Abstract: A semiconductor device includes a first transistor and a second transistor. The first transistor includes: a first source and a first drain separated by a first distance, a first semiconductor structure disposed between the first source and first drain, a first gate electrode disposed over the first semiconductor structure, and a first dielectric structure disposed over the first gate electrode. The first dielectric structure has a lower portion and an upper portion disposed over the lower portion and wider than the lower portion. The second transistor includes: a second source and a second drain separated by a second distance greater than the first distance, a second semiconductor structure disposed between the second source and second drain, a second gate electrode disposed over the second semiconductor structure, and a second dielectric structure disposed over the second gate electrode. The second dielectric structure and the first dielectric structure have different material compositions.

Abstract: A hinge capable of widely expanding includes an arc-shaped guide member, two movable members and two torsion generating members, wherein first guide rails are formed on two sides of the arc-shaped guide member, and a circular displacement track is defined by an arc center of the arc-shaped guide member. Each of the two movable members, respectively positioned on two sides of the arc-shaped guide member, is provided with a working surface contacting one of the first guide rails and an arc-shaped through hole penetrating therethrough. The arc center of the arc-shaped through hole is the same as the arc-shaped guide members'. Each of the two torsion generating members is assembled to the arc-shaped guide member through the arc-shaped through hole to which one of the two movable members belongs. The two movable members are guided by the arc-shaped guide member to move on the circular displacement track.

Abstract: A hinge module and an electronic device are provided. The electronic device includes a first body and a second body that the hinge module is connected therebetween, and the first and the second bodies are rotated to be folded or unfolded through the hinge module. The hinge module includes a guiding member, a first rail, a rotating shaft, and a linking member. The rotating shaft disposed at the first body in a rotatable and penetrating manner. The linking member is linked between the rotating shaft and the guiding member. The first and the second bodies are rotated relatively to each other via the guiding member and the first rail, and the guiding member drives the linking member to rotate the rotating shaft.

Abstract: A hinge capable of widely expanding includes an arc-shaped guide member, two movable members and two torsion generating members, wherein first guide rails are formed on two sides of the arc-shaped guide member, and a circular displacement track is defined by an arc center of the arc-shaped guide member. Each of the two movable members, respectively positioned on two sides of the arc-shaped guide member, is provided with a working surface contacting one of the first guide rails and an arc-shaped through hole penetrating therethrough. The arc center of the arc-shaped through hole is the same as the arc-shaped guide members'. Each of the two torsion generating members is assembled to the arc-shaped guide member through the arc-shaped through hole to which one of the two movable members belongs. The two movable members are guided by the arc-shaped guide member to move on the circular displacement track.

Abstract: A hinge module and an electronic device are provided. The electronic device includes a first body and a second body that the hinge module is connected therebetween, and the first and the second bodies are rotated to be folded or unfolded through the hinge module. The hinge module includes a guiding member, a first rail, a rotating shaft, and a linking member. The rotating shaft disposed at the first body in a rotatable and penetrating manner. The linking member is linked between the rotating shaft and the guiding member. The first and the second bodies are rotated relatively to each other via the guiding member and the first rail, and the guiding member drives the linking member to rotate the rotating shaft.

Abstract: A hinge module and an electronic device are provided. The electronic device includes a first body and a second body that the hinge module is connected therebetween, and the first and the second bodies are rotated to be folded or unfolded through the hinge module. The hinge module includes a guiding member, a first rail, a rotating shaft, and a linking member. The rotating shaft disposed at the first body in a rotatable and penetrating manner. The linking member is linked between the rotating shaft and the guiding member. The first and the second bodies are rotated relatively to each other via the guiding member and the first rail, and the guiding member drives the linking member to rotate the rotating shaft.

