Abstract: Disclosed are devices, systems and methods for displaying a map for a user. A method of displaying a map for a user comprises: receiving, from a user device, a request to display the map for a geographical region around a vehicle, wherein the request identifies one or more layers of the map; retrieving, in response to the request, map data corresponding to the geographical region from a map database that stores a multi-layer representation of the geographical region; selecting, in response to the request, the one or more layers from the multi-layer representation; and displaying the map on a display of the user device based on the request.

Abstract: A computer-implemented method of map data processing, comprising generating, for a grid-based representation of map data, raw grid features; building a grid map by reading from a memory that stores the raw grid features; and processing the grid map using one or more post-processing operations including a smoothing operation applied across zero or more grid lines of the grid map according to a rule.

Abstract: A wearable device includes a first radiation metal element, a second radiation metal element, a ground metal element, a third radiation metal element, and a carrier element. The first radiation metal element is coupled to a positive feeding point. The second radiation metal element is coupled to the positive feeding point. The ground metal element is coupled to a negative feeding point. The third radiation metal element is adjacent to the ground metal element. A coupling gap is formed between the third radiation metal element and the ground metal element. The first radiation metal element, the second radiation metal element, the ground metal element, and the third radiation metal element are disposed on the carrier element. An antenna structure is formed by the first radiation metal element, the second radiation metal element, the ground metal element, and the third radiation metal element.

Abstract: An antenna structure includes a feeding radiation element, a first radiation element, a second radiation element, a third radiation element, and a carrier element. The feeding radiation element has a feeding point. The first radiation element is coupled to the feeding radiation element. The first radiation element has a meandering structure. The second radiation element is coupled to the feeding radiation element. The second radiation element is adjacent to the first radiation element. The third radiation element is coupled to the ground voltage. The third radiation element is adjacent to the second radiation element. The feeding radiation element, the first radiation element, the second radiation element, and the third radiation element are disposed on the carrier element.

Abstract: A forming operation method of a resistive random access memory is provided. The method includes the following steps. A positive pulse and a negative pulse are sequentially applied, by a bit line/source line driver, to multiple resistive random access memory cells in a direction form a farthest location to a nearest location based on the bit line/source line driver through a bit line and a source line to break down a dielectric film of each of the resistive random access memory cells and generate a conductive filament of each of the resistive random access memory cells.

Abstract: A package-on-package (PoP) structure includes a first package structure and a second package structure stacked on the first package structure. The first package structure includes a die, conductive structures, an encapsulant, and a conductive pattern layer. The conductive structures surround the die. The encapsulant laterally encapsulates the die and the conductive structures. The conductive pattern layer is disposed over and in physical contact with a top surface of the encapsulant and top surfaces of the conductive structures. An entire bottom surface of the conductive pattern layer is located at a same level height, and an entirety of the top surface of the encapsulant and an entirety of the top surfaces of the conductive structures are located at the same level height.

Abstract: A wearable device includes a feeding radiation element, a connection radiation element, a bifurcate radiation element, a shorting radiation element, an extension radiation element, and a carrier element. The feeding radiation element has a feeding point. The connection radiation element is coupled to the feeding radiation element. The bifurcate radiation element is coupled to the connection radiation element. The connection radiation element is also coupled through the shorting radiation element to a grounding point. The extension radiation element is coupled to the feeding radiation element. The feeding radiation element, the connection radiation element, the bifurcate radiation element, the shorting radiation element, and the extension radiation element are disposed on the carrier element. An antenna structure is formed by the feeding radiation element, the connection radiation element, the bifurcate radiation element, the shorting radiation element, and the extension radiation element.

Abstract: Embodiments relate to a cascode diode circuit. The cascode diode circuit comprises a normally on transistor, a low voltage diode and a high voltage diode. The normally on transistor has a gate, a drain, and a source. The low voltage diode has a cathode connected to the source of the normally on transistor and an anode connected to the gate of the normally on transistor. The high voltage diode has a cathode connected to a node between the normally on transistor and the low voltage diode, and an anode connected the drain of the normally on transistor.

