Abstract: A direct drive robotic manipulator is provided which includes a plurality of segments that are rotatably coupled with respect to one another. A plurality of spindles connects the segments for relative rotation therebetween, and a plurality of direct drive assemblies is further coupled to the plurality of spindles. Each direct drive assembly encloses an end of a spindle and comprises a rotor assembly to which the spindle is attached for manipulating the spindle. A positional measurement apparatus may also be included at each direct drive assembly to ascertain an angular disposition of a segment relative to an adjoining segment.

Abstract: A heating apparatus and method for heating a semiconductor device during bonding of electrical contacts onto the device is provided, which includes a heating plate that is provided for heating the semiconductor device and a layer of compliant material extending over at least a portion of the heating plate for mounting the semiconductor device. A holding mechanism secures the semiconductor device on the layer of compliant material during bonding of electrical contacts onto the semiconductor device while it is being heated by the heating plate.

Abstract: A direct drive robotic manipulator is provided which includes a plurality of segments that are rotatably coupled with respect to one another. A plurality of spindles connects the segments for relative rotation therebetween, and a plurality of direct drive assemblies is further coupled to the plurality of spindles. Each direct drive assembly encloses an end of a spindle and comprises a rotor assembly to which the spindle is attached for manipulating the spindle. A positional measurement apparatus may also be included at each direct drive assembly to ascertain an angular disposition of a segment relative to an adjoining segment.