Abstract: In a tape lead bonding system, lead frames (3) are moved on a tape substrate (2) from a first station, where a first camera (12) takes an image of one half of one lead frame, to the next station, where a second camera (16) takes an image of the second half of the lead frame, while, at the same time, the first half of the next lead frame is being imaged by the first cameras(12). Both images of the particular lead frame (3) are then inspected by an inspection computer (15) before that lead frame reaches a bonding station so that bonding of a semiconductor die (21) to the lead frame (3) can be halted if a defect in the lead frame (3) is found. The system operates at the speed of the bonding unit (22), with out requiring the system to be slowed down to allow a full inspection of each lead frame (3) before the bonding step.