Patents by Inventor Tin Kwan Chan

Tin Kwan Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multiple-head wire-bonding system
    Patent number: 6749100
    Abstract: The invention provides a wire-bonding apparatus for forming electrical connections between a semiconductor chip and a leadframe, comprising a plurality of bond-heads associated with a plurality of work holders on said wire bonding apparatus for holding a plurality of leadframes, wherein each bond-head of the apparatus is capable of independent bonding operation simultaneously with the other bond-heads, without synchronization of movement with the other bond-heads.
    Type: Grant
    Filed: November 28, 2001
    Date of Patent: June 15, 2004
    Assignee: ASM Technology Singapore Pte Ltd.
    Inventors: Yam Mo Wong, Keng Yew Song, Ka Shing Kwan, Hon Yu Ng, Tin Kwan Chan
  • Multiple-head wire-bonding system
    Publication number: 20030098340
    Abstract: The invention provides a wire-bonding apparatus for forming electrical connections between a semiconductor chip and a leadframe, comprising a plurality of bond-heads associated with a plurality of work holders on said wire bonding apparatus for holding a plurality of leadframes, wherein each bond-head of the apparatus is capable of independent bonding operation simultaneously with the other bond-heads, without synchronization of movement with the other bond-heads.
    Type: Application
    Filed: November 28, 2001
    Publication date: May 29, 2003
    Applicant: ASM Technology Singapore Pte Ltd
    Inventors: Yam Mo Wong, Keng Yew Song, Ka Shing Kwan, Hon Yu Ng, Tin Kwan Chan