Patents by Inventor TING-AN LIU

TING-AN LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240191744
    Abstract: The invention proposes a kind of bending bolt type anti-loosening nut, which relates to the technical field of mechanical fastening. It comprises an upper nut and a lower nut, the upper nut and the lower nut are stacked on the outside of the bolt and used to tightly connect the bolt to the connecting piece, the lower nut is arranged close to the connecting piece, the upper nut is arranged on the outer end surface of the lower nut; the adjacent end between the upper nut and lower nut is provided with an inclined surface, the inclined surface is inclined towards the interior of the upper nut, so that an inclined plane angle with deformation space between the upper nut and lower nut is formed; the invention achieves the effect of preventing nut loosening, is low in price, easy to manufacture, and suitable for small or miniature anti-loosening nuts.
    Type: Application
    Filed: November 30, 2023
    Publication date: June 13, 2024
    Inventors: Qing Liu, Yu Liu, Quanxi Liu, Xuyang Liu, Ting Gao, Ming Liu, Junfeng Liu, Meng Fan, Xiaohong Wang, Xiaoying Wang, Peng Wang, Wei Wang, Jie Fan, Jianyi Liu
  • Publication number: 20240194767
    Abstract: Semiconductor structures and methods of forming the same are provided. A method according to the present disclosure includes forming a stack of epitaxial layers over a substrate, forming a first fin-like structure and a second fin-like structure from the stack, forming an isolation feature between the first fin-like structure and the second fin-like structure, forming a cladding layer over the first fin-like structure and the second fin-like structure, conformally depositing a first dielectric layer over the cladding layer, depositing a second dielectric layer over the first dielectric layer, planarizing the first dielectric layer and the second dielectric layer until the cladding layer are exposed, performing an etch process to etch the second dielectric layer to form a helmet recess, performing a trimming process to trim the first dielectric layer to widen the helmet recess, and depositing a helmet feature in the widened helmet recess.
    Type: Application
    Filed: January 29, 2024
    Publication date: June 13, 2024
    Inventors: Jen-Hong Chang, Yuan-Ching Peng, Chung-Ting Ko, Kuo-Yi Chao, Chia-Cheng Chao, You-Ting Lin, Chih-Chung Chang, Yi-Hsiu Liu, Jiun-Ming Kuo, Sung-En Lin
  • Publication number: 20240194682
    Abstract: The present disclosure describes an apparatus with a local interconnect structure. The apparatus can include a first transistor, a second transistor, a first interconnect structure, a second interconnect structure, and a third interconnect structure. The local interconnect structure can be coupled to gate terminals of the first and second transistors and routed at a same interconnect level as reference metal lines coupled to ground and a power supply voltage. The first interconnect structure can be coupled to a source/drain terminal of the first transistor and routed above the local interconnect structure. The second interconnect structure can be coupled to a source/drain terminal of the second transistor and routed above the local interconnect structure. The third interconnect structure can be routed above the local interconnect structure and at a same interconnect level as the first and second interconnect structures.
    Type: Application
    Filed: January 22, 2024
    Publication date: June 13, 2024
    Applicant: Tiawan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Liang CHEN, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien WU, Charles Chew-Yuen Young, Hui-Ting Yang, Jiann-Tyng Tzeng, Ru-Gun Liu, Wei-Cheng Lin, Lei-Chun Chou, Wei-An Lai
  • Publication number: 20240190737
    Abstract: A moving bed biofilm reactor includes a tank body, a first tube, a second tube, a first guiding structure, a second guiding structure and a return pipe. A reaction zone is formed in the tank body by the first tube and the second tube. A three-phase separation zone is formed in the tank body by the first guiding structure and the second guiding structure. By using multi-layer horizontal water curtain disturbances formed by the first tube and the second tube, fluid contaminant could be well mixed in the reaction zone. Thereupon, gas desorption from bio carriers can be increased, the possibility for micro organisms to attach the bio carriers can be raised, the guiding of gas emission can be improved, and thus performance of the fluid treatment in the anaerobic biological process can be substantially enhanced.
