Abstract: A semiconductor structure is provided. The semiconductor structure includes a first low dielectric constant (low-k) layer, a first metal layer, a metal cap layer, a dielectric on dielectric (DoD) layer, an etch stop layer (ESL), a second low-k layer, a metal via and a second metal layer. The dielectric constant of the first low-k layer is less than 4. The first metal layer is embodied in the first low-k layer. The first low-k layer exposes the first metal layer. The metal cap layer is disposed on the first metal layer. The DoD layer is disposed on the first low-k layer. The etch stop layer is disposed on the metal cap layer and the DoD layer. The second low-k layer is disposed above the etch stop layer. The metal via is embodied in the second low-k layer and connected to the first metal layer.

Abstract: A socket of a testing tool is configured to provide testing signals. A device-under-test (DUT) board is configured to provide electrical routing. An integrated circuit (IC) die is disposed between the socket and the DUT board. The testing signals are electrically routed to the IC die through the DUT board. The IC die includes a substrate in which plurality of transistors is formed. A first structure contains a plurality of first metallization components. A second structure contains a plurality of second metallization components. The first structure is disposed over a first side of the substrate. The second structure is disposed over a second side of the substrate opposite the first side. A trench extends through the DUT board and extends partially into the IC die from the second side. A signal detection tool is configured to detect electrical or optical signals generated by the IC die.

Abstract: A semiconductor structure includes a conductive layer, an IMD layer and a plurality of protrusions. The IMD layer is formed on the conductive layer and has a first etch rate. Each protrusion includes an etching slowing layer, a lower electrode and a MTJ layer, wherein the etching slowing layer is formed on the IMD layer and has a second etch rate, the lower electrode passes through the IMD layer and the etching slowing layer, and the MTJ layer is formed on the lower electrode. The second etch rate is less than the first etch rate.

Abstract: A graph neural network to predict net parasitics and device parameters by transforming circuit schematics into heterogeneous graphs and performing predictions on the graphs. The system may achieve an improved prediction rate and reduce simulation errors.

Abstract: A method and an electronic device of updating and testing multiple embedded controllers (ECs) are provided. First, in the electronic device, a basic input output system (BIOS) executes an updating software to read an embedded-controller read-only file (ECROF) in an external read-only memory (ROM). A first embedded controller (first EC) writes the ECROF from the external ROM into the first EC. The first EC uses the ECROF to update a first firmware of the first EC. Then, the first EC updates a second firmware of a second embedded controller (second EC) with the ECROF. Next, the first EC or another hardware device compares the first summary information stored in the first EC and the second summary information of the updated second EC. When the first summary information and the second summary information are different, the first EC or the hardware device generates a warning message.

Abstract: An electrostatic discharge protection circuit is disclosed. It comprises a stacked drain-ballasted NMOS devices structure and a gate bias circuit. The gate bias circuit includes an inverter, a first gate bias output terminal, and a second gate bias output terminal. The first gate bias output terminal is coupled to a gate of a first one of the drain-ballasted NMOS devices. The second gate bias output terminal runs from an output of the inverter to a gate of a second one of the drain-ballasted NMOS devices.

Abstract: In various embodiments, a comparison circuit compares voltages within an integrated circuit. The comparison circuit includes a comparison capacitor, an inverter, and multiple switches. A first terminal of the comparison capacitor is coupled to both a first terminal of a first switch and a first terminal of a second switch. A second terminal of the comparison capacitor is coupled to both a first terminal of a third switch and an input of the inverter. An output of the inverter is coupled to both a second terminal of the third switch and a first terminal of a fourth switch. A second terminal of the fourth switch is coupled to a first terminal of a fifth switch and a first output of the comparison circuit. At least a portion of the switches are turned on during a comparison model and are turned off during a reset mode.

Abstract: In various embodiments, a comparison circuit compares voltages within an integrated circuit. The comparison circuit includes a comparison capacitor, an inverter, and multiple switches. A first terminal of the comparison capacitor is coupled to both a first terminal of a first switch and a first terminal of a second switch. A second terminal of the comparison capacitor is coupled to both a first terminal of a third switch and an input of the inverter. An output of the inverter is coupled to both a second terminal of the third switch and a first terminal of a fourth switch. A second terminal of the fourth switch is coupled to a first terminal of a fifth switch and a first output of the comparison circuit. At least a portion of the switches are turned on during a comparison model and are turned off during a reset mode.

Abstract: A graph neural network to predict net parasitics and device parameters by transforming circuit schematics into heterogeneous graphs and performing predictions on the graphs. The system may achieve an improved prediction rate and reduce simulation errors.

Abstract: A graph neural network to predict net parasitics and device parameters by transforming circuit schematics into heterogeneous graphs and performing predictions on the graphs. The system may achieve an improved prediction rate and reduce simulation errors.

Abstract: In various embodiments, a current measurement circuit measures an input current within an integrated circuit. The current measurement circuit includes an integration capacitor, an operational amplifier, a comparison capacitor, an inverter, and multiple switches. The current measurement circuit is coupled to a clocking circuit that, during operation, generates a two-phase clock having a frequency that is proportional to the input current. At least a portion of the switches are turned on during a first phase of the two-phase clock and are turned off during a second phase of the two-phase clock.