Abstract: The present disclosure provides an optical packaging structure and a backlight module with the optical packaging structure. The optical packaging structure includes a light-emitting chip, a packaging layer, a fluorescent layer, a lens structure, and a reflecting layer. The light-emitting chip includes a light-emitting surface, a connecting surface, and a side surface. The packaging layer covers the light-emitting surface and the first side surface. The connecting surface is exposed from the packaging layer. The fluorescent layer is disposed on the packaging layer, and covers on the light-emitting surface and the first side surface. The lens structure is disposed on a top surface of the fluorescent layer. A surface of the lens structure is recessed towards the light-emitting chip to form a curved surface. The reflecting layer is disposed on the curved surface.

Abstract: Packaged devices and methods of manufacturing the devices are described herein. The packaged devices may be fabricated using heterogeneous devices and asymmetric dual-side molding on a multi-layered redistribution layer (RDL) structure. The packaged devices may be formed with a heterogeneous three-dimensional (3D) Fan-Out System-in-Package (SiP) structure having small profiles and can be formed using a single carrier substrate.

Abstract: A semiconductor package is provided. The semiconductor package includes an encapsulating layer, a semiconductor die formed in the encapsulating layer, and an interposer structure covering the encapsulating layer. The interposer structure includes an insulating base having a first surface facing the encapsulating layer, and a second surface opposite the first surface. The interposer structure also includes insulating features formed on the first surface of the insulating base and extending into the encapsulating layer. The insulating features is arranged in a matrix and faces a top surface of the semiconductor die. The interposer structure further includes first conductive features formed on the first surface of the insulating base and extending into the encapsulating layer. The first conductive features surround the matrix of the insulating features.

Abstract: A semiconductor device includes a first transistor and a second transistor. The first transistor includes: a first source and a first drain separated by a first distance, a first semiconductor structure disposed between the first source and first drain, a first gate electrode disposed over the first semiconductor structure, and a first dielectric structure disposed over the first gate electrode. The first dielectric structure has a lower portion and an upper portion disposed over the lower portion and wider than the lower portion. The second transistor includes: a second source and a second drain separated by a second distance greater than the first distance, a second semiconductor structure disposed between the second source and second drain, a second gate electrode disposed over the second semiconductor structure, and a second dielectric structure disposed over the second gate electrode. The second dielectric structure and the first dielectric structure have different material compositions.

Abstract: An integrated fan-out package includes a first redistribution structure, a die, a plurality of conductive structures, an encapsulant, and a second redistribution structure. The die is bonded to the first redistribution structure through flip-chip bonding. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The second redistribution structure is disposed on the encapsulant and is electrically connected to the first redistribution structure through the conductive structures. The second redistribution structure includes at least one conductive pattern layer that is in physical contact with the encapsulant. Top surfaces of the conductive structures contacting the second redistribution structure are coplanar with a top surface of the encapsulant.

Abstract: A container for containing food or liquid is provided. The container includes a body portion, a lid and an attachment. The lid is detachably disposed on the body portion. The attachment includes a magnetic attraction member and a connecting structure. The magnetic attraction member is independent from the lid and adapted to be magnetically connected to a mobile electronic device. The connecting structure is disposed between the magnetic attraction member and the container for selectively fixing the magnetic attraction member at a first position or a second position. At least a portion of the connecting structure is fixed to the container.

Abstract: An antenna structure includes a main ground plane, a protruding ground plane, a feeding radiation element, a connection radiation element, a shorting radiation element, a first radiation element, and a second radiation element. The protruding ground plane is coupled to the main ground plane. The feeding radiation element has a feeding point. The connection radiation element is coupled to the feeding radiation element. The connection radiation element is further coupled through the shorting radiation element to the protruding ground plane. The first radiation element is coupled to the feeding radiation element. The second radiation element is coupled to the connection radiation element. The protruding ground plane further includes an extension portion. The first radiation element is adjacent to the extension portion of the protruding ground plane.

Abstract: An optimizing method of semi-supervised learning and a computing apparatus are provided. In the method, a first predicted result of a labeled data set and a second predicted result of an unlabeled data set are respectively determined through a machine learning model. A pseudo-label threshold is determined according to a first confidence score of the first predicted result of a first sample of the labeled data set. The machine learning model is updated according to a compared result of the second predicted result of a second sample of the unlabeled data set and the pseudo-label threshold.