Patents by Inventor Ting Ruei CHEN

Ting Ruei CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device package
    Patent number: 11670836
    Abstract: A semiconductor device package includes a substrate, an air cavity, a radiator, and a director. The substrate has a top surface. The air cavity is disposed within the substrate. The air cavity has a first sidewall and a second sidewall opposite to the first sidewall. The radiator is disposed adjacent to the first sidewall of the air cavity. The director is disposed adjacent to the second sidewall of the air cavity.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: June 6, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ting Ruei Chen, Hung-Hsiang Cheng, Guo-Cheng Liao, Yun-Hsiang Tien
  • Semiconductor device package and method of manufacturing the same
    Patent number: 11404799
    Abstract: A semiconductor device package includes a substrate, a support structure and a first antenna. The substrate has a first surface and a second surface opposite to the first surface. The support structure is disposed on the first surface of the substrate. The first antenna is disposed on the support structure. The first antenna has a first surface facing the substrate, a second surface opposite to the first surface and a lateral surface extending between the first surface and a second surface of the first antenna. The lateral surface of the first antenna is exposed to the external of the semiconductor device package. The first antenna includes a dielectric layer and an antenna pattern disposed within the dielectric layer and penetrating the dielectric layer.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: August 2, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ting Ruei Chen, Guo-Cheng Liao
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220140467
    Abstract: A semiconductor device package includes a substrate, an air cavity, a radiator, and a director. The substrate has a top surface. The air cavity is disposed within the substrate. The air cavity has a first sidewall and a second sidewall opposite to the first sidewall. The radiator is disposed adjacent to the first sidewall of the air cavity. The director is disposed adjacent to the second sidewall of the air cavity.
    Type: Application
    Filed: October 29, 2020
    Publication date: May 5, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ting Ruei CHEN, Hung-Hsiang CHENG, Guo-Cheng LIAO, Yun-Hsiang TIEN
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210125945
    Abstract: A semiconductor device package includes a substrate, a support structure and a first antenna. The substrate has a first surface and a second surface opposite to the first surface. The support structure is disposed on the first surface of the substrate. The first antenna is disposed on the support structure. The first antenna has a first surface facing the substrate, a second surface opposite to the first surface and a lateral surface extending between the first surface and a second surface of the first antenna. The lateral surface of the first antenna is exposed to the external of the semiconductor device package. The first antenna includes a dielectric layer and an antenna pattern disposed within the dielectric layer and penetrating the dielectric layer.
    Type: Application
    Filed: October 24, 2019
    Publication date: April 29, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ting Ruei CHEN, Guo-Cheng LIAO