Patents by Inventor Tina C. Zhong

Tina C. Zhong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11630691
    Abstract: Disclosed embodiments relate to an improved memory system architecture for multi-threaded processors. In one example, a system includes a system comprising a multi-threaded processor core (MTPC), the MTPC comprising: P pipelines, each to concurrently process T threads; a crossbar to communicatively couple the P pipelines; a memory for use by the P pipelines, a scheduler to optimize reduction operations by assigning multiple threads to generate results of commutative arithmetic operations, and then accumulate the generated results, and a memory controller (MC) to connect with external storage and other MTPCs, the MC further comprising at least one optimization selected from: an instruction set architecture including a dual-memory operation; a direct memory access (DMA) engine; a buffer to store multiple pending instruction cache requests; multiple channels across which to stripe memory requests; and a shadow-tag coherency management unit.
    Type: Grant
    Filed: August 24, 2021
    Date of Patent: April 18, 2023
    Assignee: Intel Corporation
    Inventors: Robert Pawlowski, Ankit More, Jason M. Howard, Joshua B. Fryman, Tina C. Zhong, Shaden Smith, Sowmya Pitchaimoorthy, Samkit Jain, Vincent Cave, Sriram Aananthakrishnan, Bharadwaj Krishnamurthy
  • Publication number: 20210389984
    Abstract: Disclosed embodiments relate to an improved memory system architecture for multi-threaded processors. In one example, a system includes a system comprising a multi-threaded processor core (MTPC), the MTPC comprising: P pipelines, each to concurrently process T threads; a crossbar to communicatively couple the P pipelines; a memory for use by the P pipelines, a scheduler to optimize reduction operations by assigning multiple threads to generate results of commutative arithmetic operations, and then accumulate the generated results, and a memory controller (MC) to connect with external storage and other MTPCs, the MC further comprising at least one optimization selected from: an instruction set architecture including a dual-memory operation; a direct memory access (DMA) engine; a buffer to store multiple pending instruction cache requests; multiple channels across which to stripe memory requests; and a shadow-tag coherency management unit.
    Type: Application
    Filed: August 24, 2021
    Publication date: December 16, 2021
    Inventors: Robert PAWLOWSKI, Ankit MORE, Jason M. HOWARD, Joshua B. FRYMAN, Tina C. ZHONG, Shaden SMITH, Sowmya PITCHAIMOORTHY, Samkit JAIN, Vincent CAVE, Sriram AANANTHAKRISHNAN, Bharadwaj KRISHNAMURTHY
  • Patent number: 11106494
    Abstract: Disclosed embodiments relate to an improved memory system architecture for multi-threaded processors. In one example, a system includes a system comprising a multi-threaded processor core (MTPC), the MTPC comprising: P pipelines, each to concurrently process T threads; a crossbar to communicatively couple the P pipelines; a memory for use by the P pipelines, a scheduler to optimize reduction operations by assigning multiple threads to generate results of commutative arithmetic operations, and then accumulate the generated results, and a memory controller (MC) to connect with external storage and other MTPCs, the MC further comprising at least one optimization selected from: an instruction set architecture including a dual-memory operation; a direct memory access (DMA) engine; a buffer to store multiple pending instruction cache requests; multiple channels across which to stripe memory requests; and a shadow-tag coherency management unit.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: August 31, 2021
    Assignee: Intel Corporation
    Inventors: Robert Pawlowski, Ankit More, Jason M. Howard, Joshua B. Fryman, Tina C. Zhong, Shaden Smith, Sowmya Pitchaimoorthy, Samkit Jain, Vincent Cave, Sriram Aananthakrishnan, Bharadwaj Krishnamurthy
  • Patent number: 10929330
    Abstract: Examples may include chipsets, processor circuits, and a system including chipsets and processor circuits. The chipsets and processor circuits can be coupled together via side band interconnect. The chipsets and processor circuits can be coupled together dynamically, during runtime using the side band interconnects. A chipset can send control signals for other chipsets and/or receive control signals from processor circuits via the side band links to dynamically coordinate the chipsets and processor circuits into systems.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: February 23, 2021
    Assignee: INTEL CORPORATION
    Inventors: Chih-Cheh Chen, Russell J. Wunderlich, Tina C. Zhong
  • Patent number: 10620966
