Abstract: A communication system is disclosed. The communication system includes an active antenna set and a passive antenna set. The active antenna set includes at least one active antenna array, the at least one active antenna array is configured to transmit a first signal through at least one active beam group, and the at least one active beam group covers a first coverage area with a first coverage angle. The passive antenna set includes at least one passive antenna subset, the at least one passive antenna subset is configured to transmit a second signal through at least one passive beam group, and the at least one passive beam group covers a second coverage area with a second coverage angle. The first coverage area and the second coverage area do not overlap.

Abstract: A method for forming vertical gate all around transistors includes forming stack of semiconductor layers on a lower source/drain region. The stack of semiconductor layers includes a first layer, a second layer on the first layer, and a third layer on the second layer. The first and third layers have substantially identical compositions and are selectively etchable with respect to the second layer. The first and second layers can be selectively removed and replaced with inner spacers. The second layer can be selectively removed and replaced with a gate electrode.

Abstract: A motion information candidate list construction method includes: performing a first processing process on all neighboring image blocks of a current image block until a quantity of candidate motion information sets in a candidate motion information list is equal to a first preset value or all the neighboring image blocks are traversed; then traversing at least two extra to be selected motion information sets, and storing, in the candidate motion information list, an extra to be selected motion information set that satisfies a preset condition, until the quantity of candidate motion information sets in the candidate motion information list is equal to a preset quantity value or the extra to be selected motion information sets are traversedextra to be selected motion.

Abstract: A method for forming a gate all around transistor includes forming a plurality of semiconductor nanosheets. The method includes forming a cladding inner spacer between a source region of the transistor and a gate region of the transistor. The method includes forming sheet inner spacers between the semiconductor nanosheets in a separate deposition process from the cladding inner spacer.

Abstract: A coupler for a communication system, including: a first conductive trace including a first coupling section; a second conductive trace including a second coupling section configured to be adjacent to and spaced from the first coupling section to be galvanically isolated from and coupled to the first coupling section; and a first intermediate conductor provided between and spaced from the first coupling section and the second coupling section to be galvanically isolated from and coupled to both the first coupling section and the second coupling section, where an edge of the first coupling section adjacent to the second coupling section has a first recess, and the first intermediate conductor is provided at the first recess.

Abstract: Techniques for skin-condition visualization using machine learning. A color image depicting facial skin of a subject is retrieved. A monochromatic version of the color image is generated. Candidate instances of one or more skin conditions are segmented from the monochromatic version based on a segmentation threshold and using a machine learning model. A polarized version of the color image is generated, and based on the polarized version, the candidate instances are filtered. One or more simulation images are generated based on the filtered candidate instances.

Abstract: The present disclosure describes an apparatus with a local interconnect structure. The apparatus can include a first transistor, a second transistor, a first interconnect structure, a second interconnect structure, and a third interconnect structure. The local interconnect structure can be coupled to gate terminals of the first and second transistors and routed at a same interconnect level as reference metal lines coupled to ground and a power supply voltage. The first interconnect structure can be coupled to a source/drain terminal of the first transistor and routed above the local interconnect structure. The second interconnect structure can be coupled to a source/drain terminal of the second transistor and routed above the local interconnect structure. The third interconnect structure can be routed above the local interconnect structure and at a same interconnect level as the first and second interconnect structures.

Abstract: A high concentration antibody formulation comprising an antibody at a concentration of about 120-200 mg/ml, a histidine buffer at a concentration of about 5-15 mM, an amino acid at a concentration of about 1-1.5% (w/v), a tonicity modifier such as sodium chloride at a concentration of about 50-100 mM; and a non-ionic surfactant such as polysorbate 80 at a concentration of about 0.005-0.02% (w/v). In some instances, the high concentration antibody formulation may have a pH of about 5.5 to 6.5.

Abstract: A sub-assembly of a medicament delivery device is disclosed having a first part containing a first fastener and a second fastener; a second part of the medicament delivery device sub-assembly having a first counter fastener and a second counter fastener; and a space between the first part and the second part; wherein the space is configured to accommodate a medicament container; wherein the medicament delivery device sub-assembly can have a shipping configuration where the distally directed surface of the first part abuts the proximally directed surface of the second part so that the first part and the second part are detachably attached to each other and an assembled configuration where the fastener of the first part abuts the counter fastener of the second part so that the first part and the second part are undetachably attached to each other.

Abstract: A die bonding tool includes a bond head that secures a semiconductor die against a planar surface of the bond head, an actuator system that moves the bond head and the semiconductor die towards a surface of a target substrate, and at least one contact sensor configured to detect an initial contact between a first region of the semiconductor die and the surface of the target substrate, where in response to detecting the initial contact between the semiconductor die and the target substrate, the actuator tilts the planar surface of the bond head and the semiconductor die to bring a second region of the semiconductor die into contact with the surface of the target substrate and thereby provide improved contact between the semiconductor die and the target substrate and more effective bonding including instances where the planar surface of the bond head and the target substrate surface are not parallel.

