Patents by Inventor Ting-Jui Wang

Ting-Jui Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230383552
    Abstract: A construction system for construction work is applied to set up a construction object on a target position, and includes a carrier device, a coating structure, and a setup structure. A feed structure is arranged on the carrier device and is used to provide an intermediate material. The coating structure is used to coat the target position with the intermediate material. The setup structure is used to set up the construction object on the target position via the intermediate material.
    Type: Application
    Filed: May 23, 2023
    Publication date: November 30, 2023
    Inventor: TING-JUI WANG
  • Publication number: 20230383775
    Abstract: The disclosure provides a joint structure, a joint module and a method of assembling a joint structure on an object. The joint structure includes a body part and an actuating piece. The actuating piece combines movably with the body part, the actuating piece has a first joint part, the first joint part is located outside of the body part, the first joint part can carry out a vertical movement, lateral movement or rotational movement. Accordingly, the body part of the disclosure can go with the actuating piece or the first joint part, and combine to the first object and the second object, or disengage from the first object and the second object for achieving the effect of combining or separating at least two objects.
    Type: Application
    Filed: August 9, 2023
    Publication date: November 30, 2023
    Inventor: TING-JUI WANG
  • Publication number: 20230386906
    Abstract: In an embodiment, a method includes: dispensing a first dielectric layer around and on a first metallization pattern, the first dielectric layer including a photoinsensitive molding compound; planarizing the first dielectric layer such that surfaces of the first dielectric layer and the first metallization pattern are planar; forming a second metallization pattern on the first dielectric layer and the first metallization pattern; dispensing a second dielectric layer around the second metallization pattern and on the first dielectric layer, the second dielectric layer including a photosensitive molding compound; patterning the second dielectric layer with openings exposing portions of the second metallization pattern; and forming a third metallization pattern on the second dielectric layer and in the openings extending through the second dielectric layer, the third metallization pattern coupled to the portions of the second metallization pattern exposed by the openings.
    Type: Application
    Filed: August 9, 2023
    Publication date: November 30, 2023
    Inventors: Ting-Chen Tseng, Sih-Hao Liao, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo
  • Publication number: 20230375118
    Abstract: The present disclosure provides a communicating structure applied to a first communicating body and including a door assembly. The door assembly is assembled in the first communicating body, and includes a door movably connected to the first communicating body, and a connecting structure allowing movement of the door. The connecting structure includes an actuating portion, and the door is provided with a connecting portion. The actuating portion is for acting on the connecting portion or performing a lever operation on the connecting portion so as to move the door.
    Type: Application
    Filed: May 19, 2022
    Publication date: November 23, 2023
    Inventor: TING-JUI WANG
  • Patent number: 11813702
    Abstract: A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: November 14, 2023
    Assignee: DTECH PRECISION INDUSTRIES CO., LTD.
    Inventor: Ting-Jui Wang
  • Patent number: 11813701
    Abstract: A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: November 14, 2023
    Assignee: DTECH PRECISION INDUSTRIES CO., LTD.
    Inventor: Ting-Jui Wang
  • Patent number: 11794292
    Abstract: An assembling die block includes a first main die having at least one first mounting section; a second main die having at least one second mounting section; at least one first matching die respectively having a first mating section to be correspondingly associated with the at least one first mounting section; and at least one second matching die respectively having a second mating section to be correspondingly associated with the at least one second mounting section. Wherein, there is a plurality of first mounting sections arrayed in a matrix; or there is a plurality of second mounting sections arrayed in a matrix; or there is a plurality of first mounting sections arrayed in a matrix and a plurality of second mounting sections arrayed in a matrix. An assembling apparatus using the above assembling die block is also disclosed.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: October 24, 2023
    Inventor: Ting-Jui Wang
  • Publication number: 20230329312
    Abstract: A method for manufacturing a food shaping mold includes following steps. A calculation module is provided. The calculation module calculates a shape or form of a corresponding food shaping mold according to a target shape of a target food, or calculates the shape or form of a corresponding food shaping mold according to a target density, thickness, hardness, elasticity, tasting texture, glutenness, taste, color, temperature, structure, shape or flavor of the target food so as to produce a food shaping mold. The present disclosure further provides a food shaping mold, which is manufactured by the above method. The present disclosure further provides a method for manufacturing a food, wherein the shape, form or structure of the target food is calculated by the above method for manufacturing a food shaping mold.