    Abstract: Embodiments disclosed herein relate to coordinated system boot and reset flows and improve reliability, availability, and serviceability (RAS) among multiple chipsets. In an example, a system includes a master chipset having multiple interfaces, each interface to connect to one of a processor and a chipset, at least one processor connected to the master chipset, at least one non-master chipset connected to the master chipset, and a sideband messaging channel connecting the master chipset and the non-master chipsets, wherein the master chipset is to probe a subset of its multiple interfaces to discover a topology of connected processors and non-master chipsets, and use the sideband messaging channel to coordinate a synchronized boot flow.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: April 14, 2020
    Assignee: Intel Corporation
    Inventors: Tina C. Zhong, Russell J. Wunderlich, Chih-Cheh Chen, Malay Trivedi
  • Publication number: 20200104164
    Abstract: Disclosed embodiments relate to an improved memory system architecture for multi-threaded processors. In one example, a system includes a system comprising a multi-threaded processor core (MTPC), the MTPC comprising: P pipelines, each to concurrently process T threads; a crossbar to communicatively couple the P pipelines; a memory for use by the P pipelines, a scheduler to optimize reduction operations by assigning multiple threads to generate results of commutative arithmetic operations, and then accumulate the generated results, and a memory controller (MC) to connect with external storage and other MTPCs, the MC further comprising at least one optimization selected from: an instruction set architecture including a dual-memory operation; a direct memory access (DMA) engine; a buffer to store multiple pending instruction cache requests; multiple channels across which to stripe memory requests; and a shadow-tag coherency management unit.
    Type: Application
    Filed: September 28, 2018
    Publication date: April 2, 2020
    Inventors: Robert PAWLOWSKI, Ankit MORE, Jason M. HOWARD, Joshua B. FRYMAN, Tina C. ZHONG, Shaden SMITH, Sowmya PITCHAIMOORTHY, Samkit JAIN, Vincent CAVE, Sriram AANANTHAKRISHNAN, Bharadwaj KRISHNAMURTHY
  • Patent number: 10496565
    Abstract: Examples include an apparatus having a communications link bridge coupled to a plurality of processors to control connections between each of the plurality of processors and the apparatus; and a controller coupled to a memory over a memory interface to control access to the memory, the controller configured to, during system initialization, selectively bypass a token requirement for access to the memory for read requests by processors and allow multiple processors to read the memory concurrently.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: December 3, 2019
    Assignee: Intel Corporation
    Inventors: Anand K. Enamandram, Sivakumar Radhakrishnan, Jayasekhar Tholiyil, Tina C. Zhong, Malay Trivedi
  • Publication number: 20190095224
    Abstract: Embodiments disclosed herein relate to coordinated system boot and reset flows and improve reliability, availability, and serviceability (RAS) among multiple chipsets. In an example, a system includes a master chipset having multiple interfaces, each interface to connect to one of a processor and a chipset, at least one processor connected to the master chipset, at least one non-master chipset connected to the master chipset, and a sideband messaging channel connecting the master chipset and the non-master chipsets, wherein the master chipset is to probe a subset of its multiple interfaces to discover a topology of connected processors and non-master chipsets, and use the sideband messaging channel to coordinate a synchronized boot flow.
    Type: Application
    Filed: September 28, 2017
    Publication date: March 28, 2019
    Inventors: Tina C. Zhong, Russell J. Wunderlich, Chih-Cheh Chen, Malay Trivedi
  • Publication number: 20190042514
    Abstract: Examples include an apparatus having a communications link bridge coupled to a plurality of processors to control connections between each of the plurality of processors and the apparatus; and a controller coupled to a memory over a memory interface to control access to the memory, the controller configured to, during system initialization, selectively bypass a token requirement for access to the memory for read requests by processors and allow multiple processors to read the memory concurrently.
    Type: Application
    Filed: July 30, 2018
    Publication date: February 7, 2019
    Inventors: Anand K. ENAMANDRAM, Sivakumar RADHAKRISHNAN, Jayasekhar THOLIYIL, Tina C. ZHONG, Malay TRIVEDI
  • Publication number: 20190004989
    Abstract: Examples may include chipsets, processor circuits, and a system including chipsets and processor circuits. The chipsets and processor circuits can be coupled together via side band interconnect. The chipsets and processor circuits can be coupled together dynamically, during runtime using the side band interconnects. A chipset can send control signals for other chipsets and/or receive control signals from processor circuits via the side band links to dynamically coordinate the chipsets and processor circuits into systems.
