Abstract: A method for fabricating a memory device includes: providing a substrate; forming a first dielectric layer over the substrate; forming a plurality of conductive layers and a plurality of dielectric layers alternately and horizontally disposed on the substrate; forming a channel column structure on the substrate and in the plurality of conductive layers and the plurality of dielectric layers, where a side wall of the channel column structure is in contact with the plurality of conductive layers; forming a second dielectric layer covering the first dielectric layer; and forming, in the first and second dielectric layers, a conductive column structure adjacent to the channel column structure and in contact with one of the plurality of conductive layers, where the conductive column structure includes a liner insulating layer as a shell layer.

Abstract: A method, computer program product, and computer system for public speaking guidance is provided. A processor retrieves speaker data regarding a speech made by a user. A processor separates the speaker data into one or more speaker modalities. A processor extracts one or more speaker features from the speaker data for the one or more speaker modalities. A processor generates a performance classification based on the one or more speaker features. A processor sends to the user guidance regarding the speech based on the performance classification.

Abstract: A computer-implemented method according to one embodiment includes running an initial network on a plurality of images to detect actors pictured therein and body joints of the detected actors. The method further includes running fully-connected networks in parallel, one fully-connected network for each of the detected actors, to reconstruct complete three-dimensional poses of the actors. Sequential model fitting is performed on the plurality of images. The sequential model fitting is based on results of running the initial network and the fully-connected networks. The method further includes determining, based on the sequential model fitting, a locational position for a camera in which the camera has a view of a possible point of collision of two or more of the actors. The camera is instructed to be positioned in the locational position.

Abstract: A method for manufacturing a touch panel includes the following steps. A touch-sensing unit is provided. A decoration layer is formed on the touch-sensing unit. And, a cover lens is disposed on the decoration layer. A touch panel is also provided. A touch panel includes a cover lens, a touch-sensing unit, and a first decoration layer separating the cover lens from the touch-sensing unit, wherein the first decoration layer and the touch-sensing unit have a first adhesive force per unit area therebetween, the first decoration layer and the cover lens have a second adhesive force per unit area therebetween, and the first adhesive force per unit area is greater than the second adhesive force per unit area.

Abstract: Configurations of a touch panel having a buffer layer and a manufacturing method thereof are disclosed. The proposed touch panel has a touch sensor, wherein the touch sensor includes a sensing electrode, a buffer layer configured on the sensing electrode, and a metal signal line configured on the buffer layer.

Abstract: A touch apparatus is disclosed. The touch apparatus includes a touch panel; an anti-shatter film having a first surface and a second surface opposite to the first surface, wherein the first surface is attached below the touch panel; a display panel having a third surface; and a pressure sensitive adhesive disposed on one of the second surface and the third surface, wherein the display panel is attached to the second surface through the pressure sensitive adhesive.

Abstract: A bonding structure includes a first substrate, a second substrate, a printed circuit board (PCB) disposed between the first substrate and the second substrate, anisotropic conductive adhesive (ACA) and conductive wires. The ACA is disposed between second connecting bonding pads of the first substrate and second bonding pads of the second substrate. First bonding pads of the first substrate are bonded with corresponding first matching bonding pads of the PCB, and second duplicated bonding pads of the first substrate are bonded with second matching bonding pads of the PCB, wherein the first and the second matching bonding pads are disposed on the same surface of the PCB. The second connecting bonding pads and the corresponding second duplicated bonding pads are electrically coupled via the conductive wires.

Abstract: A method for manufacturing a touch panel includes the following steps. A touch-sensing unit is provided. A decoration layer is formed on the touch-sensing unit. And, a cover lens is disposed on the decoration layer. A touch panel is also provided. A touch panel includes a cover lens, a touch-sensing unit, and a first decoration layer separating the cover lens from the touch-sensing unit, wherein the first decoration layer and the touch-sensing unit have a first adhesive force per unit area therebetween, the first decoration layer and the cover lens have a second adhesive force per unit area therebetween, and the first adhesive force per unit area is greater than the second adhesive force per unit area.

Abstract: A method of increasing strength of a panel edge includes providing a panel having a lateral surface treated by plasma. An elastic material is provided, photoinitiator is added therein, and the elastic material is then liquefied by heating. Subsequently, the liquefied elastic material is sprayed on the lateral surface, and is then cured to result in a protective layer bonded on the lateral surface.

Abstract: A printing method for a touch panel device is disclosed. The method includes the following steps: firstly, providing a substrate; then, printing a first shielding layer on a surface of the substrate; and afterwards, printing a second shielding layer on the first shielding layer, wherein the second shielding layer covers the first shielding layer, and a side surface of the second shielding layer is connected to the surface of the substrate.

Abstract: A touch device includes a top housing and bottom housing, which define an accommodating space. A touch panel has a lateral surface abutting the top housing. A hollow frame crosses adjacency between a top surface of the touch panel and a top surface of the top housing.

Abstract: A capacitive touch panel including a transparent substrate, a plurality of first metal wires, an insulation layer, a plurality of first sensing units, a plurality of second sensing units and a plurality of second metal wires are provided. The transparent substrate has a substrate surface on which the first metal wires, the first sensing units and the second sensing units are formed. The insulation layer can cover a portion of each first metal wire, which is connected to two of the first sensing units, wherein each second metal wire is connected to two of the second sensing units.

Abstract: A capacitive touch panel is provided. The capacitive touch panel includes a transparent substrate, a plurality of first sensing wires, a plurality of second sensing units, an insulation layer, a plurality of second sensing wires and a plurality of fourth sensing units. The transparent substrate has a substrate surface on which the insulation layer is disposed. The insulation layer covers the first sensing wires and the second sensing wires. A plurality of third sensing units of the second sensing wires is disposed on the insulation layer along a second axial direction. The fourth sensing units are disposed on the insulation layer along a first axial direction. The third sensing units and the fourth sensing units are adjacently arranged.

Abstract: A capacitive touch panel including a transparent substrate, a plurality of first sensing wires, a plurality of second sensing wires and an insulation layer is provided. The transparent substrate has a substrate surface. The first sensing wires are disposed on the substrate surface along a first axis direction. The second sensing wires include a plurality of bridge wires and a plurality of sensing units. The sensing units are disposed on the substrate surface along the second axis direction. The insulation layer is disposed on the substrate surface, covers the first sensing wires, and has a plurality of through holes. The through holes correspondingly expose the sensing units. Each bridge wire strides the insulation layer to electrically connect two of the sensing units.