Patents by Inventor Ting Hung

Ting Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250226586
    Abstract: A wearable device includes a feeding radiation element, a ground element, a connection radiation element, an additional radiation element, a first grounding radiation element, a second grounding radiation element, and a carrier element. The feeding radiation element has a positive feeding point. The ground element has a negative feeding point. The additional radiation element is coupled through the connection radiation element to the feeding radiation element. The first grounding radiation element is coupled to the ground element. The first grounding radiation element is adjacent to the feeding radiation element. The second grounding radiation element is coupled to the ground element. The second grounding radiation element is adjacent to the feeding radiation element. An antenna structure is formed by the feeding radiation element, the ground element, the connection radiation element, the additional radiation element, the first grounding radiation element, and the second grounding radiation element.
    Type: Application
    Filed: February 5, 2024
    Publication date: July 10, 2025
    Inventors: Kuan-Hsien LEE, Chung-Ting HUNG, Chin-Lung TSAI, Yu-Chen ZHAO
  • Publication number: 20250203826
    Abstract: A power module includes a PCB, a transformer module, and a power converter circuit. The PCB has a top surface and a bottom surface. The transformer module includes a magnetic core, and a primary winding and a secondary winding wound around the magnetic core. The magnetic core has a first core unit arranged on the top surface of the PCB and a second core unit arranged on the bottom surface of the PCB. The primary winding is formed by traces on multiple layers of the PCB, the secondary winding is formed by traces on multiple layers of the PCB, the multiple layers are stacked vertically to form a winding stack. The power converter circuit has power switches, wherein a part of the power switches are disposed on the top surface of the PCB, and another part of the power switches are disposed on the bottom surface of the PCB.
    Type: Application
    Filed: December 13, 2024
    Publication date: June 19, 2025
    Inventors: Kuan-Hung Wu, Ting-Hung Wang, Chia-Hsi Chang, Junjie Feng, Daocheng Huang
  • Publication number: 20250189069
    Abstract: A container for containing food or liquid is provided. The container includes a body portion, a lid and an attachment. The lid is detachably disposed on the body portion. The attachment is configured to be disposed on the lid or the body portion and includes a magnetic attraction member and a connecting structure. The magnetic attraction member is adapted to be magnetically connected to a mobile electronic device. The connecting structure is disposed between the magnetic attraction member and the container for selectively fixing the magnetic attraction member at a first position or a second position. The connecting structure includes a fastening member, and the fastening member is adapted to be detachably fastened to the body portion or the lid.
    Type: Application
    Filed: February 20, 2025
    Publication date: June 12, 2025
    Applicant: EVOLUTIVE LABS CO., LTD.
    Inventors: JUI-CHEN LU, CHING-YU WANG, YU-TING HUNG, YU-CHANG CHIANG, CHENG-CHE HO
  • Patent number: 12320610
    Abstract: A cover kit for a firearm handguard having a plurality of slots, the cover kit includes a bottom side detachably mounted on the slot of the firearm handguard; fastening means for securing the cover body to cover the slot on the firearm handguard; a cable secured between the bottom side of the cover body and the firearm handguard; wherein the bottom side comprises a plurality of horizontal tunnels and a plurality of transversal tunnels intersected with the transversal tunnels; wherein the cable is embedded in at least one of transversal tunnel and/or the horizontal tunnels.
    Type: Grant
    Filed: June 19, 2021
    Date of Patent: June 3, 2025
    Inventors: Shanyao Lee, Shih Ting Hung
  • Publication number: 20250174902
    Abstract: An antenna structure includes a feeding radiation element, a first radiation element, a second radiation element, an extension radiation element, and a dielectric substrate. The feeding radiation element has a feeding point. The first radiation element is coupled to a ground voltage. The first radiation element is adjacent to the feeding radiation element. The second radiation element is coupled to the ground voltage. The second radiation element is adjacent to the feeding radiation element. The extension radiation element is coupled to the first radiation element. The feeding radiation element and the second radiation element are at least partially surrounded by the first radiation element. The feeding radiation element, the first radiation element, the second radiation element, and the extension radiation element are all disposed on the dielectric substrate.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 29, 2025
    Inventors: Kai-Hsiang CHANG, Chung-Ting HUNG, Chin-Lung TSAI, Yi-Ling TSENG, Yu-Chen ZHAO, Chun-I CHENG
  • Publication number: 20250174900
    Abstract: An antenna structure includes a feeding radiation element, a first grounding radiation element, a second grounding radiation element, a connection radiation element, an extension radiation element, and a dielectric substrate. The feeding radiation element has a feeding point. The first grounding radiation element has a first grounding point. The first grounding radiation element is adjacent to the feeding radiation element. The second grounding radiation element has a second grounding point. The connection radiation element is coupled between the first grounding radiation element and the second grounding radiation element. The extension radiation element is coupled to the connection radiation element. A closed slot is surrounded by the connection radiation element and the extension radiation element.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 29, 2025
    Inventors: Yu-Chen ZHAO, Chung-Ting HUNG, Chin-Lung TSAI, Yi-Ling TSENG, Kai-Hsiang CHANG, Chun-I CHENG
  • Publication number: 20250146832
    Abstract: Disclosed are devices, systems and methods for displaying a map for a user. A method of displaying a map for a user comprises: receiving, from a user device, a request to display the map for a geographical region around a vehicle, wherein the request identifies one or more layers of the map; retrieving, in response to the request, map data corresponding to the geographical region from a map database that stores a multi-layer representation of the geographical region; selecting, in response to the request, the one or more layers from the multi-layer representation; and displaying the map on a display of the user device based on the request.
