Abstract: Disclosed herein is a method of forming vias in electrical laminates comprising laminating a sheet having a layer comprising a crosslinkable polymer composition to a substrate wherein the crosslinkable polymer composition has a viscosity at lamination temperatures in the range of 200 Pa-s to 100,000 Pa-s, forming at least one via in the crosslinkable polymer layer by laser ablation; and after the forming of the at least one via, thermally curing the crosslinkable polymer layer. According to certain embodiments the cross linkable polymer composition has a viscosity at lamination temperature of at least 5000 Pa-s. This method yields good lamination results, good via profiles, and good desmear results when such compositions are used and the via is laser ablated before cure.

Abstract: Disclosed herein is a method of forming vias in electrical laminates comprising laminating a sheet having a layer comprising a crosslinkable polymer composition to a substrate wherein the crosslinkable polymer composition has a viscosity at lamination temperatures in the range of 200 Pa·s to 100,000 Pa·s, forming at least one via in the crosslinkable polymer layer by laser ablation; and after the forming of the at least one via, thermally curing the crosslinkable polymer layer. According to certain embodiments the cross linkable polymer composition has a viscosity at lamination temperature of at least 5000 Pa·s. This method yields good lamination results, good via profiles, and good desmear results when such compositions are used and the via is laser ablated before cure.

Abstract: The present invention provides a polymer composition comprising, in copolymerized form, one or more addition polymerizable arylcyclobutene monomers A having an alkyl, aryl, alkoxy, aryloxy, thioalkyl or thioaryl cyclobutene ring substituent, one or more aromatic addition polymerizable second monomers and one or more addition polymerizable monomer chosen from one or more nitrogen heterocycle containing third monomers, one or more addition polymerizable fourth monomer, such as n-butyl acrylate, or one or more of both monomers. The polymer compositions find use in making thin films or coatings having improved flexibility. Methods for making the polymer compositions are also provided.

Abstract: The present invention provides a low temperature polymerizing and curing polymer composition comprising, in copolymerized form, one or more addition polymerizable arylcyclobutene monomers A having as a cyclobutene ring substituent one or more groups chosen from alkyl; heteroatom containing alkyl; aryl; heteroatom containing aryl; or heteroatom containing aryloxy, one or more aromatic addition polymerizable second monomers, and one or more other addition polymerizable monomers chosen from an addition polymerizable nitrogen heterocycle containing third monomer, an addition polymerizable fourth monomer, or, preferably, both of the one or more third monomers and the one or more fourth monomers. The polymer compositions find use in making films or coatings for use in electronics applications.