    Type: Application
    Filed: April 19, 2023
    Publication date: June 13, 2024
    Inventors: YI-HONG LIU, CHENG-CHIN CHANG, TING-TING CHANG, KUAN-FOO CHANG
  • Publication number: 20240193787
    Abstract: Techniques for skin-condition visualization using machine learning. A color image depicting facial skin of a subject is retrieved. A monochromatic version of the color image is generated. Candidate instances of one or more skin conditions are segmented from the monochromatic version based on a segmentation threshold and using a machine learning model. A polarized version of the color image is generated, and based on the polarized version, the candidate instances are filtered. One or more simulation images are generated based on the filtered candidate instances.
    Type: Application
    Filed: December 13, 2022
    Publication date: June 13, 2024
    Inventors: Yuan Yuan DING, Yi Chen ZHONG, Jing ZHANG, Yang LIU, Ziyi JIANG, Ting Ting CAO
  • Patent number: 12009291
    Abstract: The present disclosure provides an electronic device including a substrate, an extending element, a conductive element and a first insulating layer. The substrate includes an edge. The extending element is disposed on the substrate and includes a first conductive layer and a semiconductor layer, the first conductive layer and the semiconductor layer are overlapped, and the semiconductor layer extends to the edge of the substrate. The conductive element is overlapped with the first conductive layer. The insulating layer is disposed between the conductive element and the extending element.
    Type: Grant
    Filed: March 16, 2023
    Date of Patent: June 11, 2024
    Assignee: InnoLux Corporation
    Inventors: Chiu-Yuan Huang, Pei-Chieh Chen, Yu-Ting Liu, Tsung-Yeh Ho
  • Patent number: 12009345
    Abstract: An embodiment is method including forming a first die package over a carrier substrate, the first die package comprising a first die, forming a first redistribution layer over and coupled to the first die, the first redistribution layer including one or more metal layers disposed in one or more dielectric layers, adhering a second die over the redistribution layer, laminating a first dielectric material over the second die and the first redistribution layer, forming first vias through the first dielectric material to the second die and forming second vias through the first dielectric material to the first redistribution layer, and forming a second redistribution layer over the first dielectric material and over and coupled to the first vias and the second vias.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: June 11, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng
  • Patent number: 12009464
    Abstract: A display device includes a pixel array substrate and a circuit board. The pixel array substrate has a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface and the second surface. Multiple bonding pads are located on the first surface. The circuit board is bent from above the first surface of the pixel array substrate to below the second surface. The circuit board is electrically connected to the bonding pads and includes a thermoplastic substrate. The thermoplastic substrate includes a third surface facing the pixel array substrate and a fourth surface opposite to the third surface. The thermoplastic substrate includes a first bend formed by thermoplastics.
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: June 11, 2024
    Assignee: Au Optronics Corporation
    Inventors: Wei-Fu Wu, Yu Tseng, Yu-Ting Liu, Chih-Cheng Kao, Tsai-Chi Yeh
  • Patent number: 12009322
    Abstract: A package structure includes a semiconductor device, a molding compound, a first dielectric layer, and a through-via. The molding compound is in contact with a sidewall of the semiconductor device. The first dielectric layer is over the molding compound and the semiconductor device. The through-via is in the molding compound and the first dielectric layer. The through-via is a continuous element and in contact with the first dielectric layer.
