Patents by Inventor Tin-Lup Wong

Tin-Lup Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200373277
    Abstract: An interposer is capable of efficiently reinforcing the connecting portion between an electronic component and a substrate. The interposer is used for mounting a first electronic component on a substrate and includes a sheet-shaped spacer having at least one through-hole and including a material that does not flow during reflow soldering and a resin portion that covers at least a part of the spacer and is flowable during reflow soldering, and the through-hole is configured to store a bump of the first electronic component.
    Type: Application
    Filed: August 2, 2019
    Publication date: November 26, 2020
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Tadashi Kosuga, Tin-Lup Wong
  • Publication number: 20200373268
    Abstract: A substrate is capable of effectively reinforcing a connecting portion between an electronic component and the substrate. The substrate is a substrate on which a first electronic component having a plurality of bumps is to be mounted, and includes a base portion including an insulator and having, on the upper face thereof, at least one groove portion configured to store a tip portion of at least one of the bumps, and includes an electrode formed on at least the bottom face of the groove portion.
    Type: Application
    Filed: August 2, 2019
    Publication date: November 26, 2020
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Tadashi Kosuga, Tin-Lup Wong
  • Patent number: 10833050
    Abstract: An interposer is capable of efficiently reinforcing the connecting portion between an electronic component and a substrate. The interposer is used for mounting a first electronic component on a substrate and includes a sheet-shaped spacer having at least one through-hole and including a material that does not flow during reflow soldering and a resin portion that covers at least a part of the spacer and is flowable during reflow soldering, and the through-hole is configured to store a bump of the first electronic component.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: November 10, 2020
    Assignee: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Tadashi Kosuga, Tin-Lup Wong
  • Publication number: 20200311290
    Abstract: Apparatus, methods, and program products are disclosed for operating a display in privacy mode. One apparatus includes a processor and a memory that stores code executable by the processor. The code is executable by the processor to detect an individual within an unauthorized zone in the field of view of a camera. The code is executable by the processor to operate a display in privacy mode in response to detecting the individual within the unauthorized zone. Methods and computer program products that perform the functions of the apparatus are also disclosed.
    Type: Application
    Filed: March 29, 2019
    Publication date: October 1, 2020
    Inventors: Koji Kawakita, David W. Douglas, Tin-Lup Wong
  • Publication number: 20200291196
    Abstract: Apparatuses, methods, and systems are disclosed for attaching structures. One system includes: a device having a first structure attached to a second structure; a first polymer coupled to the first structure, wherein the first polymer has a first temperature profile and a first shape; and a second polymer coupled to the second structure. The second polymer has a second temperature profile and a second shape. The second shape interlocks the first shape. The first polymer and the second polymer secure the first structure to the second structure in response to the first polymer and the second polymer being in a first temperature range. The first polymer and the second polymer release the first structure from the second structure in response to the first polymer and the second polymer being in a second temperature range different from the first temperature range.
    Type: Application
    Filed: March 15, 2019
    Publication date: September 17, 2020
    Inventors: Bouziane Yebka, Philip John Jakes, Tin-Lup Wong
  • Publication number: 20200280032
    Abstract: One embodiment provides a device, including: a battery; and a tape strip comprising: a top surface; a bottom surface; and at least one elevatable section, wherein the at least one elevatable section comprises an area, situated in the top surface, containing an adhesive; wherein the top surface is composed of a non-adhesive substance on all portions of the top surface not associated with the area and wherein the bottom surface is composed of the adhesive on all portions of the bottom surface not associated with the at least one elevatable section; wherein the battery is adhered to the top surface of the tape strip via an adhesive connection between the area containing the adhesive and a bottom surface of the battery, wherein the tape strip is adhered to the device via another adhesive connection between the bottom surface of the tape strip and an inner portion of the device.
