Abstract: For effecting a uniform temperature distribution in a wafer in a process chamber, a support apparatus for a wafer is disclosed, comprising support means for supporting the wafer, temperature homogenization means arranged peripherally regarding to the wafer to provide a uniform thermal environment for the wafer, temperature homogenization means consisting of a plurality of segments, at least one of the plurality of segments being movable with regard to the other segments to enable supply and removal of the wafer to and from support means. By the fact that the at least one segment is movable with regard to the other segments, it can be elevated when introducing the wafer and can then be lowered during a process step at the wafer such that temperature homogenization means provides a uniform thermal environment for the wafer. Thereby it is made sure that in material depositioning processes an even layer thickness (uniformity) on the wafer will be achieved.