Patents by Inventor Tingjui CHEN

Tingjui CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUBSTRATE OF A WIRING BOARD AND A DRILLING METHOD THEREOF
    Publication number: 20110024178
    Abstract: A substrate of a wiring board is provided with at least one through-hole and includes an upper conductive layer, a lower conductive layer and an insulation layer. The lower conductive layer is opposite to the upper layer and the insulation layer is configured between the upper conductive layer and the lower conductive layer. The through-hole is formed by penetrating the upper conductive layer, the insulation layer and the lower conductive layer and is provided with a wall at the insulation layer, with a surface roughness of the wall being within 10 microns.
    Type: Application
    Filed: October 15, 2009
    Publication date: February 3, 2011
    Inventor: Tingjui CHEN