Patents by Inventor Timothy Spooner

Timothy Spooner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stress mitigation in packaged microchips
    Patent number: 8344487
    Abstract: A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.
    Type: Grant
    Filed: June 28, 2007
    Date of Patent: January 1, 2013
    Assignee: Analog Devices, Inc.
    Inventors: Xin Zhang, Michael Judy, Kevin H. L. Chau, Nelson Kuan, Timothy Spooner, Chetan Paydenkar, Peter Farrell
  • Stress Mitigation in Packaged Microchips
    Publication number: 20100013067
    Abstract: A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.
    Type: Application
    Filed: June 28, 2007
    Publication date: January 21, 2010
    Applicant: ANALOG DEVICES, INC.
    Inventors: Xin Zhang, Michael Judy, Kevin H.L. Chau, Nelson Kuan, Timothy Spooner, Chetan Paydenkar, Peter Farrell
  • Stress Mitigation in Packaged Microchips
    Publication number: 20090230521
    Abstract: A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.
    Type: Application
    Filed: June 28, 2007
    Publication date: September 17, 2009
    Applicant: Analog Devices, Inc.
    Inventors: Xin Zhang, Michael Judy, Kevin Chau, Nelson Kuan, Timothy Spooner, Chetan Paydenkar, Peter Farrell
  • Stress Mitigation in Packaged Microchips
    Publication number: 20080157298
    Abstract: A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.
    Type: Application
    Filed: June 28, 2007
    Publication date: July 3, 2008
    Applicant: ANALOG DEVICES, INC.
    Inventors: Xin Zhang, Michael Judy, Kevin H.L. Chau, Nelson Kuan, Timothy Spooner, Chetan Paydenkar, Peter Farrell
  • Optical mirror module
    Patent number: 6831772
    Abstract: An optical mirror module has an interface port that is spaced from a corresponding die. More specifically, the optical mirror module includes a substrate and a die having at least one mirror and circuitry to control the at least one mirror. The optical mirror module defines a plane that is substantially parallel to the die. The optical mirror module further includes the noted interface port, which is adapted to electrically couple the circuitry with a device external to the optical mirror module. As suggested above, the interface port is located on the substrate and spaced from the die on the plane.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: December 14, 2004
    Assignee: Analog Devices, Inc.
    Inventors: Timothy Spooner, Lewis Long
  • Optical mirror module
    Publication number: 20030147118
    Abstract: An optical mirror module has an interface port that is spaced from a corresponding die. More specifically, the optical mirror module includes a substrate and a die having at least one mirror and circuitry to control the at least one mirror. The optical mirror module defines a plane that is substantially parallel to the die. The optical mirror module further includes the noted interface port, which is adapted to electrically couple the circuitry with a device external to the optical mirror module. As suggested above, the interface port is located on the substrate and spaced from the die on the plane.
    Type: Application
    Filed: July 18, 2002
    Publication date: August 7, 2003
    Inventors: Timothy Spooner, Lewis Long