Patents by Inventor Timothy R. Spooner

Timothy R. Spooner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package having a plurality of mounting orientations
    Patent number: 7968807
    Abstract: A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.
    Type: Grant
    Filed: July 20, 2007
    Date of Patent: June 28, 2011
    Assignee: Analog Devices, Inc.
    Inventors: Timothy R. Spooner, Nelson Kuan
  • Package Having a Plurality of Mounting Orientations
    Publication number: 20080205025
    Abstract: A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.
    Type: Application
    Filed: July 20, 2007
    Publication date: August 28, 2008
    Applicant: ANALOG DEVICES, INC.
    Inventors: Timothy R. Spooner, Nelson Kuan
  • Method and device for protecting micro electromechanical systems structures during dicing of a wafer
    Patent number: 7022546
    Abstract: A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.
    Type: Grant
    Filed: December 5, 2001
    Date of Patent: April 4, 2006
    Assignee: Analog Devices, Inc.
    Inventors: Timothy R. Spooner, David S. Courage, Brad Workman
  • Method and device for protecting micro electromechanical systems structures during dicing of a wafer
    Patent number: 6946326
    Abstract: A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.
    Type: Grant
    Filed: December 5, 2001
    Date of Patent: September 20, 2005
    Assignee: Analog Devices, Inc.
    Inventors: Timothy R. Spooner, Kieran P. Harney, David S. Courage, John R. Martin
  • Method and device for protecting micro electromechanical systems structures during dicing of a wafer
    Patent number: 6946366
    Abstract: A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.
    Type: Grant
    Filed: December 5, 2001
    Date of Patent: September 20, 2005
    Assignee: Analog Devices, Inc.
    Inventors: Timothy R. Spooner, David S. Courage, Brad Workman
  • Method and device for protecting micro electromechanical system structures during dicing of a wafer
    Patent number: 6555417
    Abstract: A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.
    Type: Grant
    Filed: December 5, 2001
    Date of Patent: April 29, 2003
    Assignee: Analog Devices, Inc.
    Inventors: Timothy R. Spooner, Kieran P. Harney
  • Method and device for protecting micro electromechanical systems structures during dicing of a wafer
    Publication number: 20020096743
    Abstract: A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.
    Type: Application
    Filed: December 5, 2001
    Publication date: July 25, 2002
    Inventors: Timothy R. Spooner, Kieran P. Harney, David S. Courage, John R. Martin
  • Method and device for protecting micro electromechanical systems structures during dicing of a wafer
    Publication number: 20020081816
    Abstract: A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.
    Type: Application
    Filed: December 5, 2001
    Publication date: June 27, 2002
    Inventors: Timothy R. Spooner, David S. Courage, Brad Workman
  • Method and device for protecting micro electromechanical systems structures during dicing of a wafer
    Publication number: 20020076848
    Abstract: A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.
    Type: Application
    Filed: December 5, 2001
    Publication date: June 20, 2002
    Inventors: Timothy R. Spooner, David S. Courage, Brad Workman
  • Method and device for protecting micro electromechanical systems structures during dicing of a wafer
    Publication number: 20020076873
    Abstract: A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.
    Type: Application
    Filed: December 5, 2001
    Publication date: June 20, 2002
    Inventors: Timothy R. Spooner, Kieran P. Harney