    Type: Application
    Filed: June 30, 2017
    Publication date: January 3, 2019
    Applicant: INTEL CORPORATION
    Inventors: Chih-Cheh Chen, Russell J. Wunderlich, Tina C. Zhong
  • Patent number: 8799728
    Abstract: In one embodiment, the present invention includes a semiconductor die such as a system on a chip (SoC) that includes a logic analyzer with a built-in trace buffer to store information communicated between on-die agents at speed and to provide the information to an off-die agent at a slower speed. Other embodiments are described and claimed.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: August 5, 2014
    Assignee: Intel Corporation
    Inventors: Tina C. Zhong, Jason G. Sandri, Kenneth P. Griesser, Lori R. Borger
  • Publication number: 20140053026
    Abstract: In one embodiment, the present invention includes a semiconductor die such as a system on a chip (SoC) that includes a logic analyzer with a built-in trace buffer to store information communicated between on-die agents at speed and to provide the information to an off-die agent at a slower speed. Other embodiments are described and claimed.
    Type: Application
    Filed: October 25, 2013
    Publication date: February 20, 2014
    Inventors: Tina C. Zhong, Jason G. Sandri, Kenneth P. Griesser, Lori R. Borger
  • Patent number: 8589745
    Abstract: In one embodiment, the present invention includes a semiconductor die such as a system on a chip (SoC) that includes a logic analyzer with a built-in trace buffer to store information communicated between on-die agents at speed and to provide the information to an off-die agent at a slower speed. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: November 19, 2013
    Assignee: Intel Corporation
    Inventors: Tina C. Zhong, Jason G. Sandri, Kenneth P. Griesser, Lori R. Borger
  • Patent number: 8543776
    Abstract: In one embodiment, the present invention includes a semiconductor die such as a system on a chip (SoC) that includes a logic analyzer with a built-in trace buffer to store information communicated between on-die agents at speed and to provide the information to an off-die agent at a slower speed. Other embodiments are described and claimed.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: September 24, 2013
    Assignee: Intel Corporation
    Inventors: Tina C. Zhong, Jason G. Sandri, Kenneth P. Griesser, Lori R. Borger
  • Publication number: 20130103987
    Abstract: In one embodiment, the present invention includes a semiconductor die such as a system on a chip (SoC) that includes a logic analyzer with a built-in trace buffer to store information communicated between on-die agents at speed and to provide the information to an off-die agent at a slower speed. Other embodiments are described and claimed.
    Type: Application
    Filed: December 11, 2012
    Publication date: April 25, 2013
    Inventors: Tina C. Zhong, Jason G. Sandri, Kenneth P. Griesser, Lori R. Borger
  • Publication number: 20130054931
    Abstract: In one embodiment, the present invention includes a semiconductor die such as a system on a chip (SoC) that includes a logic analyzer with a built-in trace buffer to store information communicated between on-die agents at speed and to provide the information to an off-die agent at a slower speed. Other embodiments are described and claimed.
    Type: Application
    Filed: October 31, 2012
    Publication date: February 28, 2013
    Inventors: Tina C. Zhong, Jason G. Sandri, Kenneth P. Griesser, Lori R. Borger
  • Patent number: 8327198
    Abstract: In one embodiment, the present invention includes a semiconductor die such as a system on a chip (SoC) that includes a logic analyzer with a built-in trace buffer to store information communicated between on-die agents at speed and to provide the information to an off-die agent at a slower speed. Other embodiments are described and claimed.
    Type: Grant
    Filed: August 14, 2009
    Date of Patent: December 4, 2012
    Assignee: Intel Corporation
    Inventors: Tina C. Zhong, Jason G. Sandri, Kenneth P. Griesser, Lori R. Borger
  • Publication number: 20110041017
    Abstract: In one embodiment, the present invention includes a semiconductor die such as a system on a chip (SoC) that includes a logic analyzer with a built-in trace buffer to store information communicated between on-die agents at speed and to provide the information to an off-die agent at a slower speed. Other embodiments are described and claimed.
    Type: Application
    Filed: August 14, 2009
    Publication date: February 17, 2011
    Inventors: Tina C. Zhong, Jason G. Sandri, Kenneth P. Griesser, Lori R. Borger