Abstract: Embodiments of a circuit and a stylus for interacting with a capacitive sensor are disclosed. The stylus includes a stylus body, a circuit disposed within the stylus body, a tip, and a power source. The circuit includes an input terminal, an amplifier, and an output terminal. The tip includes a sensing electrode and an emitting electrode, and the tip is disposed on a proximal end of the stylus body. The power source is electrically coupled to the circuit. The input terminal of the circuit is electrically coupled to the sensing electrode of the tip, and the output terminal of the circuit is electrically coupled to the emitting electrode of the tip. The circuit receives a signal through the sensing electrode, amplifies and inverts the signal, and outputs the signal through the emitting electrode. The amplifier of the circuit amplifies only a portion of the signal that exceeds a threshold voltage.

Abstract: Embodiments of a circuit and a stylus for interacting with a capacitive sensor are disclosed. The stylus includes a stylus body, a circuit disposed within the stylus body, a tip, and a power source. The circuit includes an input terminal, an amplifier, and an output terminal. The tip includes a sensing electrode and an emitting electrode, and the tip is disposed on a proximal end of the stylus body. The power source is electrically coupled to the circuit. The input terminal of the circuit is electrically coupled to the sensing electrode of the tip, and the output terminal of the circuit is electrically coupled to the emitting electrode of the tip. The circuit receives a signal through the sensing electrode, amplifies and inverts the signal, and outputs the signal through the emitting electrode. The amplifier of the circuit amplifies only a portion of the signal that exceeds a threshold voltage.

Abstract: Embodiments of a magnetic switch assembly and a stylus having the magnetic switch assembly are disclosed. The magnetic switch assembly includes a charging apparatus and a switching apparatus. The charging apparatus includes a housing, a first spring, a first magnet, a second magnet, an insulator layer, and a ball member. The first magnet, the second magnet, and the insulator layer form a recess region with the ball member situated in the center of the recess region. The switching apparatus includes a button, a second spring, and a metal plate. The button includes a contact part and an insulating part. The metal plate has a contact pad disposed on the metal plate. When the button is situated in the recess region of the charging apparatus, power is supplied from the charging apparatus to a power source electrically connected to the metal plate.

Abstract: The invention discloses a computer and an expandable power supply system. The expandable power supply system includes N interface units, a determination unit, and a voltage converting unit. N is an integer equal to or more than two. The interface units are electrically connected with at least one power supplies and switching the levels of (N?1) control signals according to conductance of the power supplies. When the interface units are electrically connected with 1st to Mth power supplies, the determination unit outputs a start signal when the determination unit receives power reply signals provided by the 1st to Mth power supplies. M is an integer, and 1?M?N. The voltage converting unit is enabled according to the start signal to distribute operation voltages provided by the 1st to Mth power supplies by utilizing the control signals to generate a supply voltage.

Abstract: A method and a system of temperature-control for an electronic component are provided, in which a plurality of temperature sensors is disposed in each area of the electronic component. The temperature-control method includes obtaining a plurality of sensed temperature values; looking up a temperature-control table recording the relationship between a temperature-control threshold and a temperature-control operation set for each area; selecting the temperature-control operation corresponding to sensed temperature values greater than the temperature-control thresholds depending on the temperature-control table; and starting the temperature-control operation to make the sensed temperature values being lower than or equal to the temperature-control thresholds.

Abstract: A method and a system of temperature-control for an electronic component are provided, in which a plurality of temperature sensors is disposed in each area of the electronic component. The temperature-control method includes obtaining a plurality of sensed temperature values; looking up a temperature-control table recording the relationship between a temperature-control threshold and a temperature-control operation set for each area; selecting the temperature-control operation corresponding to sensed temperature values greater than the temperature-control thresholds depending on the temperature-control table; and starting the temperature-control operation to make the sensed temperature values being lower than or equal to the temperature-control thresholds.

Abstract: The invention discloses a computer and an expandable power supply system. The expandable power supply system includes N interface units, a determination unit, and a voltage converting unit. N is an integer equal to or more than two. The interface units are electrically connected with at least one power supplies and switching the levels of (N?1) control signals according to conductance of the power supplies. When the interface units are electrically connected with 1st to Mth power supplies, the determination unit outputs a start signal when the determination unit receives power reply signals provided by the 1st to Mth power supplies. M is an integer, and 1?M?N. The voltage converting unit is enabled according to the start signal to distribute operation voltages provided by the 1st to Mth power supplies by utilizing the control signals to generate a supply voltage.

Abstract: A method and a system of temperature-control for an electronic component are provided, in which a plurality of temperature sensors is disposed in each area of the electronic component. The temperature-control method includes obtaining a plurality of sensed temperature values; looking up a temperature-control table recording the relationship between a temperature-control threshold and a temperature-control operation set for each area; selecting the temperature-control operation corresponding to sensed temperature values greater than the temperature-control thresholds depending on the temperature-control table; and starting the temperature-control operation to make the sensed temperature values being lower than or equal to the temperature-control thresholds.

Abstract: A computer system with integrated cable is disclosed. The computer system includes a circuit board module, at least one electronic device and an integrated cable. The circuit board module includes a first connector, and the integrated cable is electrically connecting with the circuit board module and the electronic device. The integrated cable includes a second connector electrically connected to the first connector and a body electrically connected to the electronic device. The body integrates at least one power cable and at least one signal cable electrically connected to the second connector, and has a tearing structure formed between the power cable and the signal cable to allow an easy separation of the power cable and the signal cable. With such, meanwhile, entwining of unused power cables or signal cables is effectively avoided.

