Patents by Inventor Ting-Ju WU

Ting-Ju WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220170961
    Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.
    Type: Application
    Filed: November 3, 2021
    Publication date: June 2, 2022
    Applicant: MPI Corporation
    Inventors: Chin-Yi Lin, Che-Wei Lin, Ting-Ju Wu, Chien-Kai Hung
  • Publication number: 20200309819
    Abstract: A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.
    Type: Application
    Filed: March 18, 2020
    Publication date: October 1, 2020
    Applicant: MPI Corporation
    Inventors: Che-Wei Lin, Ting-Ju Wu, Keng-Min Su, Chin-Yi Lin
  • Patent number: 10119991
    Abstract: A vertical probe device includes a lower die having engaging holes and needle holes, a positioning film having limiting holes and needle holes, probe needles inserted through the needle holes, and supporters having at least an upper stopping surface and at least a lower stopping surface for moveably limiting the positioning film therebetween. Each supporter has a head, a neck passing through the limiting hole and having a length longer than the thickness of the positioning film, a body, and a tail inserted into the engaging hole, which are connected in order, and at least one of the upper and lower stopping surfaces. The supporters can prevent the positioning film from being lifted and flipped over and enables the positioning film to move so that the probe needles are reliable.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: November 6, 2018
    Assignee: MPI CORPORATION
    Inventors: Tsung-Yi Chen, Horng-Kuang Fan, Ching-Hung Yang, Chung-Tse Lee, Chia-Yuan Kuo, Tien-Chia Li, Ting-Ju Wu, Shang-Jung Hsieh
  • Patent number: 9465050
    Abstract: An assembling method for a vertical probe device includes steps of disposing a lower die on a jig by inserting supporting columns through jig holes of the lower die, fastening a positioning film on the supporting columns, installing probe needles and an upper die in a way that the positioning film is located between the upper and lower dies without contacting the upper die, unfastening the positioning film, and removing the jig so that the upper and lower dies, positioning film and probe needles constitute the device. A maintaining method for the device includes steps of inserting the supporting columns through the jig holes, fastening the positioning film to the jig, and removing the upper die. The probe needles and upper die are easily removed and installed and the probe needles are reliable. The vertical probe device is applicable for accommodating electronic components on the top thereof.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: October 11, 2016
    Assignee: MPI CORPORATION
    Inventors: Tsung-Yi Chen, Horng-Kuang Fan, Ching-Hung Yang, Chung-Tse Lee, Chia-Yuan Kuo, Tien-Chia Li, Ting-Ju Wu
  • Publication number: 20150276800
    Abstract: A vertical probe device includes a lower die having engaging holes and needle holes, a positioning film having limiting holes and needle holes, probe needles inserted through the needle holes, and supporters having at least an upper stopping surface and at least a lower stopping surface for moveably limiting the positioning film therebetween. Each supporter has a head, a neck passing through the limiting hole and having a length longer than the thickness of the positioning film, a body, and a tail inserted into the engaging hole, which are connected in order, and at least one of the upper and lower stopping surfaces. The supporters can prevent the positioning film from being lifted and flipped over and enables the positioning film to move so that the probe needles are reliable.
    Type: Application
    Filed: March 25, 2015
    Publication date: October 1, 2015
    Inventors: Tsung-Yi CHEN, Horng-Kuang FAN, Ching-Hung YANG, Chung-Tse LEE, Chia-Yuan KUO, Tien-Chia LI, Ting-Ju WU, Shang-Jung HSIEH
  • Publication number: 20150253358
    Abstract: An assembling method for a vertical probe device includes steps of disposing a lower die on a jig by inserting supporting columns through jig holes of the lower die, fastening a positioning film on the supporting columns, installing probe needles and an upper die in a way that the positioning film is located between the upper and lower dies without contacting the upper die, unfastening the positioning film, and removing the jig so that the upper and lower dies, positioning film and probe needles constitute the device. A maintaining method for the device includes steps of inserting the supporting columns through the jig holes, fastening the positioning film to the jig, and removing the upper die. The probe needles and upper die are easily removed and installed and the probe needles are reliable. The vertical probe device is applicable for accommodating electronic components on the top thereof.
    Type: Application
    Filed: March 10, 2015
    Publication date: September 10, 2015
    Inventors: Tsung-Yi CHEN, Horng-Kuang FAN, Ching-Hung YANG, Chung-Tse LEE, Chia-Yuan KUO, Tien-Chia LI, Ting-Ju WU