Abstract: A hinge module and an electronic device are provided. The electronic device includes a first body and a second body that the hinge module is connected therebetween, and the first and the second bodies are rotated to be folded or unfolded through the hinge module. The hinge module includes a guiding member, a first rail, a rotating shaft, and a linking member. The rotating shaft disposed at the first body in a rotatable and penetrating manner. The linking member is linked between the rotating shaft and the guiding member. The first and the second bodies are rotated relatively to each other via the guiding member and the first rail, and the guiding member drives the linking member to rotate the rotating shaft.

Abstract: A modular potentiometer includes a magnetic block slide unit including a slide and a magnetic block disposed on the slide; a magnetic field sensing unit parallel to the magnetic block slide unit and including at least one Hall device and a circuit board electrically connected to the at least one Hall device, wherein the circuit board is modularized so that portions thereof are connected in series; a signal processing unit electrically connected to the magnetic field sensing unit to receive a sensing signal from the magnetic field sensing unit and thereby calculate a distance traveled by the magnetic block. Hence, due to the aforesaid segmental design, the non-contact potentiometer is easy to manufacture, mount, demount, and carry, and its manufacturing cost is reduced by modularizaton.

Abstract: A modular potentiometer includes a magnetic block slide unit including a slide and a magnetic block disposed on the slide; a magnetic field sensing unit parallel to the magnetic block slide unit and including at least one Hall device and a circuit board electrically connected to the at least one Hall device, wherein the circuit board is modularized so that portions thereof are connected in series; a signal processing unit electrically connected to the magnetic field sensing unit to receive a sensing signal from the magnetic field sensing unit and thereby calculate a distance traveled by the magnetic block. Hence, due to the aforesaid segmental design, the non-contact potentiometer is easy to manufacture, mount, demount, and carry, and its manufacturing cost is reduced by modularizaton.

Abstract: The invention provides an antifungal composite comprising an antifungal agent and ?-cyclodextrin surface-modified with a long carbon chain compound, wherein the antifungal agent is clad in ?-cyclodextrin surface-modified with a long carbon chain compound as a carrier, and thus a use of inhibiting harmful fungi can be provided by sustained release of the antifungal agent from the composite. The antifungal composite may be retained on the surface of the resin materials to increase the concentration of the antifungal composite on the surface of the resin materials by adjusting the difference of the lipophilic and hydrophilic characters between the antifungal composite and the resin materials, and thus an antifungal effect can be increased. The invention also relates to a method for manufacturing an antifungal composite.

Abstract: A microforce measuring device includes a base; a fixing component disposed at the base; a cantilever fixed at one end by the fixing component; a magnetic component disposed at the cantilever; a Hall effect sensing unit disposed at the base, aimed at the magnetic component, and spaced apart from the magnetic component by a distance to sense a change in a magnetic field of the magnetic component and generate a sensing signal; and a signal processing unit electrically connected to the Hall effect sensing unit to receive and analyze the sensing signal. Parts and components of the microforce measuring device are commercially available and cheap, so that the microforce measuring device incurs low manufacturing costs and measures a variation in a force of less than 5 gf precisely.

Abstract: The invention provides an antifungal composite comprising an antifungal agent and ?-cyclodextrin surface-modified with a long carbon chain compound, wherein the antifungal agent is clad in ?-cyclodextrin surface-modified with a long carbon chain compound as a carrier, and thus a use of inhibiting harmful fungi can be provided by sustained release of the antifungal agent from the composite. The antifungal composite may be retained on the surface of the resin materials to increase the concentration of the antifungal composite on the surface of the resin materials by adjusting the difference of the lipophilic and hydrophilic characters between the antifungal composite and the resin materials, and thus an antifungal effect can be increased. The invention also relates to a method for manufacturing an antifungal composite.

Abstract: A durable synchronous opening and closing mechanism includes a support rack, a first rotation portion, a second rotation portion and a transmission member. The support rack includes a first jointing hole and a second jointing hole and at least one coupling portion. The first rotation portion includes a first rotation shaft, a plurality of integrally formed first transmission bumps extended radially outward and a first limiting portion. The second rotation portion includes a second rotation shaft, a plurality of integrally formed second transmission bumps extended radially outward and a second limiting/portion. The transmission member has an axle and a plurality of bridging bumps radially formed to engage with the first transmission bumps and second transmission bumps. The first and second limiting portions restrict rotation of the bridging bumps.

