Abstract: A system, method and computer program product are provided for managing the use of a plurality of security service providers during network communication. A first security service provider is utilized for affording secure communication between applications using a network. During operation, the system is monitored for events relating to the secure communication between the applications. Upon the detection of an event, a second security service provider is utilized for affording secure communication between the applications using the network.

Abstract: The described invention is directed to microwave methods for burning-in, electrical stressing, thermal stressing and reducing rectifying junction leakage current in fully processed semiconductor chips individually and at wafer level, as well as burning in and stressing semiconductor chip packaging substrates and the combination of a semiconductor chip mounted onto a semiconductor chip packaging substrate. Microwaves burn-in devices in a substantially shorter period of time than conventional burn-in techniques and avoid the need for special workpiece holders which are required by conventional stress and burn-in techniques. Additionally, microwave methods are described for reducing the leakage current of recitfying junctions, such as PN junctions and Schottky barrier diode junctions of semiconductor devices on fully processed semiconductor chips and wafers.