Abstract: A mechanical feedthrough apparatus is provided to be mounted on a pivot base of a vacuum apparatus. A first axial tube of the mechanical feedthrough apparatus is pivotally connected to the pivot base and a second axial tube of the mechanical feedthrough apparatus is inserted into the first axial tube. An external cone surface of the second axial tube contacts with an internal cone surface of a first axial tube such that the second axial tube is close-fitted to the first axial tube.

Abstract: A vacuum deposition composite target includes a plurality of target blocks each including a target body, an insulating layer and a high-resistance-conductive layer. The target body has a top surface, a bottom surface and a peripheral surface connected between the top and bottom surfaces. The insulating layer is formed on the peripheral surface. The high-resistance-conductive layer is formed on the bottom surface of the target body and has a resistance higher than that of the target body. The target blocks are juxtaposed to each other. Each of the target blocks has a modulated resistance. A modulated resistance difference between any two adjacent ones of the target blocks is not greater than 5%.

Abstract: A coating apparatus for continuously forming a film through chemical vapor deposition (CVD) includes a conveyor unit for conveying a substrate along a moving path, a deposition unit and a film formation-prohibiting unit. The deposition unit is disposed on the moving path and includes a deposition chamber adapted for receiving the substrate and forming a film on the substrate through CVD. The film formation-prohibiting unit includes a heating mechanism that is disposed in the deposition chamber for maintaining the conveyor unit at a film formation-prohibiting temperature.

Abstract: An apparatus for continuously forming a film through chemical vapor deposition includes a conveyor unit, a depositing unit and a cooling mechanism. The conveyor unit is for conveying a substrate along a moving path. The depositing unit includes at least one deposition chamber disposed to deposit a film-forming material on the substrate. The cooling mechanism includes inlet and outlet cooling units that are disposed oppositely relatively to the deposition chamber, that are communicated fluidly with the deposition chamber and that are controllable to provide a cooling temperature preventing the film-forming material from escaping and scattering away from the inlet and outlet cooling units.