    Type: Application
    Filed: April 12, 2023
    Publication date: October 19, 2023
    Inventor: TING-JUI WANG
  • Publication number: 20230323909
    Abstract: A fastener structure includes a body and a fastening portion. The fastening portion is provided on one end of the body, and includes a neck configured to be receivingly fastened into, assembled into or fitted with a coupling counterpart. Thus, the handle and the coupling counterpart may be assembled during use, and the handle may be removed from the coupling counterpart when not in use, achieving effects of easy operation and collision prevention. Further, the fastener structure may be assembled to a first object, and be fastening connected to a second object or removed from the second object so as to complete coupling or separation of at least two objects, achieving the effect of repeated quick coupling and separation.
    Type: Application
    Filed: June 16, 2023
    Publication date: October 12, 2023
    Inventor: TING-JUI WANG
  • Publication number: 20230288004
    Abstract: The present disclosure provides a fluid joint structure including a first body and a second body. The first body includes a first cavity, a first joint element and a first elastic element. The second body includes a second cavity, a second joint element and a second elastic element. The first body is joined with the second body such that the first joint element and the second joint element push against each other to generate a flow path of a fluid for the fluid to flow in the first cavity and the second cavity. Thus, a required fluid is enabled to flow stably in the first body and the second body.
    Type: Application
    Filed: March 13, 2023
    Publication date: September 14, 2023
    Inventor: TING-JUI WANG
  • Publication number: 20230282558
    Abstract: A package structure includes a first redistribution layer, a semiconductor die and a second redistribution layer. The first redistribution layer includes a first dielectric layer, first conductive elements, second conductive elements, a top dielectric layer and an auxiliary dielectric portion. The first conductive elements and the second conductive elements are disposed on the first dielectric layer with a first pattern density and a second pattern density respectively. The top dielectric layer is disposed on the first dielectric layer and covering a top surface of the second conductive elements. The auxiliary dielectric portion is disposed in between the first dielectric layer and the top dielectric layer, and covering a top surface of the first conductive elements. The semiconductor die is disposed on the first redistribution layer. The second redistribution layer is disposed on the semiconductor die, and electrically connected to the semiconductor die and the first redistribution layer.
    Type: Application
    Filed: March 1, 2022
    Publication date: September 7, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Han Wang, Sih-Hao Liao, Wei-Chih Chen, Hung-Chun Cho, Ting-Chen Tseng, Yu-Hsiang Hu, Hung-Jui Kuo
  • Publication number: 20230279889
    Abstract: A handle with a fastening portion includes a body and a second fastening portion. The second fastening portion is provided on one end of the body, and includes a neck configured to be receivingly fastened into, assembled into or fitted with a coupling counterpart. Thus, the handle may be assembled with a coupling counterpart when in use, and the handle may be removed from the coupling counterpart when not in use.
    Type: Application
    Filed: May 9, 2023
    Publication date: September 7, 2023
    Inventor: TING-JUI WANG
  • Publication number: 20230278127
    Abstract: A welding connection element includes a body and an assembly portion. The body includes a fitting fastening portion having an elastic withdrawal space. The elastic withdrawal space is capable of elastically withdrawing two or more fastening portions, so as to enable the fastening portions to be receivingly fastened in another object. The welding connection element has a welding surface configured to be welding connected to a welding surface of the object. The welding surface of the object is provided in advance with a solder layer configured to be heated and to welding connect the welding connection element and the welding surface of the object. The welding connection element is provided at a carrier in advance, taken out by a tool, compared with an assembly position of the object by a comparison device, and placed at the assembly position by the tool so as to be assembled with the object.
