Patents by Inventor Timothy Wayne Olesiewicz

Timothy Wayne Olesiewicz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High airflow storage device array and related electronic modules
    Patent number: 12641744
    Abstract: An electronic assembly for handling a storage module is provided. The electronic assembly includes an open frame structure having a front frame including a front opening configured to receive air, and two side rails coupled to opposite sides of the front frame. Each side rail includes a side opening and an extended portion. The side opening is configured to direct the air received by the front opening at least partially out of the open frame structure. The extended portion extends from the side opening and away from the front frame and is configured to hold a storage module. The electronic assembly includes a lever bar coupled in proximity to the opposite sides of the front frame and having a lock position that is configured to lock the storage module onto a chassis base and a release position that is configured to release the storage module from the chassis base.
    Type: Grant
    Filed: July 19, 2024
    Date of Patent: May 26, 2026
    Assignee: QUALCOMM Incorporated
    Inventor: Timothy Wayne Olesiewicz
  • HIGH AIRFLOW STORAGE DEVICE ARRAY AND RELATED ELECTRONIC MODULES
    Publication number: 20240373579
    Abstract: An electronic assembly for handling a storage module is provided. The electronic assembly includes an open frame structure having a front frame including a front opening configured to receive air, and two side rails coupled to opposite sides of the front frame. Each side rail includes a side opening and an extended portion. The side opening is configured to direct the air received by the front opening at least partially out of the open frame structure. The extended portion extends from the side opening and away from the front frame and is configured to hold a storage module. The electronic assembly includes a lever bar coupled in proximity to the opposite sides of the front frame and having a lock position that is configured to lock the storage module onto a chassis base and a release position that is configured to release the storage module from the chassis base.
    Type: Application
    Filed: July 19, 2024
    Publication date: November 7, 2024
    Inventor: Timothy Wayne Olesiewicz
  • High airflow storage device array and related electronic modules
    Patent number: 12082362
    Abstract: An electronic assembly for handling a storage module is provided. The electronic assembly includes an open frame structure having a front frame including a front opening configured to receive air, and two side rails coupled to opposite sides of the front frame. Each side rail includes a side opening and an extended portion. The side opening is configured to direct the air received by the front opening at least partially out of the open frame structure. The extended portion extends from the side opening and away from the front frame and is configured to hold a storage module. The electronic assembly includes a lever bar coupled in proximity to the opposite sides of the front frame and having a lock position that is configured to lock the storage module onto a chassis base and a release position that is configured to release the storage module from the chassis base.
    Type: Grant
    Filed: October 12, 2022
    Date of Patent: September 3, 2024
    Assignee: QUALCOMM Incorporated
    Inventor: Timothy Wayne Olesiewicz
  • HIGH AIRFLOW STORAGE DEVICE ARRAY AND RELATED ELECTRONIC MODULES
    Publication number: 20230116549
    Abstract: An electronic assembly for handling a storage module is provided. The electronic assembly includes an open frame structure having a front frame including a front opening configured to receive air, and two side rails coupled to opposite sides of the front frame. Each side rail includes a side opening and an extended portion. The side opening is configured to direct the air received by the front opening at least partially out of the open frame structure. The extended portion extends from the side opening and away from the front frame and is configured to hold a storage module. The electronic assembly includes a lever bar coupled in proximity to the opposite sides of the front frame and having a lock position that is configured to lock the storage module onto a chassis base and a release position that is configured to release the storage module from the chassis base.
    Type: Application
    Filed: October 12, 2022
    Publication date: April 13, 2023
    Inventor: Timothy Wayne Olesiewicz