Abstract: A thermoelectric cooling module includes a base, a thermoelectric cooler and a plurality of heat exchangers. The base includes a case and a cover. The case has an inlet and an outlet. The cover covers the case. The cover and the case together define an accommodation space. The inlet and the outlet are connected with the accommodation space for a heat transfer fluid to flow in and out of the accommodation space. The thermoelectric cooler is in thermal contact with the cover for exchanging heat with the cover. The heat exchangers are disposed on and in thermal contact with the cover. The heat exchangers extend from the cover into the accommodation space for exchanging heat with the heat transfer fluid in the accommodation space.

Abstract: A stopping structure of a fan is described. An opening is opened on a surface of a frame, and a bearing support is disposed within the frame. A blade wheel is accommodated within the frame and pivoted to the bearing support. Then, a stopper is disposed at the frame corresponding to the opening, such that a distance between the stopper and the blade wheel is smaller than a distance between blades of the blade wheel and the frame. When the blade wheel moves outwards relative to the bearing support, the blade wheel is stopped by the stopper to prevent the blades from interfering with the frame, and a reactive force is generated at an axial center position of the blade wheel, so that an axle of the blade wheel is maintained on the same central axis as the bearing support when the axle restores an original position thereof.

Abstract: A fastening member for fastening a peripheral device in an electronic device casing and performing heat exchange with the peripheral device is presented. The fastening member includes a supporting plate and a pair of side plates. This pair of side plates is respectively disposed on two sides of the supporting plate to support the peripheral device. The side plates can be fastened to the electronic device casing. The supporting plate has a plurality of heat-conductive connecting pieces in contact with the casing for transferring heat generated by the peripheral device to the electronic device casing, so as to perform heat exchange.