Abstract: A process and system for the separation of materials from electrochemical cells is disclosed. Electrode materials are removed from electrochemical cells and separated into constituent active materials using magnetic separation.

Abstract: A process and system for the separation of materials from electrochemical cells is disclosed. Electrode materials are removed from electrochemical cells and separated into constituent active materials using magnetic separation.

Abstract: A battery grid comprising a continuous cast and mechanically deformed lead-based alloy that comprises lead and silver and is essentially free of calcium, wherein the silver is at a concentration that is in a range of about 0.003 to about 0.015 weight percent, and has a predominant equiaxed grain structure that comprises grain sizes that are in a range of about 0.1 to about 5 microns. Other alloy constituents include bismuth at a concentration that is in a range of about 0.003 to about 0.002 weight percent and tin at a concentration that is in a range of about 0.2 to about 1.8 weight percent. A process for making strip of said alloy for use in manufacturing said grid. A battery comprising said grid.

Abstract: An emissions reduction stack includes a conditioning section, collector section utilizing a Wet Electrostatic Precipitator (WESP), and output section. A chemically active aqueous stream is introduced into an incoming process stream in order to saturate the stream and produce a fog stream wherein water is condensed on the surface of particulates. The process of condensation increases the efficiency of the particulate filtration process conducted by the WESP.

Abstract: Processes for separating and recycling battery and electrochemical cell materials are disclosed.

Abstract: An emissions reduction slack includes a conditioning section, collector section utilizing a Wet Electrostatic Precipitator (WESP), and output section. A chemically active aqueous stream is introduced into an incoming process stream in order to saturate the stream and produce a fog stream wherein water is condensed on the surface of particulates. The process of condensation increases the efficiency of the particulate filtration process conducted by the WESP.

Abstract: Materials in battery and electrochemical cells are separated in a form suitable for recycling by employing froth flotation techniques. Bulk materials, such as casings, are removed from converted battery scrap and the resultant pulp is subjected to froth flotation. Froth flotation agents, including frothers, collectors and/or depressants, are used to manipulate the hydrophilic and hydrophobic nature of the materials in the scrap. Hydrophobic materials are entrained in the air bubbles of the froth and float out of the froth flotation vessel while those that are hydrophilic remain in the vessel, thereby separating battery grid materials without resort to pyrometallurgical, energy intensive or other environmentally undesirable processes.

Abstract: An electrode is formed using a sanding mechanism to condition the surface of the electrode for electrochemical purposes. Hazardous particles emitted during sanding are captured using jetted liquid, and may be recycled for later use. The sanded surface provides increased electrode lifespan and lead oxide adherence.

Abstract: A process and system for the separation of materials from electrochemical cells is disclosed. Electrode materials are removed from electrochemical cells and separated into constituent active materials using magnetic separation.

Abstract: An electrochemical anode is formed using friction stir welded (FSW) joints. A FSW joint may be formed between the bus bar and anode sheet or the lead encapsulation and anode sheet. The FSW joints may also comprise fillet and butt joints. FSW joints may also be utilized to seal the ends of the electrochemical anodes to prevent corrosion.

Abstract: An emissions reduction stack comprises a conditioning section, collector section utilizing a Wet Electrostatic Precipitator (WESP), and output section. A chemically active aqueous stream is introduced into an incoming process stream in order to saturate the stream and produce a fog stream wherein water is condensed on the surface of particulates. The process of condensation increases the efficiency of the particulate filtration process conducted by the WESP.

Abstract: An electrode is formed using a sanding mechanism to condition the surface of the electrode for electrochemical purposes. Hazardous particles emitted during sanding are captured using jetted liquid, and may be recycled for later use. The sanded surface provides increased electrode lifespan and lead oxide adherence.

Abstract: An electrochemical anode is formed using friction stir welded (FSW) joints. A FSW joint may be formed between the bus bar and anode sheet or the lead encapsulation and anode sheet. The FSW joints may also comprise fillet and butt joints. FSW joints may also be utilized to seal the ends of the electrochemical anodes to prevent corrosion.

Abstract: Materials in battery and electrochemical cells are separated in a form suitable for recycling by employing froth flotation techniques. Bulk materials, such as casings, are removed from converted battery scrap and the resultant pulp is subjected to froth flotation. Froth flotation agents, including frothers, collectors and/or depressants, are used to manipulate the hydrophilic and hydrophobic nature of the materials in the scrap. Hydrophobic materials are entrained in the air bubbles of the froth and float out of the froth flotation vessel while those that are hydrophilic remain in the vessel, thereby separating battery grid materials without resort to pyrometallurgical, energy intensive or other environmentally undesirable processes.

Abstract: Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.

Abstract: Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.

Abstract: A process for manufacturing a Printed Circuit Board (PCB) substrate with passive electrical components (e.g., capacitors, inductors and/or resistors) includes weaving a plurality of dielectric strands (e.g., fiberglass yarns) and at least one electrically conductive strand (e.g., a copper wire) to form a woven fabric. The woven fabric is impregnated with a dielectric resin material to form an impregnated fabric and, thereafter, the impregnated fabric is cured to form a cured fabric. The cured fabric's upper and lower surfaces are then planed. The planing of the upper and lower surface segments the electrically conductive strands and forms a PCB substrate with a passive electrical component (e.g., a capacitor and/or inductor) therein. The passive electrical component(s) includes electrically isolated conductive strand segments separated by at least one of the dielectric resin material and the dielectric strands.

Abstract: Methods of protecting from atmospheric contaminants, or removing atmospheric contaminants from, the bonding surfaces of copper semiconductor bond pads by coating a bond pad with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible during ball or wedge wire bonding to obtain metal-to-metal contact between the bonding surfaces and the wires bonded thereto. Coated semiconductor wafers are also disclosed.

Abstract: Methods of protecting from atmospheric contaminants, or removing atmospheric contaminants from, the bonding surfaces of copper semiconductor bond pads by coating a bond pad with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible during ball or wedge wire bonding to obtain metal-to-metal contact between the bonding surfaces and the wires bonded thereto. Coated semiconductor wafers are also disclosed.

Abstract: A metal alloy composite comprising a phase of a highly-conductive base metal in the from of a matrix and a phase of another metal positioned within the matrix, the base metal being present in a major amount and the other metal being present in a minor amount, the metal alloy composite being capable of being formed into a very thin wire for use in a semiconductor application which includes a terminal assembly comprising an electrically conductive terminal in conductive contact with a conductive member and another electrically conductive terminal in conductive contact with a semiconductor, said terminals being joined by said alloy composite wire, examples of the base metal being gold, copper, and aluminum.