Abstract: A display device includes a driving substrate, a front panel laminate, a circuit board, a front protective layer, and a glue. The front panel laminate is disposed on the driving substrate and includes a display medium layer. The circuit board is disposed on an end of the driving substrate. The front protective layer is disposed on the front panel laminate. The front protective layer has a notch. An end of the circuit board is in the notch. The end of the circuit board and the front protective layer have a first gap therebetween. The glue is filled in the first gap. A normal projection of the glue on the driving substrate overlaps a normal projection of the circuit board on the driving substrate and overlaps a normal projection of the front protective layer on the driving substrate.

Abstract: An electrostatic discharge protection circuit is disclosed. It comprises a stacked drain-ballasted NMOS devices structure and a gate bias circuit. The gate bias circuit includes an inverter, a first gate bias output terminal, and a second gate bias output terminal. The first gate bias output terminal is coupled to a gate of a first one of the drain-ballasted NMOS devices. The second gate bias output terminal runs from an output of the inverter to a gate of a second one of the drain-ballasted NMOS devices.

Abstract: A graph neural network to predict net parasitics and device parameters by transforming circuit schematics into heterogeneous graphs and performing predictions on the graphs. The system may achieve an improved prediction rate and reduce simulation errors.

Abstract: A display device includes a driving substrate, a front panel laminate, a circuit board, a front protective layer, and a glue. The front panel laminate is disposed on the driving substrate and includes a display medium layer. The circuit board is disposed on an end of the driving substrate. The front protective layer is disposed on the front panel laminate. The front protective layer has a notch. An end of the circuit board is in the notch. The end of the circuit board and the front protective layer have a first gap therebetween. The glue is filled in the first gap. A normal projection of the glue on the driving substrate overlaps a normal projection of the circuit board on the driving substrate and overlaps a normal projection of the front protective layer on the driving substrate.

Abstract: A system and method for calibrating an integrated circuit. The method includes configuring a first impedance for a first output of the integrated circuit according to a first configuration code and measuring a first voltage at the first output which corresponds to the first configuration code. The method further includes configuring a second impedance for a second output of the integrated circuit according to a second configuration code and measuring a second voltage at the second output which corresponds to the second configuration code. A determination of which of the first voltage and the second voltage is nearest to a predetermined voltage value. Based on the voltage determination, the integrated circuit is configured according a code of said first and second codes that corresponds to the voltage nearest to the predetermined voltage.

Abstract: A baby walker is introduced herein. The baby walker includes a base and a pair of shoulder straps. The base is made by flexible materials such as plastics, or the similar materials. In one exemplary embodiment, the base of the baby walker may be packaged in a deflated form, and may be filled with air to form a shape as desired for an operation mode. The baby walker further includes a pair of shoulder straps which are firmly and fixedly attached in a peripheral upper side of the base. When the baby is placed in a central cavity of the base, the pair of the shoulder straps can be placed alongside the two shoulders of the baby. When the baby wears the baby walker and stands up, the whole baby walker is lifted up for a height above the ground level.

Abstract: A baby walker is introduced herein. The baby walker includes a base and a pair of shoulder straps. The base is made by flexible materials such as plastics, or the similar materials. In one exemplary embodiment, the base of the baby walker may be packaged in a deflated form, and may be filled with air to form a shape as desired for an operation mode. The baby walker further includes a pair of shoulder straps which are firmly and fixedly attached in a peripheral upper side of the base. When the baby is placed in a central cavity of the base, the pair of the shoulder straps can be placed alongside the two shoulders of the baby. When the baby wears the baby walker and stands up, the whole baby walker is lifted up for a height above the ground level.

Abstract: A light emitting diode (LED) lamp tube includes a lamp device including a circuit board, and a plurality of LEDs mounted on the circuit board. The circuit board is disposed in a tubular enclosure such that an inner peripheral surface of the enclosure is divided into a non-illuminated portion and a light-receiving portion. The tubular enclosure has a plurality of tapered protrusions extending from the light-receiving portion toward the LEDs. Each of the tapered protrusions converges from the light-receiving portion toward the LEDs. Each of the tapered protrusions further has a maximum width at an outer end thereof, which increases gradually from a middle portion of the light-receiving portion toward junctions of the light-receiving portion and the non-illuminated portion.

Abstract: A light emitting diode (LED) lamp tube includes a circuit board and a tubular enclosure. The circuit board is disposed in the enclosure such that the enclosure is divided into a non-illuminated portion and a light-receiving portion. The light-receiving portion has two light-condensing side sections corresponding respectively to two sides of the circuit board, and a light-diffusing middle section connected between the light-condensing side sections. An outer surface of the light-receiving portion has a smoothly varying curvature. The light-condensing side sections cooperate with the light-diffusing middle section to diffuse uniformly LED light transmitted from an outer surface of the enclosure.