Abstract: A resonant converter has a first transistor, a second transistor, a third transistor, a fourth transistor, a transformer, a resonant tank, a rectifier circuit and a current sensing circuit. The transformer comprises a primary winding and a first sampling winding at a primary side, and a secondary winding at a secondary side. The resonant tank circuit is coupled between the first switching node and the second switching node and comprises a resonant capacitor, a resonant inductor and a magnetizing inductance of the primary winding coupled in series. The rectifier circuit is coupled between the first end of the secondary winding and the second end of the secondary winding. The current sensing circuit is used to receive the first capacitor voltage sampling signal and provide a current sensing signal based on the first capacitor voltage sampling signal.

Abstract: A power module having a bottom substrate, a device substrate arranged on the bottom substrate and an inductor assembly arranged on the device substrate. The inductor assembly has a first winding, a second winding, a first magnetic core part and a second magnetic core part. The first magnetic core part has a first portion disposed on a first horizontal level and a second portion disposed on a second horizontal level. The second magnetic core part has a first portion disposed on the second horizontal level and a second portion disposed on the first horizontal level. The first and second magnetic core parts are assembled to accommodate the first winding between the first portions of the first and second magnetic core part, and to accommodate the second winding between the second portions of the first and second magnetic core part.

Abstract: A power module has an inductor assembly and a device substrate. The inductor assembly comprises a magnetic core, a first winding and a second winding. Each of the first winding and the second winding has a first end and a second end exposed at the second surface of the inductor assembly. The device substrate has a first power device chip and a second power device chip at least partially embedded within the device substrate. The device substrate further has a first top heat layer at least partially covering the first power device chip and a second top heat layer at least partially covering the second power device chip. The first end of the first winding is electrically connected to the first top heat layer, and the first end of the second winding is electrically connected to the second top heat layer.

Abstract: A power module, having a bottom substrate, a device substrate arranged on the bottom substrate and an inductor assembly arranged on the device substrate. The device substrate having a first power device chip and a second power device chip embedded within the device substrate. Each power device chip has a first surface and a second surface. The first surface of each power device chip is covered by a top heat layer, and the second surface of each power device chip has a plurality of pins or pads exposed on the second surface of the device substrate, and connected to the bottom substrate.

Abstract: A power module, having: a transformer pack; a top substrate mounted on the transformer pack; and two power device chips mounted on the top substrate, wherein each one of the power device chips has at least one pin connected to the transformer pack via the top substrate; wherein the transformer pack has a magnetic core, a first primary winding and a second primary winding, a first secondary winding and a second secondary winding, a first magnetic core part and a second magnetic core part, and wherein each one of the primary windings passes through the magnetic core, the first secondary winding is close to the first primary winding with the first magnetic core part in between, and the second secondary winding is close to the second primary winding with the second magnetic core part in between.

Abstract: A power module includes a substrate and an integrated circuit (IC) die. The IC die is disposed on the substrate. A driver and a pair of switches are integrated in the IC die. A power converter of the power module includes the driver, the pair of switches, an inductor, and a capacitor. The inductor and the capacitor are embedded within the substrate.

Abstract: A cascaded converter architecture comprising a pure switched-capacitor (SC) stage and a resonant SC stage. Multiple switching buses are utilized to connect the first-stage SC converter with second-stage multi-phase resonant SC converters. The flying capacitors of both stages are resonant with the output inductors, so the charge distribution loss is eliminated. Zero-current switching is realized by adjusting the duty ratio and switching frequency. By using the intermediate switching bus, the number of switches can be reduced, and the intermediate bus capacitor is not required; thereby greatly reducing component count and cost while improving power density. Numerous implementation variations are described by way of example and not limitation.

Abstract: A power supply module comprises an inductor pack, a top PCB (Printed Circuit Board) on top of the inductor pack, a bottom PCB disposed below the inductor pack, a connector connected between the bottom PCB and the top PCB, two power device chips on top of the top PCB, an output capacitor substrate layer disposed below the bottom PCB, and an interposer substrate layer disposed below the output capacitor substrate layer. The inductor pack comprises two inductors, each inductor having a first end and a second end. The two power device chips are respectively connected to the first ends of the two inductors via the top PCB. A first output capacitor and a second output capacitor are embedded within the output capacitor substrate layer, and are respectively connected to the second ends of the two inductors to provide a first output voltage and a second output voltage.

