Patents by Inventor Ting-Huan LEE

Ting-Huan LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device
    Patent number: 9853678
    Abstract: Electronic devices are disclosed. The electronic device includes a circuit board. The circuit board contains a first transceiver module pad configured for soldering a first transceiver module thereon; and a second transceiver module pad configured for soldering a second transceiver module thereon. The first transceiver module is different from the second transceiver module, and layouts of the first and second transceiver module pads are the same.
    Type: Grant
    Filed: June 27, 2016
    Date of Patent: December 26, 2017
    Assignee: MEDIATEK SINGAPORE PTE. LTD.
    Inventors: Jie Chen, Ting-Huan Lee, Jian Wu
  • ELECTRONIC DEVICE
    Publication number: 20160308574
    Abstract: Electronic devices are disclosed. The electronic device includes a circuit board. The circuit board contains a first transceiver module pad configured for soldering a first transceiver module thereon; and a second transceiver module pad configured for soldering a second transceiver module thereon. The first transceiver module is different from the second transceiver module, and layouts of the first and second transceiver module pads are the same.
    Type: Application
    Filed: June 27, 2016
    Publication date: October 20, 2016
    Inventors: Jie CHEN, Ting-Huan LEE, Jian WU
  • Electronic device
    Patent number: 9408252
    Abstract: Electronic devices are disclosed. The electronic device includes a circuit board. The circuit board contains a first transceiver module pad configured for soldering a first transceiver module thereon; and a second transceiver module pad configured for soldering a second transceiver module thereon. The first transceiver module is different from the second transceiver module, and layouts of the first and second transceiver module pads are the same.
    Type: Grant
    Filed: April 17, 2014
    Date of Patent: August 2, 2016
    Assignee: MEDIATEK SINGAPORE PTE. LTD.
    Inventors: Jie Chen, Ting-Huan Lee, Jian Wu
  • ELECTRONIC DEVICE
    Publication number: 20140315598
    Abstract: Electronic devices are disclosed. The electronic device includes a circuit board. The circuit board contains a first transceiver module pad configured for soldering a first transceiver module thereon; and a second transceiver module pad configured for soldering a second transceiver module thereon. The first transceiver module is different from the second transceiver module, and layouts of the first and second transceiver module pads are the same.
    Type: Application
    Filed: April 17, 2014
    Publication date: October 23, 2014
    Applicant: MediaTek Singapore Pte. Ltd.
    Inventors: Jie CHEN, Ting-Huan LEE, Jian WU