Abstract: An electrical assemblage reduces heat generated by components during operation. The assemblage has at least one heat-generating component, typically a resistor, and at least one heat-removing element electrically associated with the heat-generating component. Heat-removing element comprises a plurality of vias therein and is fixedly attached to a tip of the electrical components, typically on opposed charged ends. Heat absorbed by the heat-removing element is then transported to a heat sink, cooperatively associated therewith, for disposal. In an electrical assemblage, a circuit board contains multiple heat generating components each being associated with a heat-removing element of the invention.

Abstract: A densely packed electronic assemblage has a substrate medium for supporting at least one heat generating component and means for reducing the temperature of the at least one heat generating component. A heat sink cooperates with the at least one heat removing element for reducing heat of the heat generating component by absorbing heat from the at least one heat generating component.

Abstract: A densely packed electronic assemblage has a substrate media for supporting at least one heat generating component and means for reducing the temperature of the at least one heat generating component. A heat sink cooperates with the heat removing element for reducing heat of the at least one heat generating component by absorbing heat from the at least one heat generating component.

Abstract: A method removes heat from a densely packed electronic assemblage. Densely packed electronic assemblage has a substrate medium for supporting at least one heat generating component and means for reducing the temperature of the at least one heat generating component. A heat sink cooperates with the heat removing element for reducing heat of the heat generating component by absorbing heat from the heat generating component.

Abstract: A densely packed electronic assemblage has a substrate medium for supporting at least one heat generating component and means for reducing the temperature of the at least one heat generating component. A heat sink cooperates with the at least one heat removing element for reducing heat of the heat generating component by absorbing heat from the at least one heat generating component.

Abstract: A heat transporting electrical assemblage retained in a retaining unit transports heat between a heat sink and a thermal transport element in fluid communications with the heat sink. The thermal transport element is snugly arranged in a thermal gap between a coplanar thermal wall formed by a wall of both the heat sink and the electrical assemblage. Thermal transport element makes at least partial contact with a portion of the coplanar thermal wall and with a portion of the retaining unit thereby transporting heat from the hotter thermal wall to the cooler frame of the retaining unit.

Abstract: A densely packed electronic assemblage has a substrate medium for supporting at least one heat generating component and means for reducing the temperature of the at least one heat generating component. A heat sink cooperates with the at least one heat removing element for reducing heat of the heat generating component by absorbing heat from the at least one heat generating component.

Abstract: A densely packed electronic assemblage has a substrate medium for supporting at least one heat generating component and means for reducing the temperature of the at least one heat generating component. A heat sink cooperates with the at least one heat removing element for reducing heat of the heat generating component by absorbing heat from the at least one heat generating component.

Abstract: A method removes heat from a densely packed electronic assemblage. Densely packed electronic assemblage has a substrate medium for supporting at least one heat generating component and means for reducing the temperature of the at least one heat generating component. A heat sink cooperates with the heat removing element for reducing heat of the heat generating component by absorbing heat from the heat generating component.

Abstract: A heat transporting electrical assemblage retained in a retaining unit transports heat between a heat sink and a thermal transport element in fluid communications with the heat sink. The thermal transport element is snugly arranged in a thermal gap between a coplanar thermal wall formed by a wall of both the heat sink and the electrical assemblage. Thermal transport element makes at least partial contact with a portion of the coplanar thermal wall and with a portion of the retaining unit thereby transporting heat from the hotter thermal wall to the cooler frame of the retaining unit.

Abstract: A method of transporting heat from a heat dissipating electrical assemblage having a circuit board insertable in a card cage or retaining unit and at least one heat generating component mounted thereon. A heat sink is arranged in contact with the electrical assemblage and forms a coplanar wall spaced apart from the interior wall of the card cage. A thermal transport element is arranged in the thermal gap formed between the coplanar wall and the interior wall. The thermal transport element is at least in partial contact with the coplanar wall and interior wall thereby transporting heat from the hotter electrical assemblage to the cooler interior wall of the card cage.

Abstract: An electrical assemblage reduces heat generated by components during operation. The assemblage has at least one heat-generating component, typically a resistor, and at least one heat-removing element electrically associated with the heat-generating component. Heat-removing element comprises a plurality of vias therein and is fixedly attached to a tip of the electrical components, typically on opposed charged ends. Heat absorbed by the heat- removing element is then transported to a heat sink, cooperatively associated therewith, for disposal. In an electrical assemblage, a circuit board contains multiple heat generating components each being associated with a heat-removing element of the invention.

Abstract: A method of cooling heat-generating electrical components during service has a heat-removing element. Heat-removing element comprises a plurality of vias therein and is fixedly attached to a tip of the electrical components, typically on opposed charged ends. Heat absorbed by the heat-removing element is then transported to a heat sink, cooperatively associated therewith, for disposal. In an electrical assemblage, a circuit board contains multiple heat generating components each being associated with a heat-removing element of the invention.