Abstract: Provided are a package structure having stacked semiconductor dies with wavy sidewalls and a method of forming the same. The package structure includes: a first die and a second die bonded together; a first encapsulant laterally encapsulating the first die; and a second encapsulant laterally encapsulating the second die, wherein a second interface of the second die in contact with the second encapsulant is a wavy interface in a cross-sectional plane.

Abstract: A multi-shot moulding part structure includes a first structural part, an ink decoration layer, and a second structural part. The first structural part has a first area surface, a second area surface, and a joining surface located on the second area surface. The joining surface is non-parallel to the second area surface. The ink decoration layer is spread on the first area surface and the second area surface, but not on the joining surface. The second structural part is combined with the first structural part and covers the second area surface. The second structural part touches the joining surface. By the second structural part touching the joining surface of the first structural part that is not coated with the ink decoration layer, the structural bonding strength between the first structural part and the second structural part is enhanced.

Abstract: Methods for fabricating an integrated circuit (IC) device with a protection liner between doped semiconductor regions are provided. An example IC device includes a channel material having a first face and a second face opposite the first face, a first doped region and a second doped region in the channel material, extending from the second face towards the first face by a first distance; and an insulator structure in a portion of the channel material between the first and second doped regions, the insulator structure extending from the second face towards the first face by a second distance greater than the first distance. The insulator structure includes a first portion between the second face and the first distance and a second portion between first distance and the second distance. The insulator structure includes a liner material on sidewalls of the first portion but absent on sidewalls of the second portion.

Abstract: Embodiments disclosed herein include transistors and methods of forming transistors. In an embodiment, a transistor comprises a source, a drain, and a pair of spacers between the source and the drain. In an embodiment, a semiconductor channel is between the source and the drain, where the semiconductor channel passes through the pair of spacers. In an embodiment, the semiconductor channel has a first thickness within the pair of spacers and a second thickness between the pair of spacers, where the second thickness is less than the first thickness. In an embodiment, the transistor further comprises a gate stack over the semiconductor channel between the pair of spacers.

Abstract: Techniques are provided herein to form semiconductor devices having epitaxial growth laterally extending between inner spacer structures to mitigate issues caused by the inner spacer structures either being too thick or too thin. A directional etch is performed along the side of a multilayer fin to create a relatively narrow opening for a source or drain region to increase the usable fin space for forming the inner spacer structures. After the inner spacer structures are formed around ends of the semiconductor layers within the fin, the exposed ends of the semiconductor layers are laterally recessed inwards from the outermost sidewalls of the inner spacer structures. Accordingly, the epitaxial source or drain region is grown from the recessed semiconductor ends and thus fills in the recessed regions between the spacer structures.

Abstract: Fin trim plug structures with metal for imparting channel stress are described. In an example, an integrated circuit structure includes a fin including silicon, the fin having a top and sidewalls, wherein the top has a longest dimension along a direction. A first isolation structure is over a first end of the fin. A gate structure including a gate electrode is over the top of and laterally adjacent to the sidewalls of a region of the fin. The gate structure is spaced apart from the first isolation structure along the direction. A second isolation structure is over a second end of the fin, the second end opposite the first end, the second isolation structure spaced apart from the gate structure along the direction. The first isolation structure and the second isolation structure both include a dielectric material laterally surrounding an isolated metal structure.

Abstract: Techniques are provided herein to form semiconductor devices that include a layer across an upper surface of a dielectric fill between devices and configured to prevent or otherwise reduce recessing of the dielectric fill. In this manner, the layer may be referred to as a barrier layer or recess-inhibiting layer. The semiconductor regions of the devices extend above a subfin region that may be native to the substrate. These subfin regions are separated from one another using a dielectric fill that acts as a shallow trench isolation (STI) structure to electrically isolate devices from one another. A barrier layer is formed over the dielectric fill early in the fabrication process to prevent or otherwise reduce the dielectric fill from recessing during subsequent processing. The layer may include oxygen and a metal, such as aluminum.