    Type: Grant
    Filed: February 13, 2022
    Date of Patent: June 11, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin, Chih-Hua Chen, Ming-Da Cheng, Ching-Hua Hsieh, Hao-Yi Tsai, Chung-Shi Liu
  • Patent number: 12006551
    Abstract: A miRNA marker for the treatment and/or diagnosis of Alzheimer's disease (AD), and the miRNA marker is a miRNA23 cluster. The miRNA23 cluster is used in the diagnosis and treatment of AD. The expression of the miRNA23 cluster is detected using primers for the microRNA marker through AD model cells, AD model animals and natural aging animals, and blood of AD patients, and it is found that the expression of the miRNA23 cluster is significantly reduced during the progression of AD, which reduces neuronal apoptosis by inhibiting the GSK-3?-mediated tau protein phosphorylation. Therefore, the miRNA23 cluster can be used as a novel biomarker and therapeutic target for the early, non-invasive diagnosis and treatment of AD.
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: June 11, 2024
    Assignee: Institute of Medicinal Biotechnology, Chinese Academy of Medical Sciences and Peking University
    Inventors: Rui Liu, Zhuorong Li, Li Zeng, Ting Sun, Mimin Liu, Junxia Zhang
  • Patent number: 12005050
    Abstract: The present disclosure provides methods, drug combinations and kits for treating, ameliorating, reversing and/or preventing a Helicobacter pylori (H. pylori) infection in a patient in need thereof.
    Type: Grant
    Filed: August 1, 2023
    Date of Patent: June 11, 2024
    Assignee: TENNOR THERAPEUTICS (SUZHOU) LIMITED
    Inventors: Zhenkun Ma, Guozhu Geng, Jing Chen, Yu Liu, Xiangyi Xu, Changlin Ai, Junlei Zhang, Ting Song, Shuangshuang Zhao
  • Patent number: 12002705
    Abstract: A method that forms a sacrificial fill material that can be selectively removed for forming a backside contact via for a transistor backside power rail. In some embodiments, the method may include performing an etching process on a substrate with an opening that is conformally coated with an oxide layer, wherein the etching process is an anisotropic dry etch process using a chlorine gas to remove the oxide layer from a field of the substrate and only from a bottom portion of the opening, and wherein the etching process forms a partial oxide spacer in the opening and increases a depth of the opening and epitaxially growing the sacrificial fill material in the opening by flowing a hydrogen chloride gas at a rate of approximately 60 sccm to approximately 90 sccm in a chamber pressure of approximately 1 Torr to approximately 100 Torr.
    Type: Grant
    Filed: February 14, 2022
    Date of Patent: June 4, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: He Ren, Houssam Lazkani, Raman Gaire, Mehul Naik, Kuan-Ting Liu
  • Patent number: 12000870
    Abstract: In one aspect, a sensor includes a first metal layer portion and a second metal layer portion separated by an insulator material; a conductive material layer in electrical contact with the first metal layer portion and the second metal layer portion; and a tunnel magnetoresistance (TMR) element positioned on and in electrical contact with the conductive material layer. A first current is configured to flow from the first metal layer portion, through the conductive material layer, to the second metal layer portion, and a second current is configured to flow from the first metal layer portion, through the conductive material layer, through the TMR element, and exiting through a top of the TMR element.
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: June 4, 2024
    Assignee: Allegro MicroSystems, LLC
    Inventors: Samridh Jaiswal, Paolo Campiglio, Sundar Chetlur, Maxim Klebanov, Yen Ting Liu
  • Publication number: 20240174810
    Abstract: A modified maleimide resin is provided. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by nitration and hydrogenation of dicyclopentadiene phenolic resin.
    Type: Application
    Filed: November 30, 2022
    Publication date: May 30, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Yu-Ting Liu, Hung-Yi Chang, Chi-Lin Chen
  • Publication number: 20240177503
    Abstract: The present invention discloses a port district sea line multiple vessel monitoring system and operating method thereof. Specifically, the port district sea line multiple vessel monitoring system comprises a processing module, a storage module, a camera and a floating object information receiving module. The port district sea line multiple vessel monitoring system may automatically recognize image classification of water surface object, therefore to determine operation of patrol mode, monitor mode or auxiliary recognizing mode for satisfying the needs of monitoring of port district sea line.
