Abstract: An wafer probe device is provided, including a holder, and a probe card. The holder has a holding surface for holding a wafer. The probe card has a probing side for probing the wafer. Wherein the holder and the probe card are disposed on the ground, and the holding surface of the holder and the probing side of the probe card are perpendicular to the ground. Wherein when the holder holds the wafer to move upwardly toward the probe card into a probing position, the probed surface of the wafer is in contact with the probe card, and the probe surface is perpendicular to the ground.

Abstract: A wafer probe device is provided, including a holder and a probe card. The holder is configured to hold a wafer. The probe card is disposed on the ground, between the holder and the ground, and under the holder. The probing side of the probe card faces away from the ground. The holder moves the wafer toward the probe card, and a probed surface of the wafer contacts the probe card.

Abstract: A wafer probe device is provided, including a holder and a probe card. The holder is configured to hold a wafer. The probe card is disposed on the ground, between the holder and the ground, and under the holder. The probing side of the probe card faces away from the ground. The holder moves the wafer toward the probe card, and a probed surface of the wafer contacts the probe card.

Abstract: An electronic element inspection equipment is provided, which is adapted to inspect an electronic element. The electronic element inspection equipment includes a first transmission track, a first rotational unit, a first image capturing device, a second image capturing device, a third image capturing device, a second rotational unit, a fourth image capturing device, and a second transmission track. The first rotational unit rotates around a first axis. When the first rotational unit moves the electronic element, the first image capturing device, the second image capturing device, and the third image capturing device capture images of the electronic element. The second rotational unit rotates around a second axis, wherein the second axis is perpendicular to the first axis. When the second rotational unit moves the electronic element, the fourth image capturing device captures one image of the electronic element.

Abstract: An electronic element inspection equipment is provided, which is adapted to inspect an electronic element. The electronic element inspection equipment includes a first transmission track, a first rotational unit, a first image capturing device, a second image capturing device, a third image capturing device, a second rotational unit, a fourth image capturing device, and a second transmission track. The first rotational unit rotates around a first axis. When the first rotational unit moves the electronic element, the first image capturing device, the second image capturing device, and the third image capturing device capture images of the electronic element. The second rotational unit rotates around a second axis, wherein the second axis is perpendicular to the first axis. When the second rotational unit moves the electronic element, the fourth image capturing device captures one image of the electronic element.

Abstract: A multi-turret handler adapted to test a plurality of electronic elements is provided. The multi-turret handler includes a main turret and a test turret. The main turret includes a plurality of pickers. The test turret includes a plurality of movable brackets and a test unit. The test unit includes a plurality of lead pushers and a plurality of sockets. The movable brackets are moveable between a first position and a second position. When the movable bracket is in the first position, the pickers respectively pick and place the electronic elements on the movable brackets. When the movable brackets are in the second position, the movable brackets correspond to the sockets, and the lead pushers are respectively inserted into the movable brackets and the sockets to test the electronic elements.

Abstract: A turret handler with picker pairs is provided for testing a plurality of electronic elements. The turret handler includes a plurality of outer pickers, a plurality of inner pickers, a plurality of sockets and a package carrier. The outer pickers travel along a first circular path. The inner pickers travel along a second circular path. The first circular path and the second circular path are concentric circles, and the outer pickers and the inner pickers are arranged side by side along the radial direction of the first circular path. The sockets include a plurality of first sockets and a plurality of second sockets. The first sockets circumferentially correspond to the first circular path, the second sockets circumferentially correspond to the second circular path, and each first socket corresponds to one second socket along the radial direction. The package carrier includes a plurality of recesses.

Abstract: A tape and reel packing material for packaging a plurality of chips is provided. The tape and reel packing material includes a carrier tape and a cover tape. The carrier tape includes a plurality of recesses. The recesses are configured to receive the chips respectively. The cover tape is attached to the carrier tape. The cover tape includes a plurality of restriction structures, and the restriction structures respectively are inserted into the recesses to restrict the freedom of the movement of the chips.

Abstract: A turret handler is provided. The turret handler is adapted to test an electronic element. The electronic element includes an element body and a plurality of leads. The turret handler includes a nozzle, a stage, a test block, and an abutting unit. The nozzle is adapted to hold the element body to move the electronic element. The test block is disposed on the stage. The nozzle moves the electronic element to the test block. The test block includes a coupling unit and an initiative portion. The coupling unit includes a coupling portion, a pressing portion, and an elastic structure. The elastic structure is connected to the pressing portion. The initiative portion is connected to the elastic structure.

Abstract: A turret handler with picker pairs is provided for testing a plurality of electronic elements. The turret handler includes a plurality of outer pickers, a plurality of inner pickers, a plurality of sockets and a package carrier. The outer pickers travel along a first circular path. The inner pickers travel along a second circular path. The first circular path and the second circular path are concentric circles, and the outer pickers and the inner pickers are arranged side by side along the radial direction of the first circular path. The sockets include a plurality of first sockets and a plurality of second sockets. The first sockets circumferentially correspond to the first circular path, the second sockets circumferentially correspond to the second circular path, and each first socket corresponds to one second socket along the radial direction. The package carrier includes a plurality of recesses.

Abstract: A turret handler is provided. The turret handler is adapted to test an electronic element. The electronic element includes an element body and a plurality of leads. The turret handler includes a nozzle, a stage, a test block, and an abutting unit. The nozzle is adapted to hold the element body to move the electronic element. The test block is disposed on the stage. The nozzle moves the electronic element to the test block. The test block includes a coupling unit and an initiative portion. The coupling unit includes a coupling portion, a pressing portion, and an elastic structure. The elastic structure is connected to the pressing portion. The initiative portion is connected to the elastic structure.

Abstract: A tape and reel packing material for packaging a plurality of chips is provided. The tape and reel packing material includes a carrier tape and a cover tape. The carrier tape includes a plurality of recesses. The recesses are configured to receive the chips respectively. The cover tape is attached to the carrier tape. The cover tape includes a plurality of restriction structures, and the restriction structures respectively are inserted into the recesses to restrict the freedom of the movement of the chips.

Abstract: A multi-turret handler adapted to test a plurality of electronic elements is provided. The multi-turret handler includes a main turret and a test turret. The main turret includes a plurality of pickers. The test turret includes a plurality of movable brackets and a test unit. The test unit includes a plurality of lead pushers and a plurality of sockets. The movable brackets are moveable between a first position and a second position. When the movable bracket is in the first position, the pickers respectively pick and place the electronic elements on the movable brackets. When the movable brackets are in the second position, the movable brackets correspond to the sockets, and the lead pushers are respectively inserted into the movable brackets and the sockets to test the electronic elements.