Patents by Inventor Ting-Chu Chen

Ting-Chu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12164854
    Abstract: The present disclosure provides a method and an apparatus for arranging electrical components within a semiconductor device, and a non-transitory computer-readable medium. The method includes (a) placing a plurality of cells in a first layout; (b) generating a second layout by performing a first set of calculations on the first layout such that a total wire length of the second layout is less than that of the first layout; (c) generating a third layout by performing a second set of calculations on the second layout such that cell congestions in the second layout is eliminated from the third layout; (d) generating a fourth layout by performing a third set of calculations on the third layout such that the total wire length of the fourth layout is less than that of the third layout; and (e) iterating the operations (c) and (d) until a target layout conforms to a convergence criterion.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: December 10, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ting-Chi Wang, Wai-Kei Mak, Kuan-Yu Chen, Hsiu-Chu Hsu, Hsuan-Han Liang, Sheng-Hsiung Chen
  • Publication number: 20240375236
    Abstract: A method includes bonding a first package component on a composite carrier, and performing a first polishing process on the composite carrier to remove a base carrier of the composite carrier. The first polishing process stops on a first layer of the composite carrier. A second polishing process is performed to remove the first layer of the composite carrier. The second polishing process stops on a second layer of the composite carrier. A third polishing process is performed to remove a plurality of layers in the composite carrier. The plurality of layers include the second layer, and the third polishing process stops on a dielectric layer in the first package component.
    Type: Application
    Filed: July 25, 2024
    Publication date: November 14, 2024
    Inventors: Chun-Wei Chang, Ming-Fa Chen, Chao-Wen Shih, Ting-Chu Ko
  • Publication number: 20240363722
    Abstract: The present disclosure describes a method of forming an intermediate spacer structure between a gate structure and a source/drain (S/D) contact structure and removing a top portion of the intermediate spacer structure to form a recess. The intermediate spacer structure includes a first spacer layer, a second spacer layer, and a sacrificial spacer layer between the first spacer layer and the second spacer layer. The method further includes removing the sacrificial spacer layer to form an air gap between the first spacer layer and the second spacer layer and spinning a dielectric layer on the air gap, the first spacer layer, and the second spacer layer to fill in the recess and seal the air gap. The dielectric layer includes raw materials for a spin-on dielectric material.
    Type: Application
    Filed: July 10, 2024
    Publication date: October 31, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Ting CHEN, Tsai-Jung Ho, Tsung-Han Ko, Tetsuji Ueno, Yahru Cheng, Chen-Han Wang, Keng-Chu Lin, Shuen-Shin Liang, Tsu-Hsiu Perng
  • Patent number: 12094952
    Abstract: The present disclosure describes a method of forming an intermediate spacer structure between a gate structure and a source/drain (S/D) contact structure and removing a top portion of the intermediate spacer structure to form a recess. The intermediate spacer structure includes a first spacer layer, a second spacer layer, and a sacrificial spacer layer between the first spacer layer and the second spacer layer. The method further includes removing the sacrificial spacer layer to form an air gap between the first spacer layer and the second spacer layer and spinning a dielectric layer on the air gap, the first spacer layer, and the second spacer layer to fill in the recess and seal the air gap. The dielectric layer includes raw materials for a spin-on dielectric material.
    Type: Grant
    Filed: April 10, 2023
    Date of Patent: September 17, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Ting Chen, Chen-Han Wang, Keng-Chu Lin, Shuen-Shin Liang, Tsu-Hsiu Perng, Tsai-Jung Ho, Tsung-Han Ko, Tetsuji Ueno, Yahru Cheng
  • Patent number: 7828613
    Abstract: This invention is a cable terminal connector, primarily comprising of a U-shaped contact body at the front end of the connector, with a compressible slot located between its upper and lower faces, forming upper and lower resilient clamping faces above and below the compressible slot. When the cable terminal connector's U-shaped contact body is held in place by the cap, the resilient clamping faces on the U-shaped contact body spring back to hold the cap in place, preventing it loosening and increasing the stability of conduction, thereby making it a more effective cable terminal connector.
    Type: Grant
    Filed: August 10, 2009
    Date of Patent: November 9, 2010
    Inventor: Ting-Chu Chen
  • Publication number: 20100159756
    Abstract: This invention is a cable terminal connector, primarily comprising of a U-shaped contact body at the front end of the connector, with a compressible slot located between its upper and lower faces, forming upper and lower resilient clamping faces above and below the compressible slot. When the cable terminal connector's U-shaped contact body is held in place by the cap, the resilient clamping faces on the U-shaped contact body spring back to hold the cap in place, preventing it loosening and increasing the stability of conduction, thereby making it a more effective cable terminal connector.
    Type: Application
    Filed: August 10, 2009
    Publication date: June 24, 2010
    Inventor: Ting-Chu Chen
  • Patent number: 6672903
    Abstract: A signal-line connector includes a connecting member, a rod-shaped conductor, a plurality of grounding members and a shell. After the connecting member, the conductor and the grounding members are assembled together with and in the shell, the conductor and the grounding members are separated by separating members to prevent signal lines connected with the conductor and the grounding members from contacting with each other accidentally, and the metal material needed for the grounding members are much saved, and their resistance is reduced a lot, with the capacitance between the grounding members and the non-metal connecting member lessened mush so that the signal-line connector may have good contact and signal transmission.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: January 6, 2004
    Inventor: Ting-Chu Chen