    Type: Application
    Filed: November 25, 2023
    Publication date: May 30, 2024
    Inventors: YU-TING PENG, YAN-SHENG SONG, CHIA-YU WU, CHIEN-HUNG LIU
  • Patent number: 11993542
    Abstract: Disclosed are a multifunctional cement hydration heat control material and a manufacturing method therefor. The cement hydration heat control material in is a comb polymer having three side chain structures, the three side chain structures are respectively a carboxyl group, a sugar alcohol group, and a polyether structure, and the main chain of the polymer is a carbon chain structure formed by free-radical polymerization of a double bond in a double bond compound monomer. The multifunctional cement hydration heat control material can achieve integration of cement hydration heat control performance, water reduction performance, and shrinkage reduction performance in a same molecule, can achieve control focusing on a performance by means of structural adjustment, does not need multi-component compounding during use, and is more convenient. The control material is non-toxic and water-soluble, can be made to have an appropriate concentration, and is convenient to use.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: May 28, 2024
    Assignees: SOBUTE NEW MATERIALS CO., LTD., BOTE NEW MATERIALS TAIZHOU CO., LTD., ZHENJIANG SOBUTE NEW MATERIAL CO., LTD.
    Inventors: Jiaping Liu, Rui Wang, Qian Tian, Wenbin Wang, Lei Li, Yujiang Wang, Hua Li, Ting Yao, Yang Chu
  • Patent number: 11992290
    Abstract: A method of controlling an intraoral scanner includes upon completion of lighting a first projection device, triggering a second projection device to initiate lighting, upon initiation of lighting the first projection device, transmitting a first camera trigger signal, a first delay circuit delaying the first camera trigger signal until completion of lighting the second projection device, and upon receiving the first camera trigger signal, a first camera and a second camera starting exposing images.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: May 28, 2024
    Assignee: Qisda Corporation
    Inventors: Yuan-Yu Hsiao, Ching-Ting Liu
  • Patent number: 11994065
    Abstract: An air supply device, a gas turbine system and a using method thereof are disclosed. In the air supply device, an air intake compartment includes a connection end; a combustion air intake filter is located in the air intake compartment and connected with the combustion air intake filter; a combustion air intake interface is located on a tail plate and is connected with the combustion air silencer; and a sound insulation turnover mechanism includes a sound insulation flap and a turnover mechanism, the air intake compartment includes a first bottom plate and the tail plate that is located at the connection end, the sound insulation flap is located at the connection end, and the turnover mechanism is connected with the sound insulation flap, and is configured to drive the sound insulation flap to rotate relative to the tail plate.
    Type: Grant
    Filed: March 4, 2022
    Date of Patent: May 28, 2024
    Assignee: Yantai Jereh Petroleum Equipment & Technologies Co., Ltd.
    Inventors: Ning Feng, Tao Kou, Ting Zhang, Yichao Mou, Libin Zhou, Xin Li, Xu Liu, Lili Wang, Jianglei Zou, Qiong Wu, Wanchun Zha, Cong Zhang
  • Publication number: 20240166734
    Abstract: Monoclonal antibodies that bind and inhibit the activity of human GDF15 are disclosed. The antibodies can be used to treat body weight loss, including cachexia, associated with the over-expression of human GDF15.
    Type: Application
    Filed: June 16, 2023
    Publication date: May 23, 2024
    Inventors: Lorena LERNER, Sandra ABBOTT, Ailin BAI, Ting CHEN, Maria Isabel CHIU, Qing LIU, Laura POLING, Nianjun TAO, Solly WEILER, Zhigang WENG, William M. WINSTON, JR., Jeno GYURIS
  • Publication number: 20240166788
    Abstract: A modified dicyclopentadiene-based resin is provided. The modified dicyclopentadiene-based resin is formed from a dicyclopentadiene-based resin having an amino group, a phenol and a polyoxymethylene by a cyclization reaction. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.
    Type: Application
    Filed: March 6, 2023
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Hung-Yi Chang, Yu-Ting Liu