Abstract: CVD reactors can be cleaned at surprisingly high rates using Non-Green House gases by employing the Non-Green House gases at high temperatures and with relatively high fluorine free radical concentrations so long as high concentrations of oxygen are also used to compensate for the detrimental effects of the high temperatures and free fluorine radical concentrations. Net oxide residue etch rates approximately 2,800 times greater than etch rates achieved with controlled Green House gases can be achieved. This is done by employing a pre-ionization module upstream of the reactor to be cleaned to generate the requisite high density plasma.

Abstract: Premature equipment failure of susceptors used during plasma processing of semiconductor wafers is avoided by making the holes, characteristic of susceptors, such that the hole diameter is less that the susceptor thickness. In one embodiment, the susceptor includes a pattern of support struts which permits the planar top plate of the susceptor to be made quite thin and yet permits the diameter-to-thickness requirement to be met by aligning the pattern of holes with the pattern of support struts and having the holes penetrate the struts.

Abstract: An ion milling technique for forming non-planar features on a semiconductor wafer into relatively planar features for further layer deposition replaces the conventional polishing technique currently in use. The technique employs a first ion gun directing a beam normal to the wafer surface and operative to impact the features uniformly to exaggerate the hills of the feature into steep peaks and to form the valleys therebetween into shallow valleys. The technique also employs a second ion gun directed normal to the steep slopes of the peaks and aimed at a portion of the radius of the wafer while the wafer is rotated. The second beam takes advantage of the fact that the peaks mill at a rate twice as fast as the shallow valleys and the first ion beam operates to magnify the aspect ratio between the peaks and the valleys to ensure that the different rates of milling actually occurs when the second ion beam is brought into play.