Abstract: An image capturing optical lens system includes four lens elements, which are, in order from an object side to an image side along an optical path, a first lens element, a second lens element, a third lens element and a fourth lens element. The first lens element has an object-side surface being convex in a paraxial region thereof. The third lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The fourth lens element has negative refractive power.

Abstract: Disclosed herein are novel polyhydroxylated indolizidine and pyrrolizidine derivates and methods for using the same in the treatment of cancer. The present polyhydroxylated indolizidine and pyrrolizidine derivates has the structure of formula (I), wherein: X is O or b and c are independently an integral of 0 or and 1; R is selected from the group consisting of H, C1-6 alkyl, alkenyl, alkynyl, aryl, heteroaryl, cycloalkyl, cycloalkenyl, aralkyl, aralkenyl, aralkynyl, heteroaralkyl, heteroaralkenyl, beteroaralkynyl, heterocyclyl, alkoxy, aryloxy, and sulfonyl.

Abstract: An antenna structure includes a ground element, a feeding radiation element, a first radiation element, a second radiation element, a shorting radiation element, a third radiation element, and a fourth radiation element. The feeding radiation element has a feeding point. The first radiation element is coupled to the feeding radiation element. The second radiation element is coupled to the feeding radiation element. The second radiation element and the first radiation element substantially extend in opposite directions. The feeding radiation element is further coupled through the shorting radiation element to the ground element. The third radiation element is coupled to the ground element. The third radiation element is adjacent to the first radiation element. The fourth radiation element is coupled to the ground element. The fourth radiation element is adjacent to the second radiation element.

Abstract: A method for performing a test upon a flash memory module includes: performing data writing upon a plurality of first blocks of a first group in the flash memory module; reading the plurality of first blocks of the first group to determine whether there is any abnormal block in the plurality of first blocks and generating a first test result; after the plurality of first blocks are read, performing data writing upon a plurality of second blocks of a second group in the flash memory module; and reading the plurality of second blocks of the second group to determine whether there is any abnormal block in the plurality of second blocks and generating a second test result.

Abstract: The present disclosure provides methods, drug combinations and kits for treating, ameliorating, reversing and/or preventing a Helicobacter pylori (H. pylori) infection in a patient in need thereof.

Abstract: A method includes attaching an integrated circuit die adjacent to a first substrate, the integrated circuit die comprising: an active device in a second substrate; a pad adjacent to the second substrate; and a first dielectric layer adjacent to the second substrate, the first dielectric layer comprising a polyimide with an ester group; forming an encapsulant around the integrated circuit die; and removing the first dielectric layer.

Abstract: A stand adjustment device has a tripod-connecting member, a connecting seat, a distal clamping plate, a boom-connecting tube, a locking shaft, and a manual operating member. The connecting seat is rotatably located around the tripod-connecting member. The distal clamping plate is detachably attached to a side of the connecting seat. One end of the locking shaft is movably disposed in the boom-connecting tube. The boom is slidably mounted through the boom-connecting tube and the locking shaft. The locking shaft is slidably mounted through the boom-connecting tube, the distal clamping plate, and the connecting seat such that the boom-connecting tube is rotatable relative to the connecting seat. The manual operating member and the locking shaft are configured to clamp the boom-connecting tube, the distal clamping plate, and the connecting seat therebetween into a locked condition.

Abstract: Systems, apparatuses, and methods for multi-application optical sensing are provided. For example, an optical sensing apparatus can include a photodetector array, a first circuitry, and a second circuitry. The photodetector array includes a plurality of photodetectors, wherein a first subset of the plurality of photodetectors are configured as a first region for detecting a first optical signal, and a second subset of the plurality of photodetectors are configured as a second region for detecting a second optical signal. The first circuitry, coupled to the first region, is configured to perform a first function based on the first optical signal to output a first output result. The second circuitry, coupled to the second region, is configured to perform a second function based on the second optical signal to output a second output result.

Abstract: A package structure includes a semiconductor device, a molding compound, a first dielectric layer, and a through-via. The molding compound is in contact with a sidewall of the semiconductor device. The first dielectric layer is over the molding compound and the semiconductor device. The through-via is in the molding compound and the first dielectric layer. The through-via is a continuous element and in contact with the first dielectric layer.

Abstract: An embodiment is method including forming a first die package over a carrier substrate, the first die package comprising a first die, forming a first redistribution layer over and coupled to the first die, the first redistribution layer including one or more metal layers disposed in one or more dielectric layers, adhering a second die over the redistribution layer, laminating a first dielectric material over the second die and the first redistribution layer, forming first vias through the first dielectric material to the second die and forming second vias through the first dielectric material to the first redistribution layer, and forming a second redistribution layer over the first dielectric material and over and coupled to the first vias and the second vias.