Abstract: A display module holding frame and method of manufacturing same include the steps of: first, providing a support frame which includes an installation frame to hold a display module, two installation portions to hold two hinge structures, an installation space formed within the installation frame, a coupling space formed between the two installation portions and a wiring passage communicating with the installation space and the coupling space; next, threading a signal wire through the wiring passage; finally, forming a rubber protective layer on the surface of the support frame via an injection process. The rubber protective layer has a holding portion to fix the signal wire in the wiring passage. The display module holding frame thus formed provides a structure to securely hold the signal wire without moving freely.

Abstract: A display module support frame for electronic devices includes a first support section, a second support section and a bend section located between the first and second support sections. The bend section includes a coupling zone and a bend buffer zone. The display module support frame has an initial state in which the first and second support sections do not receive forces and the first and second coupling portions of the first and second support sections are positioned at two sides of the coupling zone, and a bend state in which either the first or second support section receives the forces to bend a bridge portion such that the first and second coupling portions are moved towards the coupling zone to couple with each other, and the compression buffer space is shrunk to form a holding space between the first and second support sections to hold a display module.

Abstract: A display module holding frame and method of manufacturing same include the steps of: first, providing a support frame which includes an installation frame to hold a display module, two installation portions to hold two hinge structures, an installation space formed within the installation frame, a coupling space formed between the two installation portions and a wiring passage communicating with the installation space and the coupling space; next, threading a signal wire through the wiring passage; finally, forming a rubber protective layer on the surface of the support frame via an injection process. The rubber protective layer has a holding portion to fix the signal wire in the wiring passage. The display module holding frame thus formed provides a structure to securely hold the signal wire without moving freely.

Abstract: A display module support frame for electronic devices includes a first support section, a second support section and a bend section located between the first and second support sections. The bend section includes a coupling zone and a bend buffer zone. The display module support frame has an initial state in which the first and second support sections do not receive forces and the first and second coupling portions of the first and second support sections are positioned at two sides of the coupling zone, and a bend state in which either the first or second support section receives the forces to bend a bridge portion such that the first and second coupling portions are moved towards the coupling zone to couple with each other, and the compression buffer space is shrunk to form a holding space between the first and second support sections to hold a display module.

Abstract: A hinge structure for assembly of a display module is located on a base. The hinge structure includes a first holder and a second holder. The first holder includes an assembly portion and at least one pin coupled with the assembly portion. The second holder includes a hinge portion hinged on the pin and a connecting portion fastened to a host of a notebook computer. The display module is located in a first holding groove and a second holding groove of the assembly portion, thereby the hinge structure and display module are fastened together to reduce thickness caused by front fastening to achieve the object of thin and light panel design. By direct coupling of the display module and the assembly portion the extra production process of fastening the hinge to the display module can be dispensed with to simplify production.

Abstract: A vibration testing device to test vibration strength and frequency generated by an electronic device, includes a base, a vibration contact member, a transmission member, and a resilient member attached to the transmission member. The base includes a receiving space to receive the electronic device and a receiving hole in communication with the receiving space. The transmission member extends through the receiving hole and is rigidly attached to the vibration contact member. During testing, the electronic device directly abuts an end portion of the transmission member so that the vibration strength and frequency generated by the electronic device are directly transmitted to the vibration contact member.

Abstract: A vibration testing device to test vibration strength and frequency generated by an electronic device, includes a base, a vibration contact member, a transmission member, and a resilient member attached to the transmission member. The base includes a receiving space to receive the electronic device and a receiving hole in communication with the receiving space. The transmission member extends through the receiving hole and is rigidly attached to the vibration contact member. During testing, the electronic device directly abuts an end portion of the transmission member so that the vibration strength and frequency generated by the electronic device are directly transmitted to the vibration contact member.