Abstract: A metal mesh sensing module of a touch panel and a manufacturing method thereof are disclosed. The metal mesh sensing module includes a transparent substrate and a metal mesh sensing circuit. The transparent substrate has at least a surface and plural referring nodes disposed on the surface and arranged in regular order. The metal mesh sensing circuit is disposed on the surface and has plural mesh nodes, plural turning points and plural metallic lines. Each mesh node is defined relative to the corresponding referring node and disposed on the surface. Each turning point is randomly selected from a shiftable zone having the center aligned to a point located between two adjacent referring nodes. Each mesh node is connected to the adjacent turning points on the surface, so as to form the metal mesh sensing circuit configured as a visible touch zone.

Abstract: A metal mesh sensing module of a touch panel and a manufacturing method thereof are disclosed. Plural first referring nodes and plural first referring points are defined on a first surface. Plural second referring nodes and plural second referring points are defined on a second surface. The first and second referring nodes are arranged in regular order and have their vertical projections in staggered arrangement. The first referring point and second referring point are located at the midpoint between two adjacent first referring nodes and second referring nodes respectively and have the same vertical projections. A shiftable zone is defined for obtaining plural first turning points, wherein each first turning point is randomly selected from the shiftable zone having the center aligned to the corresponding first referring point. A first mesh pattern is obtained by connecting each first referring node to adjacent first turning points.

Abstract: A touch display apparatus with a transparent antenna is disclosed. The touch display apparatus including a cover glass, a display module, and a touch module. The touch module is disposed between the cover glass and the display module. The touch module includes a transparent substrate, a metal mesh touch sensor, and an antenna. The metal mesh touch sensor is disposed on at least one surface of the transparent substrate and configured to form a viewable area, wherein the viewable area comprises at least an overlapping dummy area free of a vertical projection of the metal mesh touch sensor. The antenna is disposed on the at least one surface of the transparent substrate, and at least portion of the antenna is located in the overlapping dummy area, wherein the antenna and the metal mesh touch sensor are insulated from each other.

Abstract: A touch panel with an antenna structure is provided. The touch panel includes a transparent substrate, a touch sensing circuit, plural metal traces, a grounding part, an insulation film, and an antenna radiation unit. The transparent substrate is divided into a visible touch zone and a periphery wiring zone around the visible touch zone. The touch sensing circuit is included in the visible touch zone. The plural metal traces are included in the periphery wiring zone. The grounding part is included in the periphery wiring zone. A bottom surface of the insulation film is connected with the periphery wiring zone of the transparent substrate. The antenna radiation unit is disposed on a top surface of the insulation film. At least a portion of the antenna radiation unit is disposed over the grounding part, and electrically connected with the grounding part.

Abstract: A touch panel includes a transparent substrate, a sensing electrode and plural metallic traces. The transparent substrate includes a visible touch zone and a periphery wiring zone. A first side and a second side of the visible touch zone are in parallel with a first axis and a second axis, respectively. The sensing electrode is disposed on the transparent substrate and included in the visible touch zone. The sensing electrode includes plural first metal lines and plural second metal lines. The plural first metal lines are separated from each other. The plural second metal lines are separated from each other. The plural first metal lines and the plural second metal lines are non-linear and tilted relative to the first axis and the second axis. The plural metallic traces are included in the periphery wiring zone and electrically connected with the sensing electrode.

Abstract: Disclosure is related to a thermoelectric power generator. The generator essentially includes a thermoelectric thin-film element which is such as a thin film used to generate voltages according to a temperature difference. The output electric signals are converted to energy stored in an energy storage element. An output circuit is included to output power. In an exemplary embodiment, the thermoelectric power generator has a contact interface for sensing external temperate. The thermoelectric thin-film element is enabled to output voltages when temperature difference is induced. The generator further has a switch, which is used to control if the power is output. The output element is such as a light-emitting element.