    Type: Application
    Filed: October 31, 2024
    Publication date: May 8, 2025
    Inventors: Ruimin ZENG, Anying ZHENG, Wan-Ting HUNG, Anpin WANG, Minhao JIANG, Hsin LU
  • Publication number: 20250139855
    Abstract: A computer-implemented method of map data processing, comprising generating, for a grid-based representation of map data, raw grid features; building a grid map by reading from a memory that stores the raw grid features; and processing the grid map using one or more post-processing operations including a smoothing operation applied across zero or more grid lines of the grid map according to a rule.
    Type: Application
    Filed: October 29, 2024
    Publication date: May 1, 2025
    Inventors: Ke XU, Thomas Datong WANG, Hsin LU, Bolun ZHANG, Adan Daniel ARTEAGA ORGANIZ, Shicong MA, Tu Thanh TRAN, Shenchao ZHANG, Jinjian ZHAI, Wan-Ting HUNG, Anping WANG
  • Publication number: 20250125530
    Abstract: An antenna structure includes a feeding radiation element, a first radiation element, a second radiation element, a third radiation element, and a carrier element. The feeding radiation element has a feeding point. The first radiation element is coupled to the feeding radiation element. The first radiation element has a meandering structure. The second radiation element is coupled to the feeding radiation element. The second radiation element is adjacent to the first radiation element. The third radiation element is coupled to the ground voltage. The third radiation element is adjacent to the second radiation element. The feeding radiation element, the first radiation element, the second radiation element, and the third radiation element are disposed on the carrier element.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 17, 2025
    Inventors: Chun-I CHENG, Chung-Ting HUNG, Chin-Lung TSAI, Yi-Ling TSENG, Yu-Chen ZHAO, Kai-Hsiang CHANG
  • Publication number: 20250125520
    Abstract: A wearable device includes a first radiation metal element, a second radiation metal element, a ground metal element, a third radiation metal element, and a carrier element. The first radiation metal element is coupled to a positive feeding point. The second radiation metal element is coupled to the positive feeding point. The ground metal element is coupled to a negative feeding point. The third radiation metal element is adjacent to the ground metal element. A coupling gap is formed between the third radiation metal element and the ground metal element. The first radiation metal element, the second radiation metal element, the ground metal element, and the third radiation metal element are disposed on the carrier element. An antenna structure is formed by the first radiation metal element, the second radiation metal element, the ground metal element, and the third radiation metal element.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 17, 2025
    Inventors: Yi-Ling TSENG, Chin-Lung TSAI, Chung-Ting HUNG, Kai-Hsiang CHANG, Yu-Chen ZHAO
  • Patent number: 12272397
    Abstract: A forming operation method of a resistive random access memory is provided. The method includes the following steps. A positive pulse and a negative pulse are sequentially applied, by a bit line/source line driver, to multiple resistive random access memory cells in a direction form a farthest location to a nearest location based on the bit line/source line driver through a bit line and a source line to break down a dielectric film of each of the resistive random access memory cells and generate a conductive filament of each of the resistive random access memory cells.
    Type: Grant
    Filed: March 9, 2023
    Date of Patent: April 8, 2025
    Assignee: United Microelectronics Corp.
    Inventors: Yi Ting Hung, Ko-Chi Chen, Tzu-Yun Chang
  • Publication number: 20250105496
    Abstract: A wearable device includes a feeding radiation element, a connection radiation element, a bifurcate radiation element, a shorting radiation element, an extension radiation element, and a carrier element. The feeding radiation element has a feeding point. The connection radiation element is coupled to the feeding radiation element. The bifurcate radiation element is coupled to the connection radiation element. The connection radiation element is also coupled through the shorting radiation element to a grounding point. The extension radiation element is coupled to the feeding radiation element. The feeding radiation element, the connection radiation element, the bifurcate radiation element, the shorting radiation element, and the extension radiation element are disposed on the carrier element. An antenna structure is formed by the feeding radiation element, the connection radiation element, the bifurcate radiation element, the shorting radiation element, and the extension radiation element.
