Patents by Inventor TING-KAI LIU

TING-KAI LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153849
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a chip structure including a substrate and a wiring structure over a first surface of the substrate. The semiconductor device structure includes a first seed layer over the wiring structure, a first inner wall of the first enlarged portion, and a second inner wall of the neck portion. The semiconductor device structure includes a second seed layer over a second surface of the substrate, a third inner wall of the second enlarged portion, and the first seed layer over the second inner wall of the neck portion. The second seed layer is in direct contact with the first seed layer.
    Type: Application
    Filed: January 2, 2024
    Publication date: May 9, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Li YANG, Wen-Hsiung LU, Lung-Kai MAO, Fu-Wei LIU, Mirng-Ji LII
  • Patent number: 11978678
    Abstract: A display device includes a first substrate, a light-emitting element, a light conversion layer, and a color filter layer. The light-emitting element is disposed on the first substrate. The light conversion layer is disposed on the light-emitting element. In addition, the color filter layer is overlapped the light-emitting element and the light conversion layer.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: May 7, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Tung-Kai Liu, Tsau-Hua Hsieh, Wei-Cheng Chu, Chun-Hsien Lin, Chandra Lius, Ting-Kai Hung, Kuan-Feng Lee, Ming-Chang Lin, Tzu-Min Yan, Hui-Chieh Wang
  • Patent number: 11929319
    Abstract: Integrated fan-out packages and methods of forming the same are disclosed. An integrated fan-out package includes two dies, an encapsulant, a first metal line and a plurality of dummy vias. The encapsulant is disposed between the two dies. The first metal line is disposed over the two dies and the encapsulant, and electrically connected to the two dies. The plurality of dummy vias is disposed over the encapsulant and aside the first metal line.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh
  • Patent number: 9904361
    Abstract: A facial expression operation method includes capturing images using a camera device of an electronic device. A face area of the user exists in the images is determined by comparing the images with face image samples stored in a storage device. Feature values of the face area are calculated when the face area exists in the images. A facial expression is determined by comparing the feature values of the face area and the feature values of the face image samples. The electronic device is operated automatically to perform a corresponding function according to the facial expression.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: February 27, 2018
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventor: Ting-Kai Liu
  • Publication number: 20170024005
    Abstract: A facial expression operation method includes capturing images using a camera device of an electronic device. A face area of the user exists in the images is determined by comparing the images with face image samples stored in a storage device. Feature values of the face area are calculated when the face area exists in the images. A facial expression is determined by comparing the feature values of the face area and the feature values of the face image samples. The electronic device is operated automatically to perform a corresponding function according to the facial expression.
    Type: Application
    Filed: June 30, 2016
    Publication date: January 26, 2017
    Inventor: TING-KAI LIU
  • Patent number: D1024722
    Type: Grant
    Filed: November 3, 2022
    Date of Patent: April 30, 2024
    Assignee: TAIWAN FU HSING INDUSTRIAL CO., LTD.
    Inventors: Ting-Yu Liu, Jun-Kai Ko
  • Patent number: D1024723
    Type: Grant
    Filed: November 6, 2022
    Date of Patent: April 30, 2024
    Assignee: TAIWAN FU HSING INDUSTRIAL CO., LTD.
    Inventors: Ting-Yu Liu, Jun-Kai Ko