Abstract: A touch panel includes a flexible transparent substrate, a metal electrode and plural metal traces. The flexible transparent substrate includes a main segment, a first lateral segment, a second lateral segment, a first bent part and a second bent part. The metal electrode is disposed on a first surface of the flexible transparent substrate and distributed on the main segment, the first bent part and the second bent part, wherein a transparent touch zone is defined by the metal electrode. The plural metal traces are disposed over the flexible transparent substrate and distributed on a peripheral region of the transparent touch zone. The plural metal traces are extended to the main segment, the first bent part, the second bent part, the first lateral segment and the second lateral segment so as to be electrically connected with the metal electrode.

Abstract: Disclosure is to a thin-film coil component, and a charging apparatus. The thin-film coil is composed of spiral thin-film winding. Within the spiral windings, a gap exists between adjacent spiral structure, A first thin-film winding forms a first connection port for connecting external circuit at an external end, and has a first winding terminal at an internal end. An induced electric field can be formed by supplying electric current via the connection port. Further, a thin-film coil component is made when two thin-film coils with the same spiral direction are fabricated on two opposite surfaces of a substrate. An adhesive layer mixed with Ferromagnetic material is used to combine coils and the substrate. An induced electric field is also created when powering this thin-film coil component. Assembly of one or more thin-film coil components can make the charging apparatus used to electrically charge an electronic device which includes a device-end thin-film coil component.

Abstract: Provided is an electrode structure for use with a capacitive touch panel to enhance capacitance sensing capability thereof. The electrode structure includes electrically conductive fine lines each forming fine line portions, sensing portions, and cross portions. The fine line portions, the sensing portions, and the cross portions together form a latticed pattern. The sensing portions are each disposed between two adjacent ones of the cross portions. Two ends of each said sensing portion are connected to two said cross portions through two fine line portions, respectively. The sensing portions each have a geometric configuration with a short axis and a long axis. The long axis extends in the direction of a corresponding one of the fine line portions. The short axis is of a width larger than a corresponding one of the fine line portions.

Abstract: A capacitive sensor applies to a capacitive touch panel and includes a plurality of first electrodes, a plurality of second electrodes, and a plurality of virtual electrodes. The first electrodes each have a first wire portion. The second electrodes are disposed beneath and insulated from the first electrodes, and cross the first electrodes. The second electrodes each have a second wire portion. The virtual electrodes are each disposed between and spaced from two corresponding ones of the first electrodes. The virtual electrodes each include a plurality of continuous portions and a plurality of interrupted portions. The interrupted portions each overlap a corresponding one of the second wire portions of the second electrodes. The width of each of the interrupted portions is less than or equal to the width of the corresponding second wire portion.

Abstract: An electrode of capacitive touch panel sensor includes a plurality of conductive portions, the conductive portions forming a mesh structure. Each of the conductive portions has four curved wires defining a closed region, and each opposite pair of the curved wires has the same opening orientation.

Abstract: Provided is an electrode structure for use with a capacitive touch panel to enhance capacitance sensing capability thereof The electrode structure includes electrically conductive fine lines each forming fine line portions, sensing portions, and cross portions. The fine line portions, the sensing portions, and the cross portions together form a latticed pattern. The sensing portions are each disposed between two adjacent ones of the cross portions. Two ends of each said sensing portion are connected to two said cross portions through two fine line portions, respectively. The sensing portions each have a geometric configuration with a short axis and a long axis. The long axis extends in the direction of a corresponding one of the fine line portions. The short axis is of a width larger than a corresponding one of the fine line portions.

Abstract: A 3D image generating device is provided and includes: a lenticular plate storage chamber for storing a plurality of lenticular plates; a picture-taking device for taking a picture of an object to generate an object image; an image processing unit for capturing and processing the object image of the object to generate a front-view object image and combining the front-view object image with a rear-view image to generate a synthetic 3D image; a lenticular plate conveying unit for moving the lenticular plates inside the lenticular plate storage chamber to a printing device; a memory unit for storing at least one rear-view image; the printing device for printing the synthetic 3D image on a flat surface of the lenticular plate; and a controlling unit for controlling operation of the picture-taking device, the image processing unit, the memory unit, the printing device, and the lenticular plate conveying unit.