    Type: Application
    Filed: December 28, 2023
    Publication date: March 27, 2025
    Inventors: Ying-Cong DENG, Chung-Ting HUNG, Chin-Lung TSAI
  • Publication number: 20250105077
    Abstract: A package-on-package (PoP) structure includes a first package structure and a second package structure stacked on the first package structure. The first package structure includes a die, conductive structures, an encapsulant, and a conductive pattern layer. The conductive structures surround the die. The encapsulant laterally encapsulates the die and the conductive structures. The conductive pattern layer is disposed over and in physical contact with a top surface of the encapsulant and top surfaces of the conductive structures. An entire bottom surface of the conductive pattern layer is located at a same level height, and an entirety of the top surface of the encapsulant and an entirety of the top surfaces of the conductive structures are located at the same level height.
    Type: Application
    Filed: December 10, 2024
    Publication date: March 27, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shin-Puu Jeng, Hsien-Wen Liu, Shih-Ting Hung, Yi-Jou Lin, Tzu-Jui Fang, Po-Yao Chuang
  • Patent number: 12259110
    Abstract: The present disclosure provides an optical packaging structure and a backlight module with the optical packaging structure. The optical packaging structure includes a light-emitting chip, a packaging layer, a fluorescent layer, a lens structure, and a reflecting layer. The light-emitting chip includes a light-emitting surface, a connecting surface, and a side surface. The packaging layer covers the light-emitting surface and the first side surface. The connecting surface is exposed from the packaging layer. The fluorescent layer is disposed on the packaging layer, and covers on the light-emitting surface and the first side surface. The lens structure is disposed on a top surface of the fluorescent layer. A surface of the lens structure is recessed towards the light-emitting chip to form a curved surface. The reflecting layer is disposed on the curved surface.
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: March 25, 2025
    Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: Chuang-Yu Hsieh, Hsin-Ting Hung, Hao-Hsiang Hsieh, Shih-Hsiang Lo
  • Patent number: 12261594
    Abstract: Embodiments relate to a cascode diode circuit. The cascode diode circuit comprises a normally on transistor, a low voltage diode and a high voltage diode. The normally on transistor has a gate, a drain, and a source. The low voltage diode has a cathode connected to the source of the normally on transistor and an anode connected to the gate of the normally on transistor. The high voltage diode has a cathode connected to a node between the normally on transistor and the low voltage diode, and an anode connected the drain of the normally on transistor.
    Type: Grant
    Filed: June 21, 2023
    Date of Patent: March 25, 2025
    Assignee: FAST SIC SEMICONDUCTOR INCORPORATED
    Inventors: Fu-Jen Hsu, Cheng-Tyng Yen, Hsiang-Ting Hung
  • Publication number: 20250079428
    Abstract: Packaged devices and methods of manufacturing the devices are described herein. The packaged devices may be fabricated using heterogeneous devices and asymmetric dual-side molding on a multi-layered redistribution layer (RDL) structure. The packaged devices may be formed with a heterogeneous three-dimensional (3D) Fan-Out System-in-Package (SiP) structure having small profiles and can be formed using a single carrier substrate.
    Type: Application
    Filed: November 15, 2024
    Publication date: March 6, 2025
    Inventors: Yi-Wen Wu, Po-Yao Chuang, Meng-Liang Lin, Techi Wong, Shih-Ting Hung, Po-Hao Tsai, Shin-Puu Jeng
  • Patent number: 12237262
    Abstract: A semiconductor package is provided. The semiconductor package includes an encapsulating layer, a semiconductor die formed in the encapsulating layer, and an interposer structure covering the encapsulating layer. The interposer structure includes an insulating base having a first surface facing the encapsulating layer, and a second surface opposite the first surface. The interposer structure also includes insulating features formed on the first surface of the insulating base and extending into the encapsulating layer. The insulating features is arranged in a matrix and faces a top surface of the semiconductor die. The interposer structure further includes first conductive features formed on the first surface of the insulating base and extending into the encapsulating layer. The first conductive features surround the matrix of the insulating features.
    Type: Grant
    Filed: November 6, 2023
    Date of Patent: February 25, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yi-Wen Wu, Techi Wong, Po-Hao Tsai, Po-Yao Chuang, Shih-Ting Hung, Shin-Puu Jeng
  • Patent number: D1058496
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: January 21, 2025
    Assignee: BLACK & DECKER INC.
    Inventor: Yu Ting Hung
  • Patent number: D1061423
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: February 11, 2025
    Assignee: BLACK & DECKER INC.
    Inventor: Yu Ting Hung
  • Patent number: D1065152
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: March 4, 2025
    Assignee: BLACK & DECKER INC.
    Inventor: Yu Ting Hung