Abstract: A piezoelectric speaker includes: a peripheral rectangular frame having four sides; a central rectangular frame disposed on the peripheral rectangular frame, wherein the central rectangular frame has four corners and four sides, and the four corners are connected to the four sides of the peripheral rectangular frame; four central triangular cantilevers disposed within the central rectangular frame, wherein each of the central triangular cantilevers has a vibrating end and a fixed end opposite to the vibrating end, and each of the fixed ends of the central triangular cantilevers is connected to the four sides of the central rectangular frame, the four vibrating ends of the four central triangular cantilevers are close to each other, and the four central triangular cantilevers have different dimensions of their respective areas defined within the central rectangular frame; and four peripheral triangular cantilevers disposed between the peripheral rectangular frame and the central rectangular frame.

Abstract: The present invention provides a piezoelectric speaker, including: a frame; a cantilever plate actuator disposed on the frame; a spring connected to the frame and the cantilever plate actuator; and a central diaphragm connected to the spring, wherein when the cantilever plate actuator vibrates, the central diaphragm vibrates with the spring.

Abstract: A package structure is provided. The package structure comprises a package substrate, an electronic device, a thermal interface material (TIM), a lid and an insulating encapsulant. The electronic device is disposed on and electrically connected to the package substrate. The TIM is disposed on the electronic device. The lid is disposed on the TIM. The insulating encapsulant is disposed on the package substrate and laterally encapsulates the electronic device and the TIM. A lateral dimension of the TIM is greater than a lateral dimension of the electronic device.

Abstract: The present invention relates to an LC medium comprising two or more polymerizable compounds, at least one of which contains a substituent comprising a tertiary OH group, to its use for optical, electro-optical and electronic purposes, in particular in LC displays, especially in LC displays of the PSA (polymer sustained alignment) or SA (self-aligning) mode, to an LC display of the PSA or SA mode comprising the LC medium, and to a process of manufacturing the LC display using the LC medium, especially an energy-saving LC display and energy-saving LC display production process.

Abstract: This application describes method and apparatus for HDR+ using M×N-cell sensors. An example apparatus includes a plurality of pixel groups, each pixel group having M×N pixels configured with color filters of a same color such that the M×N pixels in each pixel group capture a same color. M and N are integers greater than one, and each pixel is represented by a first number of bits. The example apparatus further include one or more processors configured to: capture, through the plurality of pixel groups, a plurality of frames of a scene using a short-exposure setting; merge the plurality of frames into an HDR image; and perform tone mapping on the HDR image to reduce a dynamic range of the super-pixels of the HDR image into a low dynamic range (LDR) image, wherein each pixel in the LDR image is represented with the first number of bits.

Abstract: A method includes cropping a plurality of images from a layout of an integrated circuit, generating a first plurality of hash values, each from one of the plurality of images, loading a second plurality of hash values stored in a hotspot library, and comparing each of the first plurality of hash values with each of the second plurality of hash values. The step of comparing includes calculating a similarity value between the each of the first plurality of hash values and the each of the second plurality of hash values. The method further includes comparing the similarity value with a pre-determined threshold similarity value, and in response to a result that the similarity value is greater than the pre-determined threshold similarity value, recording a position of a corresponding image that has the result. The position is the position of the corresponding image in the layout.

Abstract: A method and a device for detecting a placement of wafers in a wafer cassette are provided. The wafer cassette includes a plurality of receiving grooves. The receiving grooves hold and store the wafers. Light is emitted through the wafer cassette. The light passes through the gaps and is imaged, and the image is captured. Characteristic information is extracted from the image. The extracted characteristic information is compared with standard characteristic information of a preset image, and whether a placement of all the wafers in the wafer cassette is qualified and satisfactory is determined according to a compared result.

Abstract: This application describes systems and methods for detecting depth in deep trench isolation with semiconductor devices using test key transistors. An method comprises: capturing, by an image sensor, an image; generating a plurality of chrominance channels by converting the image into luminance-chrominance space; performing homogeneous region segmentation on the plurality of chrominance channels to generate one or more regions of interest in the plurality of chrominance channels; and projecting the regions of interest onto eigen-illuminant images to determine gray color pixels on the image, wherein the eigen-illuminant images are generated via performing a machine learning algorithm on a training set of images captured by the image sensor.

Abstract: A method for detecting from images correct placement and function, or incorrect placement and function, of a clip of a transportation box of wafers in sterile or similar conditions obtains an image template comprising features of clip and obtains a first detection image of a working clip. An object region focusing on the imaged clip in the first detection image is determined according to the image template. Part of the working image is selected as a first preset location. The part of the image is masked to obtain a second detection image, the masking obscures the background region of the part of the image but not the clip-object region, and displays the unobscured clip-object region. The second detection image is input into a trained neural network model to determine whether the clip is in sealed or unsealed state. An electronic device and a non-transitory storage medium are also disclosed.

Abstract: A liquid-crystal (LC) medium which is based on a mixture of polar compounds and is substantially dielectrically neutral, its use for optical, electro-optical and electronic purposes, in particular as optical retarder or optical compensator in LC displays, an optical retarder or optical compensator containing the LC medium, an optical, electrooptical or electronic device containing the optical retarder or optical compensator, and a process of manufacturing the optical retarder or optical compensator.

