Abstract: A method for packaging a die includes attaching the die to a substrate using a plurality of pieces of discontinuous die attach material, and injecting a mold compound at the interface between the die and the substrate.

Abstract: A semiconductor package substrate has top and bottom surface buildup layers disposed on a thermally conductive substrate core. A portion of the substrate core may be exposed at a top surface of the package substrate to allow a heat spreader to be thermally coupled to the substrate core. An integrated circuit may be mounted on a top surface of the package substrate, with a top surface of the integrated circuit facing down. A heat spreader may be attached to the package substrate. The heat spreader may be thermally coupled to the substrate core and to a backside surface of the integrated circuit.

Abstract: A semiconductor device having a conductive layer above a dielectric layer and a top metal layer. The conductive layer is patterned to form an alternate probe area to test the functionality of active circuitry within the semiconductor device and patterned to electrically route a thru semiconductor via within the semiconductor device to an alternate junction point.

Abstract: An interposer, between a die and a substrate, has a body with a first surface, an opposite second surface, and a channel that passes from the first surface, through the body to the opposite second surface.