Patents by Inventor Ting Hung
Ting Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250226586Abstract: A wearable device includes a feeding radiation element, a ground element, a connection radiation element, an additional radiation element, a first grounding radiation element, a second grounding radiation element, and a carrier element. The feeding radiation element has a positive feeding point. The ground element has a negative feeding point. The additional radiation element is coupled through the connection radiation element to the feeding radiation element. The first grounding radiation element is coupled to the ground element. The first grounding radiation element is adjacent to the feeding radiation element. The second grounding radiation element is coupled to the ground element. The second grounding radiation element is adjacent to the feeding radiation element. An antenna structure is formed by the feeding radiation element, the ground element, the connection radiation element, the additional radiation element, the first grounding radiation element, and the second grounding radiation element.Type: ApplicationFiled: February 5, 2024Publication date: July 10, 2025Inventors: Kuan-Hsien LEE, Chung-Ting HUNG, Chin-Lung TSAI, Yu-Chen ZHAO
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Publication number: 20250203826Abstract: A power module includes a PCB, a transformer module, and a power converter circuit. The PCB has a top surface and a bottom surface. The transformer module includes a magnetic core, and a primary winding and a secondary winding wound around the magnetic core. The magnetic core has a first core unit arranged on the top surface of the PCB and a second core unit arranged on the bottom surface of the PCB. The primary winding is formed by traces on multiple layers of the PCB, the secondary winding is formed by traces on multiple layers of the PCB, the multiple layers are stacked vertically to form a winding stack. The power converter circuit has power switches, wherein a part of the power switches are disposed on the top surface of the PCB, and another part of the power switches are disposed on the bottom surface of the PCB.Type: ApplicationFiled: December 13, 2024Publication date: June 19, 2025Inventors: Kuan-Hung Wu, Ting-Hung Wang, Chia-Hsi Chang, Junjie Feng, Daocheng Huang
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Publication number: 20250189069Abstract: A container for containing food or liquid is provided. The container includes a body portion, a lid and an attachment. The lid is detachably disposed on the body portion. The attachment is configured to be disposed on the lid or the body portion and includes a magnetic attraction member and a connecting structure. The magnetic attraction member is adapted to be magnetically connected to a mobile electronic device. The connecting structure is disposed between the magnetic attraction member and the container for selectively fixing the magnetic attraction member at a first position or a second position. The connecting structure includes a fastening member, and the fastening member is adapted to be detachably fastened to the body portion or the lid.Type: ApplicationFiled: February 20, 2025Publication date: June 12, 2025Applicant: EVOLUTIVE LABS CO., LTD.Inventors: JUI-CHEN LU, CHING-YU WANG, YU-TING HUNG, YU-CHANG CHIANG, CHENG-CHE HO
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Patent number: 12320610Abstract: A cover kit for a firearm handguard having a plurality of slots, the cover kit includes a bottom side detachably mounted on the slot of the firearm handguard; fastening means for securing the cover body to cover the slot on the firearm handguard; a cable secured between the bottom side of the cover body and the firearm handguard; wherein the bottom side comprises a plurality of horizontal tunnels and a plurality of transversal tunnels intersected with the transversal tunnels; wherein the cable is embedded in at least one of transversal tunnel and/or the horizontal tunnels.Type: GrantFiled: June 19, 2021Date of Patent: June 3, 2025Inventors: Shanyao Lee, Shih Ting Hung
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Publication number: 20250174902Abstract: An antenna structure includes a feeding radiation element, a first radiation element, a second radiation element, an extension radiation element, and a dielectric substrate. The feeding radiation element has a feeding point. The first radiation element is coupled to a ground voltage. The first radiation element is adjacent to the feeding radiation element. The second radiation element is coupled to the ground voltage. The second radiation element is adjacent to the feeding radiation element. The extension radiation element is coupled to the first radiation element. The feeding radiation element and the second radiation element are at least partially surrounded by the first radiation element. The feeding radiation element, the first radiation element, the second radiation element, and the extension radiation element are all disposed on the dielectric substrate.Type: ApplicationFiled: January 11, 2024Publication date: May 29, 2025Inventors: Kai-Hsiang CHANG, Chung-Ting HUNG, Chin-Lung TSAI, Yi-Ling TSENG, Yu-Chen ZHAO, Chun-I CHENG
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Publication number: 20250174900Abstract: An antenna structure includes a feeding radiation element, a first grounding radiation element, a second grounding radiation element, a connection radiation element, an extension radiation element, and a dielectric substrate. The feeding radiation element has a feeding point. The first grounding radiation element has a first grounding point. The first grounding radiation element is adjacent to the feeding radiation element. The second grounding radiation element has a second grounding point. The connection radiation element is coupled between the first grounding radiation element and the second grounding radiation element. The extension radiation element is coupled to the connection radiation element. A closed slot is surrounded by the connection radiation element and the extension radiation element.Type: ApplicationFiled: January 11, 2024Publication date: May 29, 2025Inventors: Yu-Chen ZHAO, Chung-Ting HUNG, Chin-Lung TSAI, Yi-Ling TSENG, Kai-Hsiang CHANG, Chun-I CHENG