Abstract: The invention discloses a detachable mounting assembly for a motherboard. The assembly includes an electronic component; a carrier for carrying the electronic component and having a first portion; a base including a recess which is located at a predetermined position corresponding to the carrier on the motherboard and a second portion corresponding to the first portion, magnetically coupled to the first position. The carrier further includes an inserting structure cooperating with the recess to locate the carrier in the predetermined position.

Abstract: An identification module for facilitating installation of a functional component includes a circuit board having a first connecting portion, a first functional component, a first primary label disposed on the first connecting portion and a first subsidiary label disposed on the first functional component, wherein the first subsidiary label and the first primary label respectively have two first identifying symbols corresponding to each other. With intuitional identify the first identifying symbols, a correlation between the first functional component and the first connecting portion is easily cognized, therefore facilitates installation and increase efficiency and yield thereof.

Abstract: A motherboard is provided. The motherboard includes a chipset, a memory module slot, a bridge device, a plurality of first conducting wires and a plurality of second conducting wires. The first conducting wires are coupled between the chipset and the bridge device. The second conducting wires are coupled between the memory module slot and the bridge device. When the bridge device provides a Nth route set, the motherboard supports a Nth standard memory module inserted the memory module slot. The Nth route set is electrical connected between a Nth wire group of the first conducting wires and a Nth wire group of the second conducting wires, wherein N is a natural number. Further, transmission quality of signals is increased.

Abstract: A computer system and a method for processing a data signal of a memory interface thereof are provided. The computer system includes a memory module, a memory controller, and a digital signal processor. The memory controller accesses data temporarily stored in the memory module through a data bus. The digital signal processor processes varied data on the bus according to a select code to recover the data.

Abstract: An electronic device and a method for resuming from a suspend-to-memory (S3) state thereof are provided. The electronic device comprises a detecting circuit, a storage unit and a booting module. The detecting circuit outputs a state change value when detecting a state variation of any non-hot plug device. The storage unit is used for storing the state change value output from the detecting circuit. When the electronic device is resumed from the S3 state to the working state, a normal booting procedure is performed on the electronic device if the state change value is detected by the booting module.

Abstract: In a printed circuit board and its heat dissipating metal surface layout, a layer of copper foil is coated onto the printed circuit board for dissipating heat, and the surface of the copper foil is covered by an insulating coating, and a bare copper is formed on the surface of copper foil which is not covered by the insulating coating, and the bare copper is arranged in a cross shape, or in the shape of “#”, so that when the printed circuit board goes through a soldering furnace, the cohesion of solder is even instead of aggregating at a same position or the center, so as to obtain a larger protruding area and facilitate dissipating heat and transmitting current.

Abstract: A method and a system of temperature-control for an electronic component are provided, in which a plurality of temperature sensors is disposed in each area of the electronic component. The temperature-control method includes obtaining a plurality of sensed temperature values; looking up a temperature-control table recording the relationship between a temperature-control threshold and a temperature-control operation set for each area; selecting the temperature-control operation corresponding to sensed temperature values greater than the temperature-control thresholds depending on the temperature-control table; and starting the temperature-control operation to make the sensed temperature values being lower than or equal to the temperature-control thresholds.

Abstract: A heat dissipating type printed circuit board and its structure for conducting heat with a heat pipe include a substrate, a signal circuit disposed on a surface of the substrate and electrically coupled to an electronic component, a heat dissipating layer disposed on another surface of the substrate, and at least one heat pipe, each having a heated end and a condensing end extended from the heated end. The substrate includes a through hole passing through the heat dissipating layer, and the heat dissipating layer includes an adhering layer disposed at a surface proximate to the surroundings of the heat pipe, and a distal end of the heated end of the heat pipe is covered by the adhering layer, and the adhering layer is extended from the surface of the heat dissipating layer to a corresponding position of the electronic component.

Abstract: In a printed circuit board and its heat dissipating metal surface layout, a layer of copper foil is coated onto the printed circuit board for dissipating heat, and the surface of the copper foil is covered by an insulating coating, and a bare copper is formed on the surface of copper foil which is not covered by the insulating coating, and the bare copper is arranged in a cross shape, or in the shape of “#”, so that when the printed circuit board goes through a soldering furnace, the cohesion of solder is even instead of aggregating at a same position or the center, so as to obtain a larger protruding area and facilitate dissipating heat and transmitting current.

Abstract: A heat dissipating type printed circuit board and its structure for conducting heat with a heat pipe include a substrate, a signal circuit disposed on a surface of the substrate and electrically coupled to an electronic component, a heat dissipating layer disposed on another surface of the substrate, and at least one heat pipe, each having a heated end and a condensing end extended from the heated end. The substrate includes a through hole passing through the heat dissipating layer, and the heat dissipating layer includes an adhering layer disposed at a surface proximate to the surroundings of the heat pipe, and a distal end of the heated end of the heat pipe is covered by the adhering layer, and the adhering layer is extended from the surface of the heat dissipating layer to a corresponding position of the electronic component.

Abstract: The invention provides an apparatus that is adapted to adjust the amplitude of an audio signal based on the background. The apparatus, according to a preferred embodiment of the invention, includes an audio receiving module. The audio receiving module is adapted to receive a first audio and a second audio and to generate a process signal including a first signal and a second signal. A processing module extracts the second signal from the process signal. An adjusting module receives the extracted second signal and generates a gain in accordance with the extracted second signal and a criterion. The adjusting module adjusts the amplitude of the audio signal in accordance with the gain.