Abstract: Heat transfer couplers, which can also be referred to as nozzles, for semiconductor manufacturing are provided. The heat transfer couplers include non-continuous channels on opposite faces. In an assembly process, semiconductor chips can be electrically coupled to a devices forming electrical interconnects. The assembly process can be a thermocompression bonding process in which first level interconnects are formed.

Abstract: An apparatus includes a nozzle including a small die vacuum line disposed on a surface of the nozzle, and a large die vacuum line disposed on the surface and surrounding the small die vacuum line. The nozzle further includes a first die vacuum hole disposed through the surface and the small die vacuum line, and a second die vacuum hole disposed through the surface and the large die vacuum line. The small die vacuum line and the first die vacuum hole are configured to provide a vacuum to a small semiconductor die to be attached to a substrate, and the small die vacuum line, the large die vacuum line, the first die vacuum hole and the second die vacuum hole are configured to provide the vacuum to a large semiconductor die to be attached to the substrate.

Abstract: This disclosure describes enhanced substrate transfer arm (STA) and pedestal designs related to a thermal compression bonding process. The designs include multiple row patterns of the STA and the pedestal used to: pick up a first substrate row from a first row of a tray; place the first substrate row onto a first row of a bond stage corresponding to the first row of the tray; pick up a second substrate row from the tray; place, using the suction cups, the second substrate row onto a remaining empty row of the bond stage; pick up the first substrate row after thermal bonding from the bond stage; place the first substrate row after thermal bonding onto the tray; when all substrates from the tray have been thermally bonded, pick up a last substrate row after thermal bonding from the bond stage; and place the last substrate row onto the tray.

Abstract: An apparatus includes a nozzle including a small die vacuum line disposed on a surface of the nozzle, and a large die vacuum line disposed on the surface and surrounding the small die vacuum line. The nozzle further includes a first die vacuum hole disposed through the surface and the small die vacuum line, and a second die vacuum hole disposed through the surface and the large die vacuum line. The small die vacuum line and the first die vacuum hole are configured to provide a vacuum to a small semiconductor die to be attached to a substrate, and the small die vacuum line, the large die vacuum line, the first die vacuum hole and the second die vacuum hole are configured to provide the vacuum to a large semiconductor die to be attached to the substrate.