Abstract: A semiconductor device includes a circuit substrate, a semiconductor package, and a package frame. The semiconductor package is disposed on the circuit substrate. The package frame is disposed over the circuit substrate. The package frame encircles the semiconductor package. The semiconductor package has a first surface facing the circuit substrate and a second surface opposite to the first surface. The package frame leaves exposed at least a portion of the second surface of the semiconductor package. The package frame forms a cavity, which cavity encircles the semiconductor package.

Abstract: A semiconductor package includes a leadframe having a die pad and lead terminals along a perimeter of the die pad, and an IC die mounted on the die pad. The IC die includes I/O pads disposed on an active front surface of the IC die. The IC die includes a semiconductor substrate, a circuit block fabricated on the semiconductor substrate, and a through substrate via (TSV) extending through a thickness of the semiconductor substrate. Bond wires extend between the I/O pads and the lead terminals, respectively. A molding compound encapsulates the IC die, the bond wires, and the leadframe.

Abstract: This application describes method and apparatus for HDR+ using M×N-cell sensors. An example apparatus includes a plurality of pixel groups, each pixel group having M×N pixels configured with color filters of a same color such that the M×N pixels in each pixel group capture a same color. M and N are integers greater than one, and each pixel is represented by a first number of bits.

Abstract: A method includes cropping a plurality of images from a layout of an integrated circuit, generating a first plurality of hash values, each from one of the plurality of images, loading a second plurality of hash values stored in a hotspot library, and comparing each of the first plurality of hash values with each of the second plurality of hash values. The step of comparing includes calculating a similarity value between the each of the first plurality of hash values and the each of the second plurality of hash values. The method further includes comparing the similarity value with a pre-determined threshold similarity value, and in response to a result that the similarity value is greater than the pre-determined threshold similarity value, recording a position of a corresponding image that has the result. The position is the position of the corresponding image in the layout.

Abstract: An embodiment device includes a first source/drain region over a semiconductor substrate and a dummy fin adjacent the first source/drain region. The dummy fin comprising: a first portion comprising a first film and a second portion over the first portion, wherein the second portion comprises: a second film; and a third film. The third film is between the first film and the second film, and the third film is made of a different material than the first film and the second film. A width of the second portion is less than a width of the first portion. The device further comprises a gate stack along sidewalls of the dummy fin.

Abstract: A method includes forming isolation regions extending into a semiconductor substrate, wherein semiconductor strips are located between the isolation regions, and forming a dielectric dummy strip between the isolation regions, recessing the isolation regions. Some portions of the semiconductor strips protrude higher than top surfaces of the recessed isolation regions to form protruding semiconductor fins, and a portion of the dielectric dummy strip protrudes higher than the top surfaces of the recessed isolation regions to form a dielectric dummy fin. The method further includes etching the dielectric dummy fin so that a top width of the dielectric dummy fin is smaller than a bottom width of the dielectric dummy fin. A gate stack is formed on top surfaces and sidewalls of the protruding semiconductor fins and the dielectric dummy fin.

Abstract: A method includes forming isolation regions extending into a semiconductor substrate, wherein semiconductor strips are located between the isolation regions, and forming a dielectric dummy strip between the isolation regions, recessing the isolation regions. Some portions of the semiconductor strips protrude higher than top surfaces of the recessed isolation regions to form protruding semiconductor fins, and a portion of the dielectric dummy strip protrudes higher than the top surfaces of the recessed isolation regions to form a dielectric dummy fin. The method further includes etching the dielectric dummy fin so that a top width of the dielectric dummy fin is smaller than a bottom width of the dielectric dummy fin. A gate stack is formed on top surfaces and sidewalls of the protruding semiconductor fins and the dielectric dummy fin.

Abstract: A positioning system based on street view information for a vehicle is provided. The positioning system includes a database, an image capturing module and a processing circuit. The database includes information of a plurality of identifiable objects with high discrimination and location information of the plurality of identifiable objects. The image capturing module is disposed on the vehicle and configured to capturing a current image. The processing circuit is configured to determine whether at least one current identifiable object in the current image matches at least one of the plurality of identifiable objects with high discrimination.

Abstract: A method of dynamically updating points of interest (POIs) for applied to an electronic map system is provided. The method of dynamically updating POIs includes obtain a plurality of street view images and location information of the plurality of street view images captured by a plurality of edge devices, analyzing the plurality of street view images and the location information of the plurality of street view images according to an artificial intelligence model to determine a plurality of current POIs and locations of the plurality of current POIs, and comparing the plurality of current POIs with a plurality of original POIs stored in a POI database of the electronic map system to perform a POI update procedure.

Abstract: An anti-wear screw includes a U-shaped anti-wear clip and a locking screw. The U-shaped anti-wear clip is used to clamp on a heat dissipation substrate, and the locking screw is passed through the U-shaped anti-wear clip to fix the heat dissipation substrate. In addition, the anti-wear screw further includes a pressure spring installed between the locking screw and the U-shaped anti-wear clip to exert pressure on the U-shaped anti-wear clip and the heat dissipation substrate.