. Emery

Timothy R. Emery has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Particle tolerant architecture for feed holes and method of manufacturing
    Publication number: 20030142185
    Abstract: In one embodiment, a fluid ejection device comprises a substrate having a fluid slot defined from a first surface through to a second opposite surface; an ejection element formed over the first surface and that ejects fluid therefrom; and a filter having feed holes positioned over the fluid slot near the first surface. Fluid moves from the second surface through the feed holes to the ejection element. In a particular embodiment, the filter is formed of a first material that is surrounded by a second material. In another particular embodiment, the filter is formed from the back side and is formed of the same material as the substrate.
    Type: Application
    Filed: January 31, 2002
    Publication date: July 31, 2003
    Inventors: Jeremy Donaldson, Naoto A. Kawamura, Daniel A. Kearl, Donald J. Milligan, J. Daniel Smith, Martha A. Truninger, Diane Lai, Norman L. Johnson, William Edwards, Sadiq Bengali, Timothy R. Emery
  • Monitoring and test structures for silicon etching
    Patent number: 6599761
    Abstract: A through-substrate etching process is monitored by providing a sacrificial electrode in proximity to a desired etch window on the substrate. An etch process is performed on the substrate. The etch process is monitored by measuring an electrical property of either the substrate or the sacrificial electrode or both.
    Type: Grant
    Filed: July 26, 2001
    Date of Patent: July 29, 2003
    Assignee: Hewlett-Packard Development Company
    Inventors: Jeffery S. Hess, Steven D. Leith, Donald W. Schulte, William Edwards, Jeffrey S. Obert, Timothy R. Emery
  • Substrate with fluidic channel and method of manufacturing
    Patent number: 6555480
    Abstract: A method of manufacturing a fluidic channel through a substrate includes etching an exposed section on a first surface of the substrate, and coating the etched section of the substrate. The etching and the coating are alternatingly repeated until the fluidic channel is formed.
    Type: Grant
    Filed: July 31, 2001
    Date of Patent: April 29, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Donald J Milligan, Tim R Koch, Martha A Truninger, Diane W Lai, Timothy R Emery, J. Daniel Smith
  • Substrate with fluidic channel and method of manufacturing
    Publication number: 20030027426
    Abstract: A method of manufacturing a fluidic channel through a substrate includes etching an exposed section on a first surface of the substrate, and coating the etched section of the substrate. The etching and the coating are alternatingly repeated until the fluidic channel is formed.
    Type: Application
    Filed: July 31, 2001
    Publication date: February 6, 2003
    Inventors: Donald J. Milligan, Tim R. Koch, Martha A. Truninger, Diane W. Lai, Timothy R. Emery, J. Daniel Smith
  • Monitoring and test structures for silicon etching
    Publication number: 20030022397
    Abstract: A through-substrate etching process is monitored by providing a sacrificial electrode in proximity to a desired etch window on the substrate. An etch process is performed on the substrate. The etch process is monitored by measuring an electrical property of either the substrate or the sacrificial electrode or both.
    Type: Application
    Filed: July 26, 2001
    Publication date: January 30, 2003
    Inventors: Jeffery S. Hess, Steven D. Leith, Donald W. Schulte, William Edwards, Jeffrey S. Obert, Timothy R. Emery
  • Ink feed channels and heater supports for thermal ink-jet printhead
    Patent number: 6475402
    Abstract: An ink-jet printhead fabrication process and product that uses selectivity rate controlled etch techniques to produce trenches on the frontside of a silicon substrate to define ink feed channels and resistor support regions. Location and size of features is made independent of etch rate by providing a selective etch for the silicon trench etch steps that is greater than 10,000:1 for the silicon:oxide that defines ink feed channels and resistor support areas.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: November 5, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Terry V. Nordstrom, Timothy R. Emery, Sadiq Bengali, Victorio A. Chavarria, Michael G. Monroe, George Radominski
  • INK FEED CHANNELS AND HEATER SUPPORTS FOR THERMAL INK-JET PRINTHEAD
    Publication number: 20020122100
    Abstract: An ink-jet printhead fabrication process and product that uses selectivity rate controlled etch techniques to produce trenches on the frontside of a silicon substrate to define ink feed channels and resistor support regions. Location and size of features is made independent of etch rate by providing a selective etch for the silicon trench etch steps that is greater than 10,000:1 for the silicon:oxide that defines ink feed channels and resistor support areas.
    Type: Application
    Filed: March 2, 2001
    Publication date: September 5, 2002
    Inventors: Terry V. Nordstrom, Timothy R. Emery, Sadiq Bengali, Victorio A. Chavarria, Michael G. Monroe, George Radominski