    Type: Application
    Filed: March 1, 2019
    Publication date: September 3, 2020
    Inventors: Bouziane Yebka, Tin-Lup Wong, Philip John Jakes, Jeremy Robert Carlson
  • Patent number: 10680450
    Abstract: Battery malfunction is limited by accelerating battery discharge once battery voltage reaches a low voltage threshold. This can be done programmatically and/or using a hardware arrangement that shorts the battery to ground when the low voltage threshold is reached.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: June 9, 2020
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Bouziane Yebka, Jeremy Robert Carlson, Tin-Lup Wong, Philip John Jakes
  • Publication number: 20200163227
    Abstract: A method of manufacturing an electronic board includes: preparing a substrate in which substrate-side solder parts are provided on electrodes; preparing a mounting sheet having a resin layer in which a plurality of voids is formed in accordance with positions of the electrodes; attaching the resin layer to at least one of a first electronic component and the substrate so that interfaces of the first electronic component or the substrate-side solder parts are located inside the respective voids; causing the interfaces and the substrate-side solder parts to face each other at positions of the respective voids; and melting the substrate-side solder parts by heating to join the interfaces and the electrodes.
    Type: Application
    Filed: January 10, 2019
    Publication date: May 21, 2020
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Tadashi Kosuga, Tin-Lup Wong
  • Publication number: 20200163230
    Abstract: A method of manufacturing an electronic board includes preparing a composite sheet having a composite layer that includes a solder part and a resin part, placing the composite layer on a substrate, placing a first electronic component on the composite layer, and heating the solder part up to a temperature at which the solder part of the composite layer is melted within a reflow furnace.
    Type: Application
    Filed: January 10, 2019
    Publication date: May 21, 2020
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Tadashi Kosuga, Tin-Lup Wong
  • Patent number: 10660216
    Abstract: A method of manufacturing an electronic board includes: preparing a substrate in which substrate-side solder parts are provided on electrodes; preparing a mounting sheet having a resin layer in which a plurality of voids is formed in accordance with positions of the electrodes; attaching the resin layer to at least one of a first electronic component and the substrate so that interfaces of the first electronic component or the substrate-side solder parts are located inside the respective voids; causing the interfaces and the substrate-side solder parts to face each other at positions of the respective voids; and melting the substrate-side solder parts by heating to join the interfaces and the electrodes.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: May 19, 2020
    Assignee: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Tadashi Kosuga, Tin-Lup Wong
  • Patent number: 10579319
    Abstract: One embodiment provides a method, including: detecting, using at least one sensor, a predetermined motion of an information handling device. An embodiment additionally receives, substantially during the predetermined motion and at an input location of the information handling device, activation input. An embodiment additionally activates, responsive to the receiving, a system associated with the information handling device. Other aspects are described and claimed.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: March 3, 2020
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Adam Jerome Cavenaugh, Kenneth Scott Seethaler, David W. Douglas, Tin-Lup Wong
  • Publication number: 20190369937
    Abstract: One embodiment provides a method, including: detecting, using at least one sensor, a predetermined motion of an information handling device; receiving, substantially during the predetermined motion and at an input location of the information handling device, activation input; and activating, responsive to the receiving, a system associated with the information handling device. Other aspects are described and claimed.
    Type: Application
    Filed: May 30, 2018
    Publication date: December 5, 2019
    Inventors: Adam Jerome Cavenaugh, Kenneth Scott Seethaler, David W. Douglas, Tin-Lup Wong
  • Patent number: 10474201
    Abstract: An electronic apparatus includes a base subassembly and a display subassembly. A hinge is rotatably coupled to the base subassembly and the display subassembly. The hinge allows the base subassembly and the display subassembly to rotate about an operating axis to change a rotational orientation of the display subassembly relative to the base subassembly. An elevation mechanism is operatively coupled to the hinge. The elevation mechanism includes a support tray disposed in the base subassembly that holds the mechanical elements. The elevation mechanism is responsive to torque that changes the rotational orientation of the display subassembly such that the elevation mechanism lifts the support tray when the display subassembly is moved to an upright position and lowers the support tray when the display subassembly is moved to a closed position.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: November 12, 2019
    Assignee: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Joseph Anthony Holung, Chihui Chen, Tin-Lup Wong, Bouziane Yebka
  • Publication number: 20190324497
    Abstract: An electronic apparatus includes a base subassembly and a display subassembly. A hinge is rotatably coupled to the base subassembly and the display subassembly. The hinge allows the base subassembly and the display subassembly to rotate about an operating axis to change a rotational orientation of the display subassembly relative to the base subassembly. An elevation mechanism is operatively coupled to the hinge. The elevation mechanism includes a support tray disposed in the base subassembly that holds the mechanical elements. The elevation mechanism is responsive to torque that changes the rotational orientation of the display subassembly such that the elevation mechanism lifts the support tray when the display subassembly is moved to an upright position and lowers the support tray when the display subassembly is moved to a closed position.
