Abstract: A recognition system and an image augmentation and training method thereof are provided. The image augmentation and training method of a recognition system includes the following steps. A plurality of image frames are obtained, wherein each of the image frames includes an object pattern. A plurality of environmental patterns are obtained. The object pattern is separated from each of the image frames. A plurality of image parameters are set. The image frames, based on the object patterns and the environmental patterns, are augmented according to the image parameters to increase the number of the image frames. A recognition model is trained using the image frames.

Abstract: An impact resistant structure adapted to an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, and the damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.

Abstract: A fingerprint recognition method is provided. The method includes obtaining a plurality of fingerprint images by sensing a finger of a user, respectively calculating geometric center points corresponding to the fingerprint images, and calculating positions and offsets of the fingerprint images according to the geometric center points. The method also includes filling signals in the fingerprint images into a part of pixels in a pixel array according to the positions and the offsets of the fingerprint images, and obtaining signals of other pixels in the pixel array by inputting the signals filled in the part of pixels in the pixel array into an artificial intelligence engine. The method further includes generating a candidate fingerprint image and recognizing a user based on the candidate fingerprint image.

Abstract: An impact resistant structure for an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, a thickness of the resistance stack layer is less than 10 ?m, and a Young's modulus of the resistance stack layer is between 40 GPa and 150 GPa. The damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.

Abstract: A shopping guide method and a shopping guide platform are provided. The shopping guide method includes steps of: receiving object search information, searching a database according to the object search information to determine a needed object, obtaining object location information of the needed object according to the needed object, and obtaining object guiding information according to the object location information, wherein the object guiding information includes an in-store guiding route.

Abstract: An impact resistant structure for an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, a thickness of the resistance stack layer is less than 10 ?m, and a Young's modulus of the resistance stack layer is between 40 GPa and 150 GPa. The damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.

Abstract: A protective structure includes a substrate, a hard coating layer and an auxiliary layer. The auxiliary layer is disposed on the substrate. The hard coating layer is disposed on the auxiliary layer. The auxiliary layer is disposed between the substrate and the hard coating layer. The Young's modulus of the auxiliary layer is greater than the Young's modulus of the hard coating layer, and the Young's modulus of the hard coating layer is greater than the Young's modulus of the substrate.

Abstract: An impact resistant structure adapted to an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, and the damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.