Abstract: A cascaded power converter architecture is provided which merges a front end stage with subsequent interleaved Switched Capacitor (SC) stages to achieve high conversion ratios. This interleaving control technique addresses practical conversion challenges. Numerous topologies can be created from this approach, a number of examples being depicted, including: (a) a two stage 4-to-1 conversion using two 2-to-1 ReSc converter stages, and (b) 8-to-1 converters with (b)(i) a 2-to-1 ReSC stage followed by a 2nd stage having four 4-to-1 STC converter phases, (b)(ii) a 2-to-1 ReSC 1st stage followed by a 2nd stage with four 4-to-1 series-parallel phases, and (c) a multi-stage cascading three stage converter with a 2-to-1 ReSC 1st stage, a 2nd stage of two 2-to-1 ReSC phases, and a 3rd stage having four 2-to-1 ReSC phases.

Abstract: An inductor has one or more wires and a multipart magnetic core. The multipart magnetic core has magnetic core parts that are adjacent and magnetically coupled. The inductor provides an inductance of at least 40 nH for currents greater than 1 A and less than 60 A, and at least 20 nH for currents of at least 60 A.

Abstract: Aspects of series resonator DC-to-DC converters are described. A series resonator DC-to-DC converter can include a first half-bridge circuit comprising a first high-side switch and a first low-side switch, a second half-bridge circuit comprising a second high-side switch and a second low-side switch, and a resonator in series between the first high-side switch and the first low-side switch. The circuit design and switching controller can be relied upon to impart soft-switching.

Abstract: An inductor has one or more wires and a multipart magnetic core. The multipart magnetic core has magnetic core parts that are adjacent and magnetically coupled. The inductor provides an inductance of at least 40 nH for currents greater than 1 A and less than 60 A, and at least 20 nH for currents of at least 60 A.

Abstract: Aspects of series resonator DC-to-DC converters are described. A series resonator DC-to-DC converter can include a first half-bridge circuit comprising a first high-side switch and a first low-side switch, a second half-bridge circuit comprising a second high-side switch and a second low-side switch, and a resonator in series between the first high-side switch and the first low-side switch. The circuit design and switching controller can be relied upon to impart soft-switching.

Abstract: An inductor has one or more wires and a multipart magnetic core. The multipart magnetic core has magnetic core parts that are adjacent and magnetically coupled. The inductor provides an inductance of at least 40 nH for currents greater than 1 A and less than 60 A, and at least 20 nH for currents of at least 60 A.

Abstract: An inductor has one or more wires and a multipart magnetic core. The multipart magnetic core has magnetic core parts that are adjacent and magnetically coupled. The inductor provides an inductance of at least 40 nH for currents greater than 1 A and less than 60 A, and at least 20 nH for currents of at least 60 A.

Abstract: A voltage regulator has a switching circuit and a control circuit. The switching circuit receives an input voltage and provides an output voltage and an output current. The control circuit provides a control signal to the switching circuit, such that the output voltage is maintained at a clamp voltage level when the output current is lower than a transition current level, and the output voltage decreases as the output current increases when the output current is higher than the transition current level.

Abstract: A voltage regulator has a switching circuit and a control circuit. The switching circuit receives an input voltage and provides an output voltage and an output current. The control circuit provides a control signal to the switching circuit, such that the output voltage is maintained at a clamp voltage level when the output current is lower than a transition current level, and the output voltage decreases as the output current increases when the output current is higher than the transition current level.

Abstract: A composite includes a substrate and at least a resin composition formed on the substrate. A surface of the substrate is defined a plurality of micro-pores therein. The resin composition is coupled to the surface having the micro-pores by the resin composition filling and hardening within the micro-pores. The resin composition contains crystalline thermoplastic synthetic resins. A method for making the composite is also described.

Abstract: A power supply circuit includes a comparator, first to third electronic switches, a D-trigger, a power supply unit (PSU), and a complex programmable logic device (CPLD). When a voltage from the PSU is greater than a reference voltage, the first electronic switch is turned on. An electronic device connected to the first electronic does not receive power from the PSU. The second electronic switch is turned on. The third electronic switch is turned off. The D-trigger outputs a low level signal to make the CPLD control the PSU stop supplying power.

Abstract: When there is a memory module mounted in a memory slot, a memory power circuit provides a voltage to the memory slot. First and second power pins of the memory slot are connected. A first electronic switch is turned on. A second electronic switch is turned off. A programmable logic controller (PLC) outputs a first control signal to the memory power circuit to output the voltage to the memory slot. When there is no memory module mounted in the memory slot and the motherboard is powered on, the memory power circuit provides a voltage to the memory slot. The first and second power pins of the memory slot are disconnected. The first electronic switch is turned off. The second electronic switch is turned on. The PLC outputs a second control signal to control the memory power circuit not to output the voltage to the memory slot.