Abstract: A touch device includes a substrate, a touch sensor and an auxiliary electrode configuration. The touch sensor is located on the upper surface of the substrate. The auxiliary electrode configuration is located outside the touch sensor and is used to transmit an uplink signal.

Abstract: A touch device includes a substrate, a touch sensor and an auxiliary electrode configuration. The touch sensor is located on the upper surface of the substrate. The auxiliary electrode configuration is located outside the touch sensor and is used to transmit an uplink signal.

Abstract: In a service searching method of a server, a searching interface is transmitted to a client device, and the searching interface includes icons of a plurality of service categories. The server receives a service category selected from the searching interface and a keyword input from the searching user interface by the client device. One or more websites corresponding to the selected service category are confirmed, and the method searches for search results which are related to the input keyword from the confirmed websites. The search results are sorted in a preset manner and output in a preset format to be displayed on a display screen of the client device.

Abstract: A capacitive touch panel with single sensing layer has a substrate. The substrate has the single sensing layer formed thereon. The sensing layer has multiple electrode sets. Each electrode set has multiple driving electrode rows and multiple receiving electrode rows arranged alternately. The multiple driving electrode rows of one electrode set have different driving electrodes, but different electrode sets have the same multiple driving electrode rows. The multiple receiving electrode rows of one electrode set are consisted of multiple same receiving electrodes, but different electrode sets have different receiving electrode rows. Therefore, using less contacts can also maintained the area and the solution so that the pins on the IC are also decreased. Thus, the volume of the IC is reduced and the packaging cost is also reduced.