    Type: Application
    Filed: April 10, 2023
    Publication date: September 7, 2023
    Inventor: Ting-Jui Wang
  • Patent number: 11719271
    Abstract: A fastener structure includes a head portion, a body portion and an elastic element. The head portion has a shaft section, a press section and a hold-down section. The body portion has a corresponding press section, which is movably assembled to the press section. The elastic element has an end pressed against the press section and another end against the body section, allowing the head portion to move elastically. The body portion can be engaged with an object, and the hold-down section of the head portion can elastically hold down a workpiece against the object or be elastically removed from the workpiece, so as to complete the connection and disconnection of at least two objects to and from one another in a quick and repeatable manner.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: August 8, 2023
    Assignee: FIVETECH TECHNOLOGY INC.
    Inventor: Ting-Jui Wang
  • Publication number: 20230235771
    Abstract: A fastening device is introduced. The fastening device includes a seat body, a first fastening body and a second fastening body. The seat body may be disposed on a first object; the first fastening body is movably provided in the seat body, the first fastening body cooperates with the seat body for fastening and unfastening, so that the first fastening body couples with or separates from a second object; the second fastening body is movably provided in the first fastening body, the second fastening body cooperates with the first fastening body for fastening and unfastening, so that the second fastening body couples with or separates from a third object.
    Type: Application
    Filed: December 27, 2022
    Publication date: July 27, 2023
    Inventors: TING-JUI WANG, YING-TE YU
  • Patent number: 11698089
    Abstract: A fastener operating structure includes a holding base and a fastening-connecting unit. The holding base is disposed at a first object. The fastening-connecting unit is movably disposed at the holding base. The fastening-connecting unit is fastened to a second object. Consequently, the holding base is disposed at the first object, and the fastening-connecting unit is coupled to or removed from the second object, so as to couple together and separate the first and second objects repeatedly and quickly.
    Type: Grant
    Filed: January 19, 2020
    Date of Patent: July 11, 2023
    Assignee: FIVETECH TECHNOLOGY INC.
    Inventors: Ting-Jui Wang, Ying-Te Yu
  • Patent number: 11698097
    Abstract: A method of fitting a fastener to an object is introduced. The fastener has a weldable surface and an engaging portion or a hole portion. One end of the hole portion or one end of the engaging portion has a holding portion. During a welding heating process, solder flows into or enters the holding portion and then cools down and solidifies therein so as to be held therein. Therefore, the weldable surface and the holding portion together enable the fastener to be firmly coupled to an object. The engaging portion and the hole portion together enable an object to be coupled to or removed from another object, so as to couple together and separate at least two objects repeatedly and quickly.
    Type: Grant
    Filed: February 7, 2021
    Date of Patent: July 11, 2023
    Assignee: DTECH PRECISION INDUSTRIES CO., LTD.
    Inventor: Ting-Jui Wang
  • Publication number: 20230193935
    Abstract: A fastener structure includes a fastener having a stem portion and at least one movement portion. The stem portion has a fastening section. The movement portion is formed on the stem portion and has a retaining section. With these arrangements, the retaining section of the movement portion can be detachably assembled to a first object and the fastening section can be then detachably assembled or fastened to a second object. In this way, at least two objects can be connected to and disconnected from one another in a quick and repeatable manner.
    Type: Application
    Filed: February 13, 2023
    Publication date: June 22, 2023
    Inventor: TING-JUI WANG
  • Patent number: D995276
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: August 15, 2023
    Assignee: FIVETECH TECHNOLOGY INC.
    Inventor: Ting-Jui Wang
  • Patent number: D997691
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: September 5, 2023
    Assignee: FIVETECH TECHNOLOGY INC.
    Inventor: Ting-Jui Wang