Patents by Inventor Ting-Han Lee

Ting-Han Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955397
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a channel layer, a barrier layer, a compound semiconductor layer, a gate electrode, and a stack of dielectric layers. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer. The compound semiconductor layer is disposed on the barrier layer. The gate electrode is disposed on the compound semiconductor layer. The stack of dielectric layers is disposed on the gate electrode. The stack of dielectric layers includes layers having different etching rates.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: April 9, 2024
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Shin-Cheng Lin, Cheng-Wei Chou, Ting-En Hsieh, Yi-Han Huang, Kwang-Ming Lin, Yung-Fong Lin, Cheng-Tao Chou, Chi-Fu Lee, Chia-Lin Chen, Shu-Wen Chang
  • Publication number: 20240076449
    Abstract: The present application is directed to a polymer comprising a moiety of formula: wherein X, Y, i, j, s, and k are as described herein and salts thereof and to a process of preparing such a polymer.
    Type: Application
    Filed: July 24, 2023
    Publication date: March 7, 2024
    Inventors: Eric William Cochran, George A. Kraus, Ting-Han Lee, Michael J. Forrester