Patents by Inventor TING-I LIU

TING-I LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220339920
    Abstract: A polyimide composite film for use in a flexible metal clad substrate, comprising: a polyimide base material film; a fluorine polymer layer, formed on at least one surface of the polyimide base material film, comprising polyimide resins and fluorine polymers, wherein the polyimide resin accounts for 2 to 20 wt % of the total solid content of the fluorine polymer layer, the aromatic functional group ratio of the polyimide resin in the fluorine polymer layer is greater than 35%, and the absorption onset wavelength (?onset) of the ultraviolet-visible spectrum is greater than 360 nm; a thickness ratio of the polyimide base material film to one layer of the fluorine polymer layers is 8:1 to 1:4; and a total thickness of the polyimide composite film is between 18 and 175 microns. Thus, the polyimide composite film has a low dielectric constant, low loss factor, and has good drilling processability.
    Type: Application
    Filed: April 21, 2022
    Publication date: October 27, 2022
    Inventors: JIA-HAO WU, TING-I LIU, MENG-YING TSAI