Abstract: A LED lamp includes housing, a circuit layer, at least one LED die, a light-transmitting adhesive, a lamp shade, a light-transmitting liquid and the conductive connector. One end of the housing has a protrusion. The circuit layer is placed on the protrusion. The LED die is placed on the protrusion and electrically connected to the circuit layer. The light-transmitting adhesive covers the circuit layer and the light emitting die. The lamp shade including a plurality of ventilating holes is connected to the housing, and an accommodating space is cooperatively defined by the lamp shade and the housing. The light-transmitting liquid is filled within the accommodating space, and the LED die is sunk therein.

Abstract: A LED lamp includes housing, a circuit layer, at least one LED die, a light-transmitting adhesive, a lamp shade, a light-transmitting liquid and the conductive connector. One end of the housing has a protrusion. The circuit layer is placed on the protrusion. The LED die is placed on the protrusion and electrically connected to the circuit layer. The light-transmitting adhesive covers the circuit layer and the light emitting die. The lamp shade including a plurality of ventilating holes is connected to the housing, and an accommodating space is cooperatively defined by the lamp shade and the housing. The light-transmitting liquid is filled within the accommodating space, and the LED die is sunk therein.

Abstract: The light emitting diode module is disclosed. The light emitting diode module includes a ceramic substrate, a circuit layer, at least an illuminant element and a driving circuit element. The ceramic substrate has a recess formed on and upper surface thereof. The circuit layer is placed on the upper surface of the ceramic substrate. The driving circuit element is disposed on the upper surface of the ceramic substrate and electrically connected to the circuit layer. By providing the recess at molding of the ceramic substrate, the light emitting diode module can prevent manufacturing difficulty from hardness ceramic substrate. In addition, by accommodating the adhesive in the recess, the adhesive can be easily orientated and of convex shape.

Abstract: An illuminant device includes a housing and an illuminant unit. One side of the housing has a platform-part, the illuminant unit is disposed on the platform-part. The illuminant unit includes a carrying body and a plurality of light emitting diode (LED) dies. The carrying body is made of ceramic material and has three lateral surfaces adjoined with each other. Each lateral surface disposed with a plurality of circuit layouts, the LED dies are placed on the lateral surfaces and electrically connected to the circuit layouts.

Abstract: An illuminant device includes a housing, an circuit layer, at least a light emitting diode (LED) die, a driving circuit element, a plurality of electrical elements and an conductive connector. The housing has a supporting part and a platform-part connected to a side of the supporting part. The circuit layer is placed on the platform-part. The LED die is placed on the platform-part and electrically connected to the circuit layer. The driving circuit element is placed on the platform-part and electrically connected to the circuit layer. The electrically elements are placed on the platform-part and electrically connected to the circuit layer. The conductive connector is connected to another side of the supporting part.