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Publication number: 20250146832Abstract: Disclosed are devices, systems and methods for displaying a map for a user. A method of displaying a map for a user comprises: receiving, from a user device, a request to display the map for a geographical region around a vehicle, wherein the request identifies one or more layers of the map; retrieving, in response to the request, map data corresponding to the geographical region from a map database that stores a multi-layer representation of the geographical region; selecting, in response to the request, the one or more layers from the multi-layer representation; and displaying the map on a display of the user device based on the request.Type: ApplicationFiled: October 31, 2024Publication date: May 8, 2025Inventors: Ruimin ZENG, Anying ZHENG, Wan-Ting HUNG, Anpin WANG, Minhao JIANG, Hsin LU
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Publication number: 20250139855Abstract: A computer-implemented method of map data processing, comprising generating, for a grid-based representation of map data, raw grid features; building a grid map by reading from a memory that stores the raw grid features; and processing the grid map using one or more post-processing operations including a smoothing operation applied across zero or more grid lines of the grid map according to a rule.Type: ApplicationFiled: October 29, 2024Publication date: May 1, 2025Inventors: Ke XU, Thomas Datong WANG, Hsin LU, Bolun ZHANG, Adan Daniel ARTEAGA ORGANIZ, Shicong MA, Tu Thanh TRAN, Shenchao ZHANG, Jinjian ZHAI, Wan-Ting HUNG, Anping WANG
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Publication number: 20250125530Abstract: An antenna structure includes a feeding radiation element, a first radiation element, a second radiation element, a third radiation element, and a carrier element. The feeding radiation element has a feeding point. The first radiation element is coupled to the feeding radiation element. The first radiation element has a meandering structure. The second radiation element is coupled to the feeding radiation element. The second radiation element is adjacent to the first radiation element. The third radiation element is coupled to the ground voltage. The third radiation element is adjacent to the second radiation element. The feeding radiation element, the first radiation element, the second radiation element, and the third radiation element are disposed on the carrier element.Type: ApplicationFiled: December 28, 2023Publication date: April 17, 2025Inventors: Chun-I CHENG, Chung-Ting HUNG, Chin-Lung TSAI, Yi-Ling TSENG, Yu-Chen ZHAO, Kai-Hsiang CHANG
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Publication number: 20250125520Abstract: A wearable device includes a first radiation metal element, a second radiation metal element, a ground metal element, a third radiation metal element, and a carrier element. The first radiation metal element is coupled to a positive feeding point. The second radiation metal element is coupled to the positive feeding point. The ground metal element is coupled to a negative feeding point. The third radiation metal element is adjacent to the ground metal element. A coupling gap is formed between the third radiation metal element and the ground metal element. The first radiation metal element, the second radiation metal element, the ground metal element, and the third radiation metal element are disposed on the carrier element. An antenna structure is formed by the first radiation metal element, the second radiation metal element, the ground metal element, and the third radiation metal element.Type: ApplicationFiled: December 28, 2023Publication date: April 17, 2025Inventors: Yi-Ling TSENG, Chin-Lung TSAI, Chung-Ting HUNG, Kai-Hsiang CHANG, Yu-Chen ZHAO
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Patent number: 12272397Abstract: A forming operation method of a resistive random access memory is provided. The method includes the following steps. A positive pulse and a negative pulse are sequentially applied, by a bit line/source line driver, to multiple resistive random access memory cells in a direction form a farthest location to a nearest location based on the bit line/source line driver through a bit line and a source line to break down a dielectric film of each of the resistive random access memory cells and generate a conductive filament of each of the resistive random access memory cells.Type: GrantFiled: March 9, 2023Date of Patent: April 8, 2025Assignee: United Microelectronics Corp.Inventors: Yi Ting Hung, Ko-Chi Chen, Tzu-Yun Chang
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Publication number: 20250105496Abstract: A wearable device includes a feeding radiation element, a connection radiation element, a bifurcate radiation element, a shorting radiation element, an extension radiation element, and a carrier element. The feeding radiation element has a feeding point. The connection radiation element is coupled to the feeding radiation element. The bifurcate radiation element is coupled to the connection radiation element. The connection radiation element is also coupled through the shorting radiation element to a grounding point. The extension radiation element is coupled to the feeding radiation element. The feeding radiation element, the connection radiation element, the bifurcate radiation element, the shorting radiation element, and the extension radiation element are disposed on the carrier element. An antenna structure is formed by the feeding radiation element, the connection radiation element, the bifurcate radiation element, the shorting radiation element, and the extension radiation element.Type: ApplicationFiled: December 28, 2023Publication date: March 27, 2025Inventors: Ying-Cong DENG, Chung-Ting HUNG, Chin-Lung TSAI