    Type: Application
    Filed: April 23, 2018
    Publication date: October 24, 2019
    Inventors: Joseph Anthony Holung, Chihui Chen, Tin-Lup Wong, Bouziane Yebka
  • Patent number: 10439418
    Abstract: In one aspect, a device includes a processor, at least one system component accessible to the processor, a battery accessible to the processor and that provides power to the processor and the at least one system component, a display accessible to the processor and powered by the battery, and storage accessible to the processor. The storage bears instructions executable by the processor to permit charging of the battery at a first rate during a first charging instance and to permit charging of the battery at a second rate during a second charging instance, where the second rate is slower than the first rate and the second charging instance is subsequent to the first charging instance. The instructions are also executable to provide an indication regarding the availability of again charging the battery at the first rate subsequent to the first charging instance.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: October 8, 2019
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Bouziane Yebka, Philip John Jakes, Tin-Lup Wong
  • Publication number: 20190305266
    Abstract: A device can include a processor; memory accessible by the processor; a battery bay that includes a first surface; a battery package disposed in the battery bay and operatively coupled to the processor, where the battery package includes a second surface; and materials disposed between the first surface and the second surface, where the materials include an adhesive and a thermoplastic.
    Type: Application
    Filed: March 29, 2018
    Publication date: October 3, 2019
    Inventors: Bouziane Yebka, Philip John Jakes, Tin-Lup Wong
  • Publication number: 20190305380
    Abstract: A device can include a processor; memory accessible by the processor; a housing that includes a battery bay that includes a first surface and a second, opposing surface; a battery package disposed in the battery bay and operatively coupled to the processor; and a resilient material disposed between the battery package and at least one of the first surface and the second surface of the battery bay.
    Type: Application
    Filed: March 29, 2018
    Publication date: October 3, 2019
    Inventors: Bouziane Yebka, Philip John Jakes, Tin-Lup Wong
  • Publication number: 20190305303
    Abstract: A battery package can include a battery that includes at least one lithium-ion cell; and a package material that includes at least one layer of fiberglass.
    Type: Application
    Filed: March 29, 2018
    Publication date: October 3, 2019
    Inventors: Bouziane Yebka, Joseph Anthony Holung, Philip John Jakes, Tin-Lup Wong
  • Patent number: 10389000
    Abstract: One embodiment provides an apparatus, including: a processor; a memory operatively coupled to the processor; and a battery pack supplying power to the processor and the memory; said battery pack comprising: a plurality of cells, wherein a current flow through the plurality of cells is arranged as a function of temperature of at least a portion of the battery pack. Other aspects are described and claimed.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: August 20, 2019
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Bouziane Yebka, Joseph Anthony Holung, Tin-Lup Wong, Philip John Jakes
  • Patent number: 10296054
    Abstract: An apparatus can include a processor; memory accessible by the processor; a first housing that includes a first link end; a second housing that includes a second link end; and a hinge assembly that includes a first link coupled to the first link end via a first axle, a second link coupled to the second link end via a second axle and an intermediate axle that operatively couples the first link and the second link where stop surfaces of the first and second links define a minimum radius of curvature of the hinge assembly.
    Type: Grant
    Filed: February 9, 2016
    Date of Patent: May 21, 2019
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Joseph Anthony Holung, Tin-Lup Wong, Bouziane Yebka, Joseph David Plunkett, Philip John Jakes