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Publication number: 20250105077Abstract: A package-on-package (PoP) structure includes a first package structure and a second package structure stacked on the first package structure. The first package structure includes a die, conductive structures, an encapsulant, and a conductive pattern layer. The conductive structures surround the die. The encapsulant laterally encapsulates the die and the conductive structures. The conductive pattern layer is disposed over and in physical contact with a top surface of the encapsulant and top surfaces of the conductive structures. An entire bottom surface of the conductive pattern layer is located at a same level height, and an entirety of the top surface of the encapsulant and an entirety of the top surfaces of the conductive structures are located at the same level height.Type: ApplicationFiled: December 10, 2024Publication date: March 27, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shin-Puu Jeng, Hsien-Wen Liu, Shih-Ting Hung, Yi-Jou Lin, Tzu-Jui Fang, Po-Yao Chuang
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Patent number: 12259110Abstract: The present disclosure provides an optical packaging structure and a backlight module with the optical packaging structure. The optical packaging structure includes a light-emitting chip, a packaging layer, a fluorescent layer, a lens structure, and a reflecting layer. The light-emitting chip includes a light-emitting surface, a connecting surface, and a side surface. The packaging layer covers the light-emitting surface and the first side surface. The connecting surface is exposed from the packaging layer. The fluorescent layer is disposed on the packaging layer, and covers on the light-emitting surface and the first side surface. The lens structure is disposed on a top surface of the fluorescent layer. A surface of the lens structure is recessed towards the light-emitting chip to form a curved surface. The reflecting layer is disposed on the curved surface.Type: GrantFiled: August 19, 2024Date of Patent: March 25, 2025Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: Chuang-Yu Hsieh, Hsin-Ting Hung, Hao-Hsiang Hsieh, Shih-Hsiang Lo
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Patent number: 12261594Abstract: Embodiments relate to a cascode diode circuit. The cascode diode circuit comprises a normally on transistor, a low voltage diode and a high voltage diode. The normally on transistor has a gate, a drain, and a source. The low voltage diode has a cathode connected to the source of the normally on transistor and an anode connected to the gate of the normally on transistor. The high voltage diode has a cathode connected to a node between the normally on transistor and the low voltage diode, and an anode connected the drain of the normally on transistor.Type: GrantFiled: June 21, 2023Date of Patent: March 25, 2025Assignee: FAST SIC SEMICONDUCTOR INCORPORATEDInventors: Fu-Jen Hsu, Cheng-Tyng Yen, Hsiang-Ting Hung
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Publication number: 20250079428Abstract: Packaged devices and methods of manufacturing the devices are described herein. The packaged devices may be fabricated using heterogeneous devices and asymmetric dual-side molding on a multi-layered redistribution layer (RDL) structure. The packaged devices may be formed with a heterogeneous three-dimensional (3D) Fan-Out System-in-Package (SiP) structure having small profiles and can be formed using a single carrier substrate.Type: ApplicationFiled: November 15, 2024Publication date: March 6, 2025Inventors: Yi-Wen Wu, Po-Yao Chuang, Meng-Liang Lin, Techi Wong, Shih-Ting Hung, Po-Hao Tsai, Shin-Puu Jeng
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Patent number: 12237262Abstract: A semiconductor package is provided. The semiconductor package includes an encapsulating layer, a semiconductor die formed in the encapsulating layer, and an interposer structure covering the encapsulating layer. The interposer structure includes an insulating base having a first surface facing the encapsulating layer, and a second surface opposite the first surface. The interposer structure also includes insulating features formed on the first surface of the insulating base and extending into the encapsulating layer. The insulating features is arranged in a matrix and faces a top surface of the semiconductor die. The interposer structure further includes first conductive features formed on the first surface of the insulating base and extending into the encapsulating layer. The first conductive features surround the matrix of the insulating features.Type: GrantFiled: November 6, 2023Date of Patent: February 25, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yi-Wen Wu, Techi Wong, Po-Hao Tsai, Po-Yao Chuang, Shih-Ting Hung, Shin-Puu Jeng
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Patent number: D1058496Type: GrantFiled: November 29, 2022Date of Patent: January 21, 2025Assignee: BLACK & DECKER INC.Inventor: Yu Ting Hung
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Patent number: D1061423Type: GrantFiled: November 29, 2022Date of Patent: February 11, 2025Assignee: BLACK & DECKER INC.Inventor: Yu Ting Hung
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Patent number: D1065152Type: GrantFiled: November 29, 2022Date of Patent: March 4, 2025Assignee: BLACK & DECKER